Abstract: An acceleration sensor including: a fixed substrate; a fixed electrode mounted on the fixed substrate; a movable body, supported by the fixed substrate and displaced in response to an applied acceleration; a movable electrode which is arranged in the movable body in such a manner that the movable electrode faces the fixed electrode to form, together with the fixed electrode, a capacitor; wherein the movable electrode is mounted between grooves formed in the movable body. The acceleration sensor features improved mechanical strength, compact design and improved sensing accuracy while permitting the manufacturing process to be simplified.

Abstract: When the uniformly charged surface of a photoreceptor is exposed to an intensive light (a), a potential at an exposed position (Vx) is lower than a bias voltage (Vbias-A) of a first developing unit (b), toner A attaches to the exposed position (Vx) after its developing process, and its potential is lower than a bias voltage (Vbias-B) of a second developing unit (c). When the uniformly charged surface of a photoreceptor is exposed to a weak light, a potential at the exposed position (Vx) is lower than the bias voltage (Vbias-B) but higher than the bias voltage (Vbias-A) (e). Only toner B attaches to the photoreceptor (f). If the toner A and toner B belong to the same color family and are black toner and gray toner, an image of two density levels is formed, and the gradation and the graininess of the resultant picture are improved.

Abstract: A pressure sensor device prevents foreign matters from reaching a pressure sensor at the back of a pressure introducing passage, is superior in resistance against both fouling and freezing, and includes a temperature sensor.

Abstract: Disclosed is a pressure sensor device including a temperature sensor, which can reduce the number of places required for mounting necessary sensors and can simplify a structure. The pressure sensor device comprises a housing including a connector portion provided at an outer periphery thereof, molded integrally with a plurality of external terminals and disposed to cover the pressure sensor from above, and a resin-made base cooperating the housing to define a container space for containing a pressure sensor and a circuit board.

Abstract: There is provided a connecting rod including a connecting rod body and a cap having excellent alignment properties, and a method of producing such a connecting rod. A connecting rod body and a cap are produced through the steps of molding green compacts respectively corresponding to the connecting rod body and the cap; sintering and unifying both the green compacts; forging the resultant sintered product in a mold; and fracturing the resultant forged product. The green compact corresponding to the cap and/or the green compact corresponding to the connecting rod body includes opposite circumferential end faces formed with one or more projection. A clearance c is formed between both circumferential end faces of the sintered product due to the projection. With this clearance c, both the circumferential end faces are formed with recesses and projections which are fitted to each other during the forging process and which are relatively large and thus have large biting amounts.

Abstract: A plurality of blanks divided at a division end face 5 or a blank-bonded product comprising a plurality of blanks sintered and bonded together are or is compressed in the same mold, so that they are plastically deformed until the division end faces 5 are cohered. Thereafter, a load is applied to the plastically worked product in a direction of breaking of the division end faces 5 to break the division end faces 5 and divide the plastically worked product into a plurality of members. In this manner, a split type mechanical part having irregularities meshed with each other on mating faces and easily positionable relative to each other can be produced with a good dimentional accuracy.

Abstract: An optical scanning apparatus comprises a first image formation optical system for shaping a diameter of a light beam emitted from a light source, deflection means for deflecting an incident light beam at a constant angular velocity, a second image formation optical system for forming the image with the light beam deflected by the deflection means on a surface to be scanned, and a third image formation optical system for forming the image with the light beam deflected by the deflection means on the surface to be scanned, wherein a locational relationship between the first image formation optical system and the deflection means is set so that the light beam can be incident on the deflection means in such a manner that the center of a flux of light of the light beam from the light source forms a predetermined angle relative to an axis perpendicular to a rotating axis of the deflection means, and the third image formation optical system is disposed in such a manner that the distortion of the scanning line formed

Abstract: An optical scanner in which light beams from a light source are made incident in such a manner as to extend over a plurality of reflecting surfaces of a rotating polygon mirror, comprising: a light source; a first optical system which causes at least divergent light beams of a main scanning direction from the light source to be made into substantially parallel light beams; a rotating polygon mirror which deflects the substantially parallel light beams emitted from the first optical system along a predetermined main scanning direction by the plurality of reflecting surfaces; and a second optical system which causes the light beams deflected by the rotating polygon mirror to be scanned on a surface to be scanned substantially at a uniform velocity and to be converged on the surface to be scanned, wherein the substantially parallel light beams emitted from the first optical system is provided to form a wave surface for correcting an aberration in the second optical system.

Abstract: A printed wiring board comprises a substrate, a printed wiring circuit formed on the substrate, and insulating layer formed on the printed wiring circuit, an electromagnetic wave shielding layer provided on the insulating layer, and an overcoat layer provided on the electromagnetic shielding layer. The electromagnetic shielding layer has a first color, and the overcoat layer has a second color different from the first color. The color of the overcoat layer may be any color which is easily visually distinguishable from the color of the electromagnetic wave shielding layer so that visual inspection of the working condition of the overcoat layer is facilitated.

Abstract: A method of manufacturing a printed wiring board comprises providing a substrate and forming a printed circuit having a ground circuit on the substrate. An insulating layer is formed on the substrate over the printed circuit and consists of two successively formed insulating layers having concentric circular apertures defining an opening above the ground circuit. The opening has a circular, stepped shape effective to facilitate the subsequent formation of an electromagnetic wave shielding layer. An electromagnetic wave shielding layer is formed by silk screening a conductive paste on the substrate over the insulating layer and through the opening and over the ground circuit.

Abstract: A printed wiring board includes a substrate having an electrically conductive pattern disposed on at least one side of the substrate. An electrically conductive through-hole is formed in the substrate. At least one of a solder resist film and an electromagnetic shielding layer undercoat film are disposed over the conductive pattern but do not cover the electrically conductive through-hole. An ink layer is formed over at least one end of the electrically conductive through-hole. A method of manufacturing the printed wiring board embodied by the invention comprises providing a substrate having an electrically conductive through-hole. A conductive pattern is formed on at least one side of the substrate. At least one of a solder resist film and an electromagnetic shielding layer undercoat film are formed over the conductive pattern but not over the electrically conductive through-hole. An ink layer is formed over at least one end of the electrically conductive through-hole.

Abstract: A printed wiring board shielded from electromagnetic wave radiation has a conductive circuit pattern formed on an insulating substrate, a first insulating layer disposed over the circuit pattern, a jumper wire formed over the first insulating layer and between connecting terminals of the conductive pattern, a second insulating layer covering the jumper wire and the first insulating layer, and an electromagnetic wave shielding layer disposed over the conductive pattern. The jumper wire is formed by printing using a conductive paste containing a conductive material such as silver, carbon or copper. The shield layer is formed by printing using a conductive metal resin paste such as copper. An overcoat layer is applied over the shield layer to protect the shield layer.

Abstract: In a method of manufacturing printed circuit boards by coating a flux preventive film for preventing a flux from rising on a component surface of an insulation board, the method of manufacturing printed circuit boards according to the present invention is characterized in that said method comprises the steps of printing white blank marks, white blank symbols and white blank letters corresponding to symbol marks, other symbols and letters on the component side surface of said insulation board before coating said flux preventive film, and then coating said flux preventive film of a transparent or translucent material on the printed surface.

Abstract: A method of manufacturing a printed circuit board comprises providing an insulating substrate having opposed major sides, forming a through-hole between the two sides of the insulating substrate, forming a conductive land on both sides of the insulating substrate surrounding the ends of the through-hole, forming margining frames at the outer peripheries of the conductive lands, and packing conductive paste into the through-hole after the formation of the margining frames. The margining frames extend vertically beyond the height of the conductive lands and prevent the conductive paste from spreading outwardly beyond the outer peripheries of the conductive lands.

Abstract: A printed wiring board has an electromagnetic wave shielding layer. The printed wiring board includes a printed circuit formed on a substrate. Stratified layers of insulation are formed over the printed circuit. The insulation layers are disposed so as to form a bowl-shaped connection region. A terminal may be formed simultaneously with the forming of the electromagnetic wave shielding layer to provide a connection between the electromagnetic shielding layer and the printed circuit. The bowl-shaped connecting region provides for smoothly filling the terminal with a conductor paste without the occurrence of foaming or blurring during, for example, a silk screening printing process.

Abstract: A method of manufacturing a printed circuit board comprises the steps of providing an insulating substrate for the printed circuit board, forming circuit patterns made of a conductive material on at least one side of the insulating substrate, forming an insulating layer on the circuit patterns, and adhering a cross-mesh shield layer onto at least a portion of the insulating layer in such a manner that a margin is placed both on the outer periphery of the insulating layer itself and around electric contacts such as lands and through-holes.

Abstract: A method for connecting a ground circuit and an electromagnetic wave shielding layer for a printed wiring circuit in a printed circuit board is disclosed. The method comprising the steps of forming said insulating layer by a plurality of insulating layers and gradually increasing from the printed wiring circuit side to the electromagnetic wave shielding layer side, a diameter of an aperture of the ground circuit of each insulating layer in the process for forming the insulating layer.

Abstract: A method of manufacturing a printed circuit board is disclosed. The method comprises steps of providing a substrate for the printed circuit board, forming circuit patterns on one or both sides of the substrate, and shielding the whole or a required part of the circuit patterns by using a shield layer in such a manner that the shield layer and a grounding circuit of the circuit patterns are connected through a resistor. This method of manufacturing a printed circuit board is improved so that adhesion between the shield layer and the junction land of the grounding circuit is enhanced by the joining of the shield layer to the junction land of the grounding circuit through the resistor, and that the noise preventive action of the shield layer is improved by the attenuating of electromagnetic-wave energy received by the shield layer which is to be discharged as electrical current to the grounding circuit.

Abstract: A printed wiring board having electromagnetic wave shielding layer for use in the integrated semiconductor circuit is disclosed. The printed wiring board comprises an insulating sheet, printed wiring circuits and grounded wiring circuit which are provided on one surface of the insulating sheet, an insulating layer provided on the surface of the insulating sheet, the printed wiring circuit and the grounded wiring circuit, an electromagnetic wave shielding layer provided on the insulating layer and having a portion contacted to the ground wiring circuit directly, and an over-coating layer provided on the electromagnetic wave shielding layer and having exposed portions placed over the contacted portion of the shielding layer.

Abstract: The invention relates to a printed wiring board (7) which includes at least one carbon resistor (3) formed across terminals (2a, 2b) of printed wiring circuit (2). A heat dissipating film layer (4) is formed at least on the carbon resistor (3). Thus, heat produced in the resistor (3) is effectively dissipated.