Abstract: In one aspect of a tire (10) of the present invention, a plurality of carcass plies (50a) include a first carcass ply (51). A first end portion (51a), which is a distal end portion of a portion of the first carcass ply folded around the bead core, is located outside in a tire radial direction from a position (WL) where a dimension in a tire width direction is maximum, and is located at a boundary portion (14) between a tread portion (11) and a sidewall portion (12), and in the portion located outside in the tire radial direction from the position where the dimension in the tire width direction is maximum, a dimension (T5) in a tire thickness direction between the portion of the first carcass ply folded around the bead core and an outer surface (12a) of the tire in the tire width direction is maximum between the first end portion and the outer surface of the tire in the tire width direction.

Abstract: In one aspect of a tire (10) of the present invention, a plurality of carcass plies (50a) include a first carcass ply (51). A first end portion (51a), which is a distal end portion of a portion of the first carcass ply folded around the bead core, is located outside in a tire radial direction from a position (WL) where a dimension in a tire width direction is maximum, and is located at a boundary portion (14) between a tread portion (11) and a sidewall portion (12), and in the portion located outside in the tire radial direction from the position where the dimension in the tire width direction is maximum, a dimension (T5) in a tire thickness direction between the portion of the first carcass ply folded around the bead core and an outer surface (12a) of the tire in the tire width direction is maximum between the first end portion and the outer surface of the tire in the tire width direction.

Abstract: A model creation portion having a obstacle in a space includes two creation portions, one is to separate them and another is to combine them which handles, as porous media, an obstacle in which narrow spaces are regularly arranged. A thermosets flow analysis portion includes two analysis portions to separate and combine them, each of them has a viscosity equation for thermosets. The space/obstacle separation analysis portion analyzes by combining the viscosity equation with conservation equations of mass, momentum and energy, and the space/obstacle combination analysis portion analyzes by combining the viscosity equation with a conservation equation directed to a shape simplified as porous media. Resin flow behavior is analyzed while data in an interface between two models is delivered to each other, to accurately predict filling behavior at the time of injecting resin of thermosets molded articles having the complex obstacles.

Abstract: To quick and accurately predict filling behavior at the time of injecting resin of thermosets molded articles having a complex obstacle. A model creation portion includes a space/obstacle separation model creation portion and a space/obstacle combination model creation portion. The space/obstacle combination model creation portion handles, as porous media, an obstacle in which narrow spaces are regularly arranged. A thermosets flow analysis portion includes a space/obstacle separation analysis portion and a space/obstacle combination analysis portion, and each of them has a viscosity equation for thermosets. The space/obstacle separation analysis portion analyzes by combining the viscosity equation with conservation equations of mass, momentum and energy, and the space/obstacle combination analysis portion analyzes by combining the viscosity equation with a conservation equation directed to a shape simplified as porous media.

Abstract: To regulate the passage structure of a foaming die and the injected amount of foaming material, the flow behavior of the foaming material is analyzed by obtaining a flow velocity and a pressure by inputting the density as a function, including the elapsed time from the passage through an injection port to the foaming die and the thickness, and substituting a calculated density in equations of continuity and motion. In the analysis, the viscosity of the foaming material is used as a function including a time term. The boundary and molding conditions are corrected when the calculation does not converge. The density and pressure distributions of the foaming material are determined when the calculation converges. When the density and pressure distributions depart from design tolerances, the foaming passage structure and foaming material injected amount are regulated by an analysis program that corrects the model form, physical property or molding condition.

Abstract: A design support apparatus including: a flow analyzer for analyzing a flow of thermosetting resin injected into a resin filling cavity to mold a resin mold product made of the thermosetting resin, using a finite difference method or a finite element method; a residual strain calculator for calculating residual strain (or stress) of the thermosetting resin after heat shrinkage of the thermosetting resin injected into the resin filling cavity to mold the resin mold product; and a strength analyzer for analyzing strength of the resin mold product, using a finite element method. According to this arrangement, strength of the resin mold product made of the thermosetting resin can be predicted accurately.

Abstract: A small semiconductor package having two electrodes, which can be produced at reduced cost and which features high reliability. The package has a structure in which an anode and a cathode are arranged on one surface of a semiconductor chip, each electrode having a bump electrode for connecting the electrode to an external substrate. An insulating resin is provided on the surface of the semiconductor chip and on the surfaces of the bump electrodes, except at least for the connection portions to the external substrate.

Abstract: To regulate the passage structure of a foaming die and the injected amount of foaming material, the flow behavior of the foaming material is analyzed by obtaining a flow velocity and a pressure by inputting the density as a function, including the elapsed time from the passage through an injection port to the foaming die and the thickness, and substituting a calculated density in equations of continuity and motion. In the analysis, the viscosity of the foaming material is used as a function including a time term. The boundary and molding conditions are corrected when the calculation does not converge. The density and pressure distributions of the foaming material are determined when the calculation converges. When the density and pressure distributions depart from design tolerances, the foaming passage structure and foaming material injected amount are regulated by an analysis program that corrects the model form, physical property or molding condition.

Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the “Lead-On-Chip” or “Chip-On-Lead” structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

Abstract: A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.

Abstract: A semiconductor device which can improve the connection reliability of solder bumps and productivity in manufacturing. Insulating tape having wiring patterns on its surface is bonded to a lead frame. Semiconductor elements are loaded and circuit formed surfaces and sides of the semiconductor elements are sealed with sealing resin. After arrangements of individual semiconductor devices are formed, the lead frame is separated into individual metal plates to form individual semiconductor devices. Such simultaneous production of a plurality of semiconductor devices enhances productivity, and improves flatness of the insulating tape, whereby the connection reliability of solder bumps is improved.

Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the “Lead-On-Chip” or “Chip-On-Lead” structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

Abstract: A design support apparatus comprises: a flow analysis means for analyzing a flow of thermosetting resin injected into a resin filling cavity to mold a resin mold product made of the thermosetting resin, using a finite difference method or a finite element method; a residual strain calculation means for calculating residual strain (or stress) of the thermosetting resin after heat shrinkage of the thermosetting resin injected into the resin filling cavity to mold said resin mold product; and a strength analysis means for analyzing strength of said resin mold product, using a finite element method. According to this arrangement, strength of the resin mold product made of the thermosetting resin can be predicted accurately.

Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the “Lead-On-Chip” or “Chip-On-Lead” structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

Abstract: A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.

Abstract: A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold, which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.

Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the “Lead-On-Chip” or “Chip-On-Lead” structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

Abstract: A small semiconductor package having two electrodes suppressing the cost and featuring high reliability. The package has a structure in which an anode and a cathode are arranged on one surface of a semiconductor chip, each electrode having a bump electrode for connecting the electrode to an external substrate. An insulating resin is provided on the surface of the semiconductor chip and on the surfaces of the bump electrodes except at least the connection portions to the external substrate.

Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the “Lead-On-Chip” or “Chip-On-Lead” structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

Abstract: A semiconductor device which can improve the connection reliability of solder bumps and productivity in manufacturing. Insulating tape having wiring patterns on its surface is bond ed to a lead frame. Semiconductor elements are loaded and circuit formed surfaces and sides of the semiconductor elements are sealed with sealing resin. After arrangements of individual semiconductor devices are formed, the lead frame is separated into individual metal plates to form individual semiconductor devices. Such simultaneous production of a plurality of semiconductor devices enhances productivity, and improves flatness of the insulating tape, whereby the connection reliability of solder bumps is improved.