Patents by Inventor Junichi Saeki
Junichi Saeki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20020135051Abstract: A semiconductor device which can improve the connection reliability of solder bumps and productivity in manufacturing. Insulating tape having wiring patterns on its surface is bonded to a lead frame. Semiconductor elements are loaded and circuit formed surfaces and sides of the semiconductor elements are sealed with sealing resin. After arrangements of individual semiconductor devices are formed, the lead frame is separated into individual metal plates to form individual semiconductor devices. Such simultaneous production of a plurality of semiconductor devices enhances productivity, and improves flatness of the insulating tape, whereby the connection reliability of solder bumps is improved.Type: ApplicationFiled: May 2, 2002Publication date: September 26, 2002Inventors: Asao Nishimura, Junichi Saeki
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Patent number: 6326681Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the “Lead-On-Chip” or “Chip-On-Lead” structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.Type: GrantFiled: January 13, 2000Date of Patent: December 4, 2001Assignee: Hitachi, LTDInventors: Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo, Asao Nishimura, Makoto Kitano, Akihiro Yaguchi, Sueo Kawai, Masatsugu Ogata, Syuuji Eguchi, Hiroyoshi Kokaku, Masanori Segawa, Hiroshi Hozoji, Takashi Yokoyama, Noriyuki Kinjo, Aizo Kaneda, Junichi Saeki, Shozo Nakamura, Akio Hasebe, Hiroshi Kikuchi, Isamu Yoshida, Takashi Yamazaki, Kazuyoshi Oshima, Tetsuro Matsumoto
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Patent number: 6303982Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the “Lead-On-Chip” or “Chip-On-Lead” structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.Type: GrantFiled: January 30, 2001Date of Patent: October 16, 2001Assignee: Hitachi, Ltd.Inventors: Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo, Asao Nishimura, Makoto Kitano, Akihiro Yaguchi, Sueo Kawai, Masatsugu Ogata, Syuuji Eguchi, Hiroyoshi Kokaku, Masanori Segawa, Hiroshi Hozoji, Takashi Yokoyama, Noriyuki Kinjo, Aizo Kaneda, Junichi Saeki, Shozo Nakamura, Akio Hasebe, Hiroshi Kikuchi, Isamu Yoshida, Takashi Yamazaki, Kazuyoshi Oshima, Tetsuro Matsumoto
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Patent number: 6291880Abstract: A semiconductor device includes a main circuit part having a semiconductor device formed on an electrode plate of a lead frame and a control circuit part having protective functions, which is integrally molded by a resin mold part into an integral mold structure.Type: GrantFiled: February 10, 1999Date of Patent: September 18, 2001Assignee: Hitachi, Ltd.Inventors: Toshio Ogawa, Masaaki Takahashi, Masahiro Gouda, Noritaka Kamimura, Kazuhiro Suzuki, Junichi Saeki, Kazuji Yamada, Makoto Ishii, Akihiro Tamba
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Publication number: 20010008302Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the “Lead-On-Chip” or “Chip-On-Lead” structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.Type: ApplicationFiled: January 30, 2001Publication date: July 19, 2001Inventors: Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo, Asao Nishimura, Makoto Kitano, Akihiro Yaguchi, Sueo Kawai, Masatsugu Ogata, Syuuji Eguchi, Hiroyoshi Kokaku, Masanori Segawa, Hiroshi Hozoji, Takashi Yokoyama, Noriyuki Kinjo, Aizo Kaneda, Junichi Saeki, Shozo Nakamura, Akio Hasebe, Hiroshi Kikuchi, Isamu Yoshida, Takashi Yamazaki, Kazuyoshi Oshima, Tetsurou Matsumoto
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Patent number: 6204552Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the “Lead-On-Chip” or “Chip-On-Lead” structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.Type: GrantFiled: January 12, 2000Date of Patent: March 20, 2001Assignee: Hitachi, Ltd.Inventors: Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo, Asao Nishimura, Makoto Kitano, Akihiro Yaguchi, Sueo Kawai, Masatsugu Ogata, Syuuji Eguchi, Hiroyoshi Kokaku, Masanori Segawa, Hiroshi Hozoji, Takashi Yokoyama, Noriyuki Kinjo, Aizo Kaneda, Junichi Saeki, Shozo Nakamura, Akio Hasebe, Hiroshi Kikuchi, Isamu Yoshida, Takashi Yamazaki, Kazuyoshi Oshima, Tetsuro Matsumoto
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Patent number: 6130114Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.Type: GrantFiled: April 13, 1999Date of Patent: October 10, 2000Assignee: Hitachi, Ltd.Inventors: Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh, Asao Nishimura, Makoto Kitano, Akihiro Yaguchi, Sueo Kawai, Masatsugu Ogata, Syuuji Eguchi, Hiroyoshi Kokaku, Masanori Segawa, Hiroshi Hozoji, Takashi Yokoyama, Noriyuki Kinjo, Aizo Kaneda, Junichi Saeki, Shozo Nakamura, Akio Hasebe, Hiroshi Kikuchi, Isamu Yoshida, Takashi Yamazaki, Kazuyoshi Oshima, Tetsurou Matsumoto
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Patent number: 6124629Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.Type: GrantFiled: October 8, 1998Date of Patent: September 26, 2000Assignee: Hitachi, Ltd.Inventors: Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo, Asao Nishimura, Makoto Kitano, Akihiro Yaguchi, Sueo Kawai, Masatsugu Ogata, Syuuji Eguchi, Hiroyoshi Kokaku, Masanori Segawa, Hiroshi Hozoji, Takashi Yokoyama, Noriyuki Kinjo, Aizo Kaneda, Junichi Saeki, Shozo Nakamura, Akio Hasebe, Hiroshi Kikuchi, Isamu Yoshida, Takashi Yamazaki, Kazuyoshi Oshima, Tetsuro Matsumoto
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Patent number: 6114192Abstract: A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.Type: GrantFiled: July 14, 1998Date of Patent: September 5, 2000Assignee: Hitachi, Ltd.Inventors: Shigeharu Tsunoda, Junichi Saeki, Isamu Yoshida, Kazuya Ooji, Michiharu Honda, Makoto Kitano, Nae Yoneda, Shuji Eguchi, Kunihiko Nishi, Ichiro Anjoh, Kenichi Otsuka
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Patent number: 6100580Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.Type: GrantFiled: October 7, 1998Date of Patent: August 8, 2000Assignee: Hitachi, Ltd.Inventors: Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo, Asao Nishimura, Makoto Kitano, Akihiro Yaguchi, Sueo Kawai, Masatsugu Ogata, Syuuji Eguchi, Hiroyoshi Kokaku, Masanori Segawa, Hiroshi Hozoji, Takashi Yokoyama, Noriyuki Kinjo, Aizo Kaneda, Junichi Saeki, Shozo Nakamura, Akio Hasebe, Hiroshi Kikuchi, Isamu Yoshida, Takashi Yamazaki, Kazuyoshi Oshima, Tetsuro Matsumoto
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Patent number: 6100115Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.Type: GrantFiled: October 5, 1998Date of Patent: August 8, 2000Assignee: Hitachi, Ltd.Inventors: Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo, Asao Nishimura, Makoto Kitano, Akihiro Yaguchi, Sueo Kawai, Masatsugu Ogata, Syuuji Eguchi, Hiroyoshi Kokaku, Masanori Segawa, Hiroshi Hozoji, Takashi Yokoyama, Noriyuki Kinjo, Aizo Kaneda, Junichi Saeki, Shozo Nakamura, Akio Hasebe, Hiroshi Kikuchi, Isamu Yoshida, Takashi Yamazaki, Kazuyoshi Oshima, Tetsuro Matsumoto
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Patent number: 6081023Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.Type: GrantFiled: April 9, 1999Date of Patent: June 27, 2000Assignee: Hitachi, Ltd.Inventors: Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh, Asao Nishimura, Makoto Kitano, Akihiro Yaguchi, Sueo Kawai, Masatsugu Ogata, Syuuji Eguchi, Hiroyoshi Kokaku, Masanori Segawa, Hiroshi Hozoji, Takashi Yokoyama, Noriyuki Kinjo, Aizo Kaneda, Junichi Saeki, Shozo Nakamura, Akio Hasebe, Hiroshi Kikuchi, Isamu Yoshida, Takashi Yamazaki, Kazuyoshi Oshima, Tetsurou Matsumoto
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Patent number: 6072231Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.Type: GrantFiled: April 28, 1998Date of Patent: June 6, 2000Assignee: Hitachi, Ltd.Inventors: Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh, Asao Nishimura, Makoto Kitano, Akihiro Yaguchi, Sueo Kawai, Masatsugu Ogata, Syuuji Eguchi, Hiroyoshi Kokaku, Masanori Segawa, Hiroshi Hozoji, Takashi Yokoyama, Noriyuki Kinjo, Aizo Kaneda, Junichi Saeki, Shozo Nakamura, Akio Hasebe, Hiroshi Kikuchi, Isamu Yoshida, Takashi Yamazaki, Kazuyoshi Oshima, Tetsurou Matsumoto
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Patent number: 6069029Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.Type: GrantFiled: April 15, 1998Date of Patent: May 30, 2000Assignee: Hitachi, Ltd.Inventors: Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo, Asao Nishimura, Makoto Kitano, Akihiro Yaguchi, Sueo Kawai, Masatsugu Ogata, Syuuji Eguchi, Hiroyoshi Kokaku, Masanori Segawa, Hiroshi Hozoji, Takashi Yokoyama, Noriyuki Kinjo, Aizo Kaneda, Junichi Saeki, Shozo Nakamura, Akio Hasebe, Hiroshi Kikuchi, Isamu Yoshida, Takashi Yamazaki, Kazuyoshi Oshima, Tetsuro Matsumoto
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Patent number: 6018191Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.Type: GrantFiled: March 5, 1998Date of Patent: January 25, 2000Assignee: Hitachi, Ltd.Inventors: Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh, Asao Nishimura, Makoto Kitano, Akihiro Yaguchi, Sueo Kawai, Masatsugu Ogata, Syuuji Eguchi, Hiroyoshi Kokaku, Masanori Segawa, Hiroshi Hozoji, Takashi Yokoyama, Noriyuki Kinjo, Aizo Kaneda, Junichi Saeki, Shozo Nakamura, Akio Hasebe, Hiroshi Kikuchi, Isamu Yoshida, Takashi Yamazaki, Kazuyoshi Oshima, Tetsurou Matsumoto
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Patent number: 5981315Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.Type: GrantFiled: October 6, 1998Date of Patent: November 9, 1999Assignee: Hitachi, Ltd.Inventors: Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh, Asao Nishimura, Makoto Kitano, Akihiro Yaguchi, Sueo Kawai, Masatsugu Ogata, Syuuji Eguchi, Hiroyoshi Kokaku, Masanori Segawa, Hiroshi Hozoji, Takashi Yokoyama, Noriyuki Kinjo, Aizo Kaneda, Junichi Saeki, Shozo Nakamura, Akio Hasebe, Hiroshi Kikuchi, Isamu Yoshida, Takashi Yamazaki, Kazuyoshi Oshima, Tetsurou Matsumoto
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Patent number: 5914530Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.Type: GrantFiled: April 1, 1998Date of Patent: June 22, 1999Assignee: Hitachi, Ltd.Inventors: Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh, Asao Nishimura, Makoto Kitano, Akihiro Yaguchi, Sueo Kawai, Masatsugu Ogata, Syuuji Eguchi, Hiroyoshi Kokaku, Masanori Segawa, Hiroshi Hozoji, Takashi Yokoyama, Noriyuki Kinjo, Aizo Kaneda, Junichi Saeki, Shozo Nakamura, Akio Hasebe, Hiroshi Kikuchi, Isamu Yoshida, Takashi Yamazaki, Kazuyoshi Oshima, Tetsuro Matsumoto
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Patent number: 5914531Abstract: A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.Type: GrantFiled: February 25, 1997Date of Patent: June 22, 1999Assignee: Hitachi, Ltd.Inventors: Shigeharu Tsunoda, Junichi Saeki, Isamu Yoshida, Kazuya Ooji, Michiharu Honda, Makoto Kitano, Nae Yoneda, Shuji Eguchi, Kunihiko Nishi, Ichiro Anjoh, Kenichi Otsuka
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Patent number: 5863817Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.Type: GrantFiled: March 24, 1998Date of Patent: January 26, 1999Assignee: Hitachi, Ltd.Inventors: Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo, Asao Nishimura, Makoto Kitano, Akihiro Yaguchi, Sueo Kawai, Masatsugu Ogata, Syuuji Eguchi, Hiroyoshi Kokaku, Masanori Segawa, Hiroshi Hozoji, Takashi Yokoyama, Noriyuki Kinjo, Aizo Kaneda, Junichi Saeki, Shozo Nakamura, Akio Hasebe, Hiroshi Kikuchi, Isamu Yoshida, Takashi Yamazaki, Kazuyoshi Oshima, Tetsuro Matsumoto
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Patent number: 5821606Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.Type: GrantFiled: January 29, 1997Date of Patent: October 13, 1998Assignee: Hitachi, Ltd.Inventors: Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo, Asao Nishimura, Makoto Kitano, Akihiro Yaguchi, Sueo Kawai, Masatsugu Ogata, Syuuji Eguchi, Hiroyoshi Kokaku, Masanori Segawa, Hiroshi Hozoji, Takashi Yokoyama, Noriyuki Kinjo, Aizo Kaneda, Junichi Saeki, Shozo Nakamura, Akio Hasebe, Hiroshi Kikuchi, Isamu Yoshida, Takashi Yamazaki, Kazuyoshi Oshima, Tetsurou Matsumoto