Patents by Inventor Junichi Shinyashiki

Junichi Shinyashiki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7149091
    Abstract: An electronic circuit device, includes: internal terminals; a board on which wirings to the internal terminals are formed; an electronic component that is mounted on the board and is connected with the internal terminals; and an encapsulation resin with which the electronic component and the internal terminals are encapsulated. A part of the wiring forms a ring-shaped portion, and the ring-shaped portion has a plurality of gaps by which the ring-shaped portion is divided into a plurality of discontinuous ring-constituting sections. The plurality of ring-constituting sections are connected to the respective internal terminals, and a coating region of the encapsulation resin is surrounded with the ring-shaped portion. The applied area of the encapsulation resin can be controlled to be constant without using a special element for controlling the flow of the encapsulation resin.
    Type: Grant
    Filed: April 22, 2004
    Date of Patent: December 12, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takao Ochi, Junichi Shinyashiki
  • Publication number: 20040212061
    Abstract: An electronic circuit device, includes: internal terminals; a board on which wirings to the internal terminals are formed; an electronic component that is mounted on the board and is connected with the internal terminals; and an encapsulation resin with which the electronic component and the internal terminals are encapsulated. A part of the wiring forms a ring-shaped portion, and the ring-shaped portion has a plurality of gaps by which the ring-shaped portion is divided into a plurality of discontinuous ring-constituting sections. The plurality of ring-constituting sections are connected to the respective internal terminals, and a coating region of the encapsulation resin is surrounded with the ring-shaped portion. The applied area of the encapsulation resin can be controlled to be constant without using a special element for controlling the flow of the encapsulation resin.
    Type: Application
    Filed: April 22, 2004
    Publication date: October 28, 2004
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takao Ochi, Junichi Shinyashiki
  • Patent number: D522978
    Type: Grant
    Filed: December 20, 2004
    Date of Patent: June 13, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takao Ochi, Junichi Shinyashiki
  • Patent number: D525214
    Type: Grant
    Filed: December 20, 2004
    Date of Patent: July 18, 2006
    Assignee: Matsushita Electrical Industrial Co., Ltd.
    Inventors: Takao Ochi, Junichi Shinyashiki
  • Patent number: D487430
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: March 9, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Nobuyoshi Asaka, Takashi Noda, Takao Ochi, Junichi Shinyashiki