Semiconductor memory element
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Description
FIG. 1 is a top perspective view of a semiconductor memory element showing our new design;
FIG. 2 is a side elevation view thereof, the opposite side view being a mirror image of that shown;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof; and,
FIG. 5 is a front elevation view thereof, the rear elevation view being a mirror image of that shown.
Claims
The ornamental design for a semiconductor memory element, as shown and described.
Referenced Cited
Patent History
Patent number: D487430
Type: Grant
Filed: Nov 27, 2002
Date of Patent: Mar 9, 2004
Assignee: Matsushita Electric Industrial Co., Ltd. (Osaka)
Inventors: Nobuyoshi Asaka (Tokyo), Takashi Noda (Hyogo), Takao Ochi (Shiga-gun), Junichi Shinyashiki (Osaka)
Primary Examiner: Kay H. Chin
Attorney, Agent or Law Firm: Brinks Hofer Gilson & Lione
Application Number: 29/171,752
Type: Grant
Filed: Nov 27, 2002
Date of Patent: Mar 9, 2004
Assignee: Matsushita Electric Industrial Co., Ltd. (Osaka)
Inventors: Nobuyoshi Asaka (Tokyo), Takashi Noda (Hyogo), Takao Ochi (Shiga-gun), Junichi Shinyashiki (Osaka)
Primary Examiner: Kay H. Chin
Attorney, Agent or Law Firm: Brinks Hofer Gilson & Lione
Application Number: 29/171,752
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182);
Cartridge, Chip Or Card (D14/435)
International Classification: 1303;
International Classification: 1303;