Abstract: The present invention aims to provide a thermoplastic polyester resin composition which has characteristic resin viscosity properties necessary for extrusion moldability, has excellent extrusion stability and extrusion moldability, and has flexibility optimal for in-vehicle tubes and hoses. According to the present invention, there is provided a thermoplastic polyester resin composition containing, relative to 100 parts by mass of a polyester resin component containing a polyester elastomer (a), 0.2 to 1.0 part by mass of a compound (b) having two epoxy groups, wherein the thermoplastic polyester resin composition has a z-average molecular weight Mz of 250000 or more and a Shore D hardness of 60 to 85.

Abstract: A polyester resin composition includes a polyester resin A containing 70 to 100% by mass of a polybutylene terephthalate resin and 0 to 30% by mass of a polyethylene terephthalate resin, and includes a metal organic acid salt B that is either one or both of an alkali metal organic acid salt and an alkaline earth metal organic acid salt and a predetermined amount of a polyfunctional glycidyl group-containing styrene-based polymer C, and the polyester resin composition contains either one or both of alkali metal atoms and alkaline earth metal atoms in a predetermined amount based on 100 parts by mass of the polyester resin A, and further, the content of linear oligomers of polybutylene terephthalate or the content of the linear oligomers of polybutylene terephthalate and the linear oligomers of polyethylene terephthalate is less than or equal to 1000 mg/kg.

Abstract: A steel sheet of the present invention has a steel structure obtained by performing a soaking at a dual phase region temperature of Ac1 temperature or higher and lower than Ac3 temperature for a soaking time of 15 seconds or longer and 35 seconds or shorter, next, performing a primary cooling to a temperature range of 250° C. or higher and 380° C. or lower within 3 seconds at a cooling rate of 0.5 ° C./s or more and 30° C./s or less, and performing a retention in a temperature range of 260° C. or higher and 370° C. or lower for 180 seconds or longer and 540 seconds or shorter, in which a yield ratio is 65% or less and tensile strength is 590 MPa or more after the primary cooling.

Abstract: The present invention relates to a polyester resin composition which has an excellent infrared light-transmitting property, and is excellent in heat resistance and low gas emission, and is suitable for use as black colored design parts (particularly as lamp parts). According to the present invention, there is provided a polyester resin composition containing, per 100 parts by mass of a polyester resin, 0.005 to 20 part(s) by mass of an inorganic filler that has an average particle size of 3 ?m or less, 0.05 to 3 part(s) by mass of a polyfunctional glycidyl group-containing styrene polymer and 0.5 to 3 part(s) by mass of an infrared light-transmitting black dye, wherein the polyester resin composition satisfies the following requirements (1) and (2). (1) An average value of transmittances, for wavelengths of 800 to 1100 nm, of a flat plate that is obtained from the polyester resin composition and has a thickness of 2 mm is 5% or higher and less than 20%. (2) Color-L?7.

Abstract: A steel sheet of the present invention has a steel structure obtained by performing a soaking at a dual phase region temperature of Ac1 temperature or higher and lower than Ac3 temperature for a soaking time of 15 seconds or longer and 35 seconds or shorter, next, performing a primary cooling to a temperature range of 250° C. or higher and 380° C. or lower within 3 seconds at a cooling rate of 0.5° C./s or more and 30° C./s or less, and performing a retention in a temperature range of 260° C. or higher and 370° C. or lower for 180 seconds or longer and 540 seconds or shorter, in which a yield ratio is 65% or less and tensile strength is 590 MPa or more after the primary cooling.

Abstract: The present invention is a polyester resin composition that includes a polyester resin A containing 50 to 100% by mass of a polybutylene terephthalate resin and 0 to 50% by mass of a polyethylene terephthalate resin, a metal organic acid salt B being either one or both of an alkali metal organic acid salt and an alkaline earth metal organic acid salt, a polyfunctional glycidyl group-containing styrene-based polymer C in a predetermined amount, and an inorganic filler D having an average particle diameter of 0.05 to 3 ?m. The polyester resin composition contains a predetermined amount of alkali metal atoms/alkaline earth metal atoms, and further the content of linear oligomers of polybutylene terephthalate, or the content of linear oligomers of polybutylene terephthalate and polyethylene terephthalate is less than or equal to 1000 mg/kg.

Abstract: A polyester resin composition includes a polyester resin A containing 70 to 100% by mass of a polybutylene terephthalate resin and 0 to 30% by mass of a polyethylene terephthalate resin, and includes a metal organic acid salt B that is either one or both of an alkali metal organic acid salt and an alkaline earth metal organic acid salt and a predetermined amount of a polyfunctional glycidyl group-containing styrene-based polymer C, and the polyester resin composition contains either one or both of alkali metal atoms and alkaline earth metal atoms in a predetermined amount based on 100 parts by mass of the polyester resin A, and further, the content of linear oligomers of polybutylene terephthalate or the content of the linear oligomers of polybutylene terephthalate and the linear oligomers of polyethylene terephthalate is less than or equal to 1000 mg/kg.

Abstract: The present invention relates to a polyester resin composition which has an excellent infrared light-transmitting property, and is excellent in heat resistance and low gas emission, and is suitable for use as black colored design parts (particularly as lamp parts). According to the present invention, there is provided a polyester resin composition containing, per 100 parts by mass of a polyester resin, 0.005 to 20 part(s) by mass of an inorganic filler that has an average particle size of 3 ?m or less, 0.05 to 3 part(s) by mass of a polyfunctional glycidyl group-containing styrene polymer and 0.5 to 3 part(s) by mass of an infrared light-transmitting black dye, wherein the polyester resin composition satisfies the following requirements (1) and (2). (1) An average value of transmittances, for wavelengths of 800 to 1100 nm, of a flat plate that is obtained from the polyester resin composition and has a thickness of 2 mm is 5% or higher and less than 20%. (2) Color-L?7.

Abstract: The present invention is a polyester resin composition that is includes a polyester resin A containing 50 to 100% by mass of a polybutylene terephthalate resin and 0 to 50% by mass of a polyethylene terephthalate resin, a metal organic acid salt B being either one or both of an alkali metal organic acid salt and an alkaline earth metal organic acid salt, a polyfunctional glycidyl group-containing styrene-based polymer C in a predetermined amount, and an inorganic filler D having an average particle diameter of 0.05 to 3 ?m. The polyester resin composition contains a predetermined amount of alkali metal atoms/alkaline earth metal atoms, and further the content of linear oligomers of polybutylene terephthalate, or the content of linear oligomers of polybutylene terephthalate and polyethylene terephthalate is less than or equal to 1000 mg/kg.

Abstract: The present invention is directed to a thermoplastic polyester resin composition that contains 100 to 50 parts by mass of a polybutylene terephthalate resin (A) and 0 to 50 parts by mass of a polyethylene terephthalate resin (B), and contains 1 to 20 parts by mass of a surface-treated calcium carbonate (C) having an average particle size of 0.05 to 2 ?m and 0.05 to 3 parts by mass of a multifunctional glycidyl group-containing styrene-based polymer (D) with respect to 100 parts by mass of the total polyester resin contained in the resin composition.

Abstract: This disclosure discloses a printer comprising: a host communication device that performs information transmission and reception by wired or wireless communication for the functioning as a host device of a target device; and a target processing portion that performs predetermined processing in accordance with target device information acquired from said target device when said host communication device performs information transmission and reception with said target device.

Abstract: A secure LSI device 1 includes an encryption section 2 for encrypting a program, and an external I/F 50 for inputting/outputting a program or data from/to an external memory 100. In the encryption section 2, the operation of a private key arithmetic processing section 20 is prohibited with respect to a sequence whose execution is determined by a key-generation/update sequencer 30 to be impermissible. In the external I/F 50, a program processing section 51 and a data processing section 55 are structured independently from each other.

Abstract: This disclosure discloses a printer comprising: a host communication device that performs information transmission and reception by wired or wireless communication for the functioning as a host device of a target device; and a target processing portion that performs predetermined processing in accordance with target device information acquired from said target device when said host communication device performs information transmission and reception with said target device.

Abstract: A steel sheet of the present invention has a steel structure obtained by performing a soaking at a dual phase region temperature of Ac1 temperature or higher and lower than Ac3 temperature for a soaking time of 15 seconds or longer and 35 seconds or shorter, next, performing a primary cooling to a temperature range of 250° C. or higher and 380° C. or lower within 3 seconds at a cooling rate of 0.5° C./s or more and 30° C./s or less, and performing a retention in a temperature range of 260° C. or higher and 370° C. or lower for 180 seconds or longer and 540 seconds or shorter, in which a yield ratio is 65% or less and tensile strength is 590 MPa or more after the primary cooling.

Abstract: A secure LSI device 1 includes an encryption section 2 for encrypting a program, and an external I/F 50 for inputting/outputting a program or data from/to an external memory 100. In the encryption section 2, the operation of a private key arithmetic processing section 20 is prohibited with respect to a sequence whose execution is determined by a key-generation/update sequencer 30 to be impermissible. In the external I/F 50, a program processing section 51 and a data processing section 55 are structured independently from each other.

Abstract: A secure LSI device 1 includes an encryption section 2 for encrypting a program, and an external I/F 50 for inputting/outputting a program or data from/to an external memory 100. In the encryption section 2, the operation of a private key arithmetic processing section 20 is prohibited with respect to a sequence whose execution is determined by a key-generation/update sequencer 30 to be impermissible. In the external I/F 50, a program processing section 51 and a data processing section 55 are structured independently from each other.

Abstract: A secure LSI device 1 includes an encryption section 2 for encrypting a program, and an external I/F 50 for inputting/outputting a program or data from/to an external memory 100. In the encryption section 2, the operation of a private key arithmetic processing section 20 is prohibited with respect to a sequence whose execution is determined by a key-generation/update sequencer 30 to be impermissible. In the external I/F 50, a program processing section 51 and a data processing section 55 are structured independently from each other.

Abstract: A secure LSI device 1 includes an encryption section 2 for encrypting a program, and an external I/F 50 for inputting/outputting a program or data from/to an external memory 100. In the encryption section 2, the operation of a private key arithmetic processing section 20 is prohibited with respect to a sequence whose execution is determined by a key-generation/update sequencer 30 to be impermissible. In the external I/F 50, a program processing section 51 and a data processing section 55 are structured independently from each other.

Abstract: An development environment of a high security level is provided for a key-installed system. Development of a program for a system having an LSI device which includes a secure memory is performed by providing another LSI device having the same structure and setting the provided LSI device to a development mode which is different from a product operation mode. Alternatively, the provided LSI device is set to an administrator mode to perform development and encryption of a key-generation program. The LSI device is set to a key-generation mode to execute the encrypted key-generation program, thereby generating various keys.

Abstract: A secure LSI device 1 includes an encryption section 2 for encrypting a program, and an external I/F 50 for inputting/outputting a program or data from/to an external memory 100. In the encryption section 2, the operation of a private key arithmetic processing section 20 is prohibited with respect to a sequence whose execution is determined by a key-generation/update sequencer 30 to be impermissible. In the external I/F 50, a program processing section 51 and a data processing section 55 are structured independently from each other.