Patents by Inventor Junichiro Fujimagari

Junichiro Fujimagari has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solid-state imaging device, method for manufacturing the same and imaging apparatus
    Patent number: 8189083
    Abstract: A solid-state imaging device includes a semiconductor substrate having a pixel region including a photoelectric conversion portion, a wiring portion including a conductor line and disposed on the semiconductor substrate with an insulating film therebetween, a metal pad connected to the conductor line, a pad-coating insulating film coating the metal pad, and a waveguide material layer. The wiring portion and the pad-coating insulating film each have an opening therein over the photoelectric conversion portion, and the openings continue from each other to define a waveguide opening having an open side and a closed side. The waveguide material layer is disposed in the waveguide opening and on the pad-coating insulating film with a passivation layer therebetween. The pad-coating insulating film has a thickness of 50 to 250 nm and a face defining the opening. The face is slanted so as to diverge toward the open side of the opening.
    Type: Grant
    Filed: July 2, 2009
    Date of Patent: May 29, 2012
    Assignee: Sony Corporation
    Inventors: Masashi Nakata, Haruhiko Ajisawa, Naotsugu Yoshida, Yasuhiro Nakana, Junichi Furukawa, Yoshinori Toumiya, Junichiro Fujimagari
  • SOLID-STATE IMAGING DEVICE, METHOD FOR MANUFACTURING THE SAME AND IMAGING APPARATUS
    Publication number: 20100007779
    Abstract: A solid-state imaging device includes a semiconductor substrate having a pixel region including a photoelectric conversion portion, a wiring portion including a conductor line and disposed on the semiconductor substrate with an insulating film therebetween, a metal pad connected to the conductor line, a pad-coating insulating film coating the metal pad, and a waveguide material layer. The wiring portion and the pad-coating insulating film each have an opening therein over the photoelectric conversion portion, and the openings continue from each other to define a waveguide opening having an open side and a closed side. The waveguide material layer is disposed in the waveguide opening and on the pad-coating insulating film with a passivation layer therebetween. The pad-coating insulating film has a thickness of 50 to 250 nm and a face defining the opening. The face is slanted so as to diverge toward the open side of the opening.
    Type: Application
    Filed: July 2, 2009
    Publication date: January 14, 2010
    Applicant: SONY CORPORATION
    Inventors: Masashi Nakata, Haruhiko Ajisawa, Naotsugu Yoshida, Yasuhiro Nakano, Junichi Furukawa, Yoshinori Toumiya, Junichiro Fujimagari
  • Solid-state image pickup device
    Publication number: 20070177044
    Abstract: A solid-state image pickup device includes pixels diagonally arranged, each including a photoelectric conversion unit and a plurality of transistors and wiring extending in the vertical and horizontal directions which is diagonally arranged around the photoelectric conversion unit in each of the pixels so that at least one portion of the wiring is arranged along at least one side of the photoelectric conversion unit.
    Type: Application
    Filed: January 24, 2007
    Publication date: August 2, 2007
    Inventors: Shunsuke Maruyama, Junichiro Fujimagari, Toshifumi Wakano, Motonobu Torii, Hironori Hoshi, Koji Kikuchi