Patents by Inventor Junichiro Yoshioka
Junichiro Yoshioka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9865493Abstract: A plating jig that can form a metal plating film simultaneously on both surfaces of a semiconductor wafer by one plating process. The plating jig includes a base section and a cover section that can hold a substrate to be plated, and a center section that holds the substrate between the base section and cover section; the base section, the cover section and the center section each having an annular portion having an opening at a center thereof; seal packings each having a conductive ring disposed thereon being attached to each of facing surfaces of the annular portions of the base section and the cover section; the substrate to be plated being disposed inside the opening of the center section; and the substrate to be plated being held from front and back surfaces thereof with the seal packings attached to the cover section and the center section.Type: GrantFiled: November 14, 2012Date of Patent: January 9, 2018Assignee: JCU CORPORATIONInventors: Junichiro Yoshioka, Takashi Murayama
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Patent number: 9714476Abstract: A semiconductor wafer holder includes first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the semiconductor wafer. A ring clamp is used to press the second holding member against the first holding member for holding of the semiconductor wafer.Type: GrantFiled: January 14, 2015Date of Patent: July 25, 2017Assignee: EBARA CORPORATIONInventors: Junichiro Yoshioka, Yoshitaka Mukaiyama
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Patent number: 9624596Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.Type: GrantFiled: June 13, 2016Date of Patent: April 18, 2017Assignee: EBARA CORPORATIONInventors: Junichiro Yoshioka, Kuniaki Horie, Yugang Guo, Satoshi Morikami
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Patent number: 9593430Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.Type: GrantFiled: June 13, 2016Date of Patent: March 14, 2017Assignee: EBARA CORPORATIONInventors: Junichiro Yoshioka, Kuniaki Horie, Yugang Guo, Satoshi Morikami
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Patent number: 9506162Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.Type: GrantFiled: June 13, 2016Date of Patent: November 29, 2016Assignee: Ebara CorporationInventors: Junichiro Yoshioka, Kuniaki Horie, Yugang Guo, Satoshi Morikami
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Publication number: 20160319456Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.Type: ApplicationFiled: June 13, 2016Publication date: November 3, 2016Inventors: Junichiro YOSHIOKA, Kuniaki HORIE, Yugang GUO, Satoshi MORIKAMI
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Publication number: 20160319455Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.Type: ApplicationFiled: June 13, 2016Publication date: November 3, 2016Inventors: Junichiro YOSHIOKA, Kuniaki HORIE, Yugang GUO, Satoshi MORIKAMI
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Publication number: 20160319454Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.Type: ApplicationFiled: June 13, 2016Publication date: November 3, 2016Inventors: Junichiro YOSHIOKA, Kuniaki HORIE, Yugang GUO, Satoshi MORIKAMI
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Patent number: 9388505Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.Type: GrantFiled: December 10, 2014Date of Patent: July 12, 2016Assignee: Ebara CorporationInventors: Junichiro Yoshioka, Kuniaki Horie, Yugang Guo, Satoshi Morikami
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Publication number: 20160138181Abstract: A plating device includes a pl,ting bath containing therein a plating solution, a substrate holder for detachably holding a substrate, an anode disposed opposite to the substrate held by the substrate holder, a rail part stretched across an upper portion of the plating bath in parallel to the substrate holder, and a paddle suspended by the rail part and capable of reciprocating along the rail part. The paddle is vertically provided with a vane part rotatable round or pivotable on an axis part. The plating device can increase flow rate of a plating solution without installing a circulating pump outside a plating bath, and further can achieve same flow rate of the plating solution from a bottom of the plating bath to a level of the solution, enabling plating that forms a plating film having a uniform thickness on an entire region of a substrate and exhibits a high deposition rate.Type: ApplicationFiled: March 27, 2014Publication date: May 19, 2016Applicant: JCU CORPORATIONInventors: Junichiro YOSHIOKA, Takashi MURAYAMA
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Publication number: 20150294894Abstract: A plating jig that can form a metal plating film simultaneously on both surfaces of a semiconductor wafer by one plating process. The plating jig includes a base section and a cover section that can hold a substrate to be plated, and a center section that holds the substrate between the base section and cover section; the base section, the cover section and the center section each having an annular portion having an opening at a center thereof; seal packings each having a conductive ring disposed thereon being attached to each of facing surfaces of the annular portions of the base section and the cover section; the substrate to be plated being disposed inside the opening of the center section; and the substrate to be plated being held from front and back surfaces thereof with the seal packings attached to the cover section and the center section.Type: ApplicationFiled: November 14, 2012Publication date: October 15, 2015Applicant: JCU CORPORATIONInventors: Junichiro Yoshioka, Takashi Murayama
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Publication number: 20150136610Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.Type: ApplicationFiled: December 10, 2014Publication date: May 21, 2015Inventors: Junichiro YOSHIOKA, Kuniaki HORIE, Yugang GUO, Satoshi MORIKAMI
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Publication number: 20150122635Abstract: A semiconductor wafer holder includes first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the semiconductor wafer. A ring clamp is used to press the second holding member against the first holding member for holding of the semiconductor wafer.Type: ApplicationFiled: January 14, 2015Publication date: May 7, 2015Inventors: Junichiro YOSHIOKA, Yoshitaka MUKAIYAMA
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Publication number: 20150068890Abstract: A plating jig and a plating device used for plating treatment of a substrate. The plating jig includes a mechanism rotatably driving a substrate holder, and detachably mounted on a plating bath integrally with a support portion. The plating jig includes the support portion which is formed in an engageable manner with a side wall of the plating bath, and the substrate holder which is vertically rotatably mounted on the support portion. The plating jig further includes a rotary mechanism for the substrate holder. The plating device utilizes the plating jig.Type: ApplicationFiled: April 20, 2012Publication date: March 12, 2015Applicant: JCU CORPORATIONInventors: Junichiro Yoshioka, Takashi Murayama
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Patent number: 8961755Abstract: A semiconductor wafer holder includes first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the semiconductor wafer. A ring clamp is used to press the second holding member against the first holding member for holding of the semiconductor wafer.Type: GrantFiled: November 7, 2011Date of Patent: February 24, 2015Assignee: Ebara CorporationInventors: Junichiro Yoshioka, Yoshitaka Mukaiyama
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Patent number: 8936705Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.Type: GrantFiled: November 26, 2012Date of Patent: January 20, 2015Assignee: Ebara CorporationInventors: Junichiro Yoshioka, Kuniaki Horie, Yugang Guo, Satoshi Morikami
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Publication number: 20140251798Abstract: A substrate plating jig including a first plate-shaped holding member and a second holding member including a ring-shaped seal packing, including an internal circumferential part, an external circumferential part, and an opening formed at the center of the ring-shaped seal packing. Leading edges of the internal circumferential part and external circumferential part of the ring-shaped seal packing come in close contact with a substrate surface-to-be plated and the first holding member, respectively. The edge of the substrate-to-be-plated is held between the internal circumferential part and the external circumferential part of the ring-shaped seal packing. The substrate surface-to-be-plated is exposed in the opening.Type: ApplicationFiled: October 19, 2011Publication date: September 11, 2014Applicant: JCU CORPORATIONInventors: Junichiro Yoshioka, Takashi Murayama
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Publication number: 20130015075Abstract: A plating apparatus has an ashing unit (300) configured to perform an ashing process on a resist (502) applied on a surface of a seed layer (500) formed on a substrate (W), and a pre-wetting section (26) configured to provide hydrophilicity to a surface of the substrate after the ashing process. The plating apparatus includes a pre-soaking section (28) configured to bring the surface of the substrate into contact with a treatment solution to clean or activate a surface of the seed layer formed on the substrate. The plating apparatus also includes a plating unit (34) configured to bring the surface of the substrate into a plating solution in a plating tank while the resist is used as a mask so as to form a plated film (504) on the surface of the seed layer formed on the substrate.Type: ApplicationFiled: September 14, 2012Publication date: January 17, 2013Inventors: Masahiko SEKIMOTO, Yasuhiko Endo, Stephen Strausser, Takashi Takemura, Nobutoshi Saito, Fumio Kuriyama, Junichiro Yoshioka, Kuniaki Horie, Yoshio Minami, Kenji Kamoda
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Patent number: 8337680Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.Type: GrantFiled: January 31, 2011Date of Patent: December 25, 2012Assignee: Ebara CorporationInventors: Junichiro Yoshioka, Kuniaki Horie, Yugang Guo, Satoshi Morikami
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Patent number: 8133376Abstract: A plating method and a plating apparatus, which has a plurality of plating units, for plating a substrate. Each of the plating units includes a plating tank for containing a plating solution therein, a water cleaning tank, disposed adjacent to said plating tank for cleaning the substrate with water, a substrate holder for holding the substrate in a vertical orientation, a vertical displacing mechanism for vertically dipping the substrate holder and a substrate held thereby in the plating solution in the plating tank, and a lateral displacing mechanism or a back-and-forth displacing mechanism for moving the substrate holder while holding the substrate in a vertical orientation between the plating tank and the water cleaning tank. The plating unit also includes a loading/unloading station for loading and unloading the substrate, and a transfer device for transferring the substrate between the plating unit and the loading/unloading station.Type: GrantFiled: August 30, 2010Date of Patent: March 13, 2012Assignee: Ebara CorporationInventors: Junichiro Yoshioka, Seiji Katsuoka, Masahiko Sekimoto, Yasuhiko Endo, Yugang Guo