Patents by Inventor Junichiro Yoshioka

Junichiro Yoshioka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11117489
    Abstract: Provided is a control method which includes: obtaining battery information which is information regarding a battery; calculating a present residual value of the battery based on the battery information obtained; calculating a first residual value using a first model which has been trained, the first residual value being a residual value of the battery in a case where a user uses the battery with a tendency identical to a tendency of a plurality of other users; and issuing a token to the user according to an evaluation value calculated based on the present residual value and the first residual value calculated.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: September 14, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA
    Inventors: Junichiro Soeda, Kohsuke Yoshioka
  • Patent number: 9865493
    Abstract: A plating jig that can form a metal plating film simultaneously on both surfaces of a semiconductor wafer by one plating process. The plating jig includes a base section and a cover section that can hold a substrate to be plated, and a center section that holds the substrate between the base section and cover section; the base section, the cover section and the center section each having an annular portion having an opening at a center thereof; seal packings each having a conductive ring disposed thereon being attached to each of facing surfaces of the annular portions of the base section and the cover section; the substrate to be plated being disposed inside the opening of the center section; and the substrate to be plated being held from front and back surfaces thereof with the seal packings attached to the cover section and the center section.
    Type: Grant
    Filed: November 14, 2012
    Date of Patent: January 9, 2018
    Assignee: JCU CORPORATION
    Inventors: Junichiro Yoshioka, Takashi Murayama
  • Patent number: 9714476
    Abstract: A semiconductor wafer holder includes first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the semiconductor wafer. A ring clamp is used to press the second holding member against the first holding member for holding of the semiconductor wafer.
    Type: Grant
    Filed: January 14, 2015
    Date of Patent: July 25, 2017
    Assignee: EBARA CORPORATION
    Inventors: Junichiro Yoshioka, Yoshitaka Mukaiyama
  • Patent number: 9624596
    Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.
    Type: Grant
    Filed: June 13, 2016
    Date of Patent: April 18, 2017
    Assignee: EBARA CORPORATION
    Inventors: Junichiro Yoshioka, Kuniaki Horie, Yugang Guo, Satoshi Morikami
  • Patent number: 9593430
    Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.
    Type: Grant
    Filed: June 13, 2016
    Date of Patent: March 14, 2017
    Assignee: EBARA CORPORATION
    Inventors: Junichiro Yoshioka, Kuniaki Horie, Yugang Guo, Satoshi Morikami
  • Patent number: 9506162
    Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.
    Type: Grant
    Filed: June 13, 2016
    Date of Patent: November 29, 2016
    Assignee: Ebara Corporation
    Inventors: Junichiro Yoshioka, Kuniaki Horie, Yugang Guo, Satoshi Morikami
  • Publication number: 20160319455
    Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.
    Type: Application
    Filed: June 13, 2016
    Publication date: November 3, 2016
    Inventors: Junichiro YOSHIOKA, Kuniaki HORIE, Yugang GUO, Satoshi MORIKAMI
  • Publication number: 20160319454
    Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.
    Type: Application
    Filed: June 13, 2016
    Publication date: November 3, 2016
    Inventors: Junichiro YOSHIOKA, Kuniaki HORIE, Yugang GUO, Satoshi MORIKAMI
  • Publication number: 20160319456
    Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.
    Type: Application
    Filed: June 13, 2016
    Publication date: November 3, 2016
    Inventors: Junichiro YOSHIOKA, Kuniaki HORIE, Yugang GUO, Satoshi MORIKAMI
  • Patent number: 9388505
    Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.
    Type: Grant
    Filed: December 10, 2014
    Date of Patent: July 12, 2016
    Assignee: Ebara Corporation
    Inventors: Junichiro Yoshioka, Kuniaki Horie, Yugang Guo, Satoshi Morikami
  • Publication number: 20160138181
    Abstract: A plating device includes a pl,ting bath containing therein a plating solution, a substrate holder for detachably holding a substrate, an anode disposed opposite to the substrate held by the substrate holder, a rail part stretched across an upper portion of the plating bath in parallel to the substrate holder, and a paddle suspended by the rail part and capable of reciprocating along the rail part. The paddle is vertically provided with a vane part rotatable round or pivotable on an axis part. The plating device can increase flow rate of a plating solution without installing a circulating pump outside a plating bath, and further can achieve same flow rate of the plating solution from a bottom of the plating bath to a level of the solution, enabling plating that forms a plating film having a uniform thickness on an entire region of a substrate and exhibits a high deposition rate.
    Type: Application
    Filed: March 27, 2014
    Publication date: May 19, 2016
    Applicant: JCU CORPORATION
    Inventors: Junichiro YOSHIOKA, Takashi MURAYAMA
  • Publication number: 20150294894
    Abstract: A plating jig that can form a metal plating film simultaneously on both surfaces of a semiconductor wafer by one plating process. The plating jig includes a base section and a cover section that can hold a substrate to be plated, and a center section that holds the substrate between the base section and cover section; the base section, the cover section and the center section each having an annular portion having an opening at a center thereof; seal packings each having a conductive ring disposed thereon being attached to each of facing surfaces of the annular portions of the base section and the cover section; the substrate to be plated being disposed inside the opening of the center section; and the substrate to be plated being held from front and back surfaces thereof with the seal packings attached to the cover section and the center section.
    Type: Application
    Filed: November 14, 2012
    Publication date: October 15, 2015
    Applicant: JCU CORPORATION
    Inventors: Junichiro Yoshioka, Takashi Murayama
  • Publication number: 20150136610
    Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.
    Type: Application
    Filed: December 10, 2014
    Publication date: May 21, 2015
    Inventors: Junichiro YOSHIOKA, Kuniaki HORIE, Yugang GUO, Satoshi MORIKAMI
  • Publication number: 20150122635
    Abstract: A semiconductor wafer holder includes first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the semiconductor wafer. A ring clamp is used to press the second holding member against the first holding member for holding of the semiconductor wafer.
    Type: Application
    Filed: January 14, 2015
    Publication date: May 7, 2015
    Inventors: Junichiro YOSHIOKA, Yoshitaka MUKAIYAMA
  • Publication number: 20150068890
    Abstract: A plating jig and a plating device used for plating treatment of a substrate. The plating jig includes a mechanism rotatably driving a substrate holder, and detachably mounted on a plating bath integrally with a support portion. The plating jig includes the support portion which is formed in an engageable manner with a side wall of the plating bath, and the substrate holder which is vertically rotatably mounted on the support portion. The plating jig further includes a rotary mechanism for the substrate holder. The plating device utilizes the plating jig.
    Type: Application
    Filed: April 20, 2012
    Publication date: March 12, 2015
    Applicant: JCU CORPORATION
    Inventors: Junichiro Yoshioka, Takashi Murayama
  • Patent number: 8961755
    Abstract: A semiconductor wafer holder includes first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the semiconductor wafer. A ring clamp is used to press the second holding member against the first holding member for holding of the semiconductor wafer.
    Type: Grant
    Filed: November 7, 2011
    Date of Patent: February 24, 2015
    Assignee: Ebara Corporation
    Inventors: Junichiro Yoshioka, Yoshitaka Mukaiyama
  • Patent number: 8936705
    Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.
    Type: Grant
    Filed: November 26, 2012
    Date of Patent: January 20, 2015
    Assignee: Ebara Corporation
    Inventors: Junichiro Yoshioka, Kuniaki Horie, Yugang Guo, Satoshi Morikami
  • Publication number: 20140251798
    Abstract: A substrate plating jig including a first plate-shaped holding member and a second holding member including a ring-shaped seal packing, including an internal circumferential part, an external circumferential part, and an opening formed at the center of the ring-shaped seal packing. Leading edges of the internal circumferential part and external circumferential part of the ring-shaped seal packing come in close contact with a substrate surface-to-be plated and the first holding member, respectively. The edge of the substrate-to-be-plated is held between the internal circumferential part and the external circumferential part of the ring-shaped seal packing. The substrate surface-to-be-plated is exposed in the opening.
    Type: Application
    Filed: October 19, 2011
    Publication date: September 11, 2014
    Applicant: JCU CORPORATION
    Inventors: Junichiro Yoshioka, Takashi Murayama
  • Publication number: 20130015075
    Abstract: A plating apparatus has an ashing unit (300) configured to perform an ashing process on a resist (502) applied on a surface of a seed layer (500) formed on a substrate (W), and a pre-wetting section (26) configured to provide hydrophilicity to a surface of the substrate after the ashing process. The plating apparatus includes a pre-soaking section (28) configured to bring the surface of the substrate into contact with a treatment solution to clean or activate a surface of the seed layer formed on the substrate. The plating apparatus also includes a plating unit (34) configured to bring the surface of the substrate into a plating solution in a plating tank while the resist is used as a mask so as to form a plated film (504) on the surface of the seed layer formed on the substrate.
    Type: Application
    Filed: September 14, 2012
    Publication date: January 17, 2013
    Inventors: Masahiko SEKIMOTO, Yasuhiko Endo, Stephen Strausser, Takashi Takemura, Nobutoshi Saito, Fumio Kuriyama, Junichiro Yoshioka, Kuniaki Horie, Yoshio Minami, Kenji Kamoda
  • Patent number: 8337680
    Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: December 25, 2012
    Assignee: Ebara Corporation
    Inventors: Junichiro Yoshioka, Kuniaki Horie, Yugang Guo, Satoshi Morikami