Patents by Inventor Junichiro Yoshioka
Junichiro Yoshioka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20120048727Abstract: A semiconductor wafer holder includes first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the semiconductor wafer. A ring clamp is used to press the second holding member against the first holding member for holding of the semiconductor wafer.Type: ApplicationFiled: November 7, 2011Publication date: March 1, 2012Inventors: Junichiro Yoshioka, Yoshitaka Mukaiyama
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Patent number: 8075756Abstract: A semiconductor wafer holder includes first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the semiconductor wafer. A ring clamp is used to press the second holding member against the first holding member for holding of the semiconductor wafer.Type: GrantFiled: October 13, 2010Date of Patent: December 13, 2011Assignee: Ebara CorporationInventors: Junichiro Yoshioka, Yoshitaka Mukaiyama
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Patent number: 8012332Abstract: An apparatus forms a plated film in fine trenches and plugs for interconnects and in the openings of a resist formed in the surface of a substrate such as a semiconductor wafer, and forms bumps (protruding electrodes) on the surface of a semiconductor wafer. The apparatus includes a substrate holder capable of opening and closing for holding a substrate such that the front surface of the substrate is exposed while the backside and the edge thereof are hermetically sealed. A plating tank accommodates a plating liquid in which an anode is immersed. A diaphragm is provided in the plating tank and disposed between the anode and the substrate held by the substrate holder. Plating liquid circulating systems circulate the plating liquid to respective regions of the plating tank, separated by the diaphragm. A deaerating unit is disposed in at least one of the plating liquid circulating systems.Type: GrantFiled: June 19, 2008Date of Patent: September 6, 2011Assignee: Ebara CorporationInventors: Junichiro Yoshioka, Nobutoshi Saito, Yoshitaka Mukaiyama, Tsuyoshi Tokuoka
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Publication number: 20110127159Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.Type: ApplicationFiled: January 31, 2011Publication date: June 2, 2011Inventors: Junichiro Yoshioka, Kuniaki Horie, Yugang Guo, Satoshi Morikami
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Patent number: 7901551Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.Type: GrantFiled: September 4, 2009Date of Patent: March 8, 2011Assignee: Ebara CorporationInventors: Junichiro Yoshioka, Kuniaki Horie, Yugang Guo, Satoshi Morikami
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Publication number: 20110036722Abstract: A semiconductor wafer holder includes first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the semiconductor wafer. A ring clamp is used to press the second holding member against the first holding member for holding of the semiconductor wafer.Type: ApplicationFiled: October 13, 2010Publication date: February 17, 2011Inventors: Junichiro Yoshioka, Yoshitaka Mukaiyama
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Publication number: 20100320090Abstract: A plating method and a plating apparatus, which has a plurality of plating units, for plating a substrate. Each of the plating units includes a plating tank for containing a plating solution therein, a water cleaning tank, disposed adjacent to said plating tank for cleaning the substrate with water, a substrate holder for holding the substrate in a vertical orientation, a vertical displacing mechanism for vertically dipping the substrate holder and a substrate held thereby in the plating solution in the plating tank, and a lateral displacing mechanism or a back-and-forth displacing mechanism for moving the substrate holder while holding the substrate in a vertical orientation between the plating tank and the water cleaning tank. The plating unit also includes a loading/unloading station for loading and unloading the substrate, and a transfer device for transferring the substrate between the plating unit and the loading/unloading station.Type: ApplicationFiled: August 30, 2010Publication date: December 23, 2010Inventors: Junichiro YOSHIOKA, Seiji Katsuoka, Masahiko Sekimoto, Yasuhiko Endo, Yugang Guo
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Patent number: 7833393Abstract: A semiconductor wafer holder includes first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the semiconductor wafer. A ring clamp is used to press the second holding member against the first holding member for holding of the semiconductor wafer.Type: GrantFiled: March 13, 2006Date of Patent: November 16, 2010Assignee: Ebara CorporationInventors: Junichiro Yoshioka, Yoshitaka Mukaiyama
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Patent number: 7807027Abstract: A plating method and a plating apparatus, which has a plurality of plating units, for plating a substrate. Each of the plating units includes a plating tank for containing a plating solution therein, a water cleaning tank, disposed adjacent to said plating tank for cleaning the substrate with water, a substrate holder for holding the substrate in a vertical orientation, a vertical displacing mechanism for vertically dipping the substrate holder and a substrate held thereby in the plating solution in the plating tank, and a lateral displacing mechanism or a back-and-forth displacing mechanism for moving the substrate holder while holding the substrate in a vertical orientation between the plating tank and the water cleaning tank. The plating unit also includes a loading/unloading station for loading and unloading the substrate, and a transfer device for transferring the substrate between the plating unit and the loading/unloading station.Type: GrantFiled: December 3, 2004Date of Patent: October 5, 2010Assignee: Ebara CorporationInventors: Junichiro Yoshioka, Seiji Katsuoka, Masahiko Sekimoto, Yasuhiko Endo, Yugang Guo
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Publication number: 20100000858Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.Type: ApplicationFiled: September 4, 2009Publication date: January 7, 2010Inventors: Junichiro Yoshioka, Kuniaki Horie, Yugang Guo, Satoshi Morikami
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Publication number: 20090301395Abstract: A plating apparatus has an ashing unit (300) configured to perform an ashing process on a resist (502) applied on a surface of a seed layer (500) formed on a substrate (W), and a pre-wetting section (26) configured to provide hydrophilicity to a surface of the substrate after the ashing process. The plating apparatus includes a pre-soaking section (28) configured to bring the surface of the substrate into contact with a treatment solution to clean or activate a surface of the seed layer formed on the substrate. The plating apparatus also includes a plating unit (34) configured to bring the surface of the substrate into a plating solution in a plating tank while the resist is used as a mask so as to form a plated film (504) on the surface of the seed layer formed on the substrate.Type: ApplicationFiled: August 19, 2009Publication date: December 10, 2009Inventors: Masahiko SEKIMOTO, Yasuhiko Endo, Stephen Strausser, Takashi Takemura, Nobutoshi Saito, Fumio Kuriyama, Junichiro Yoshioka, Kuniaki Horie, Yoshio Minami, Kenji Kamoda
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Patent number: 7601248Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.Type: GrantFiled: June 20, 2003Date of Patent: October 13, 2009Assignee: Ebara CorporationInventors: Junichiro Yoshioka, Kuniaki Horie, Yugang Guo, Satoshi Morikami
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Publication number: 20080245669Abstract: An apparatus forms a plated film in fine trenches and plugs for interconnects and in the openings of a resist formed in the surface of a substrate such as a semiconductor wafer, and forms bumps (protruding electrodes) on the surface of a semiconductor wafer. The apparatus includes a substrate holder capable of opening and closing for holding a substrate such that the front surface of the substrate is exposed while the backside and the edge thereof are hermetically sealed. A plating tank accommodates a plating liquid in which an anode is immersed. A diaphragm is provided in the plating tank and disposed between the anode and the substrate held by the substrate holder. Plating liquid circulating systems circulate the plating liquid to respective regions of the plating tank, separated by the diaphragm. A deaerating unit is disposed in at least one of the plating liquid circulating systems.Type: ApplicationFiled: June 19, 2008Publication date: October 9, 2008Inventors: Junichiro Yoshioka, Nobutoshi Saito, Yoshitaka Mukaiyama, Tsuyoshi Tokuoka
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Patent number: 7402227Abstract: An apparatus forms a plated film in fine trenches and plugs for interconnects and in the openings of a resist formed in the surface of a substrate such as a semiconductor wafer, and forms bumps (protruding electrodes) on the surface of a semiconductor wafer. The apparatus includes a substrate holder capable of opening and closing for holding a substrate such that the front surface of the substrate is exposed while the backside and the edge thereof are hermetically sealed. A plating tank accommodates a plating liquid in which an anode is immersed. A diaphragm is provided in the plating tank and disposed between the anode and the substrate held by the substrate holder. Plating liquid circulating systems circulate the plating liquid to respective regions of the plating tank, separated by the diaphragm. A deaerating unit is disposed in at least one of the plating liquid circulating systems.Type: GrantFiled: October 20, 2004Date of Patent: July 22, 2008Assignee: Ebara CorporationInventors: Junichiro Yoshioka, Nobutoshi Saito, Yoshitaka Mukaiyama, Tsuyoshi Tokuoka
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Patent number: 7118664Abstract: The present invention provides a plating method and apparatus, which is capable of introducing plating solution into the fine channels and holes formed in a substrate without needing to add a surface active agent to the plating solution, and capable of forming a high-quality plating film having no defects or omissions. The plating method for performing electrolytic or electroless plating of an object using a plating solution comprises: conducting a plating operation after or while deaerating dissolved gas in the plating solution; and/or conducting a preprocessing operation using a preprocessing solution after or while deaerating dissolved gas in the preprocessing solution and subsequently conducting the plating operation.Type: GrantFiled: February 18, 2004Date of Patent: October 10, 2006Assignee: Ebara CorporationInventors: Junichiro Yoshioka, Nobutoshi Saito, Tsuyoshi Tokuoka
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Publication number: 20060151317Abstract: A semiconductor wafer holder includes first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the semiconductor wafer. A ring clamp is used to press the second holding member against the first holding member for holding of the semiconductor wafer.Type: ApplicationFiled: March 13, 2006Publication date: July 13, 2006Inventors: Junichiro Yoshioka, Yoshitaka Mukaiyama
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Publication number: 20060141157Abstract: A plating apparatus has an ashing unit (300) configured to perform an ashing process on a resist (502) applied on a surface of a seed layer (500) formed on a substrate (W), and a pre-wetting section (26) configured to provide hydrophilicity to a surface of the substrate after the ashing process. The plating apparatus includes a pre-soaking section (28) configured to bring the surface of the substrate into contact with a treatment solution to clean or activate a surface of the seed layer formed on the substrate. The plating apparatus also includes a plating unit (34) configured to bring the surface of the substrate into a plating solution in a plating tank while the resist is used as a mask so as to form a plated film (504) on the surface of the seed layer formed on the substrate.Type: ApplicationFiled: May 25, 2004Publication date: June 29, 2006Inventors: Masahiko Sekimoto, Yasuhiko Endo, Stephen Strausser, Takashi Takemura, Nobutoshi Saito, Fumio Kuriyama, Junichiro Yoshioka, Kuniaki Horie, Yoshio Minami
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Publication number: 20060081478Abstract: A plating apparatus employs a dipping method with good gas-bubble releasability and, by regulating the flow of plating solution in a plating tank, can enhance the in-plane uniformity of a thickness of a plated film. The plating apparatus includes a plating tank for holding a plating solution, a plating solution jet nozzle having a slit-like plating solution jet orifice for jetting the plating solution toward a surface to be plated of an object to be plated disposed in the plating tank, and a plating solution supply section for supplying the plating solution to the plating solution jet nozzle.Type: ApplicationFiled: October 18, 2005Publication date: April 20, 2006Inventors: Tsuyoshi Sahoda, Tsutomu Nakada, Nobutoshi Saito, Junichiro Yoshioka, Fumio Kuriyama, Masunobu Onozawa
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Patent number: 7022211Abstract: A semiconductor wafer holder including first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the semiconductor wafer. A ring clamp is used to press the second holding member against the first holding member for holding of the semiconductor wafer.Type: GrantFiled: November 23, 2001Date of Patent: April 4, 2006Assignee: Ebara CorporationInventors: Junichiro Yoshioka, Yoshitaka Mukaiyama
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Publication number: 20050092600Abstract: A substrate holder holds a substrate while hermetically sealing an outer circumferential edge and a reverse side of the substrate and exposing a surface of the substrate. The substrate holder has a base and a cover having an opening defined therein and positioned to place the substrate between the base and the cover. An attracting mechanism couples the base and the cover to each other to hold the substrate between the base and the cover, with the surface of the substrate being exposed through the opening.Type: ApplicationFiled: December 3, 2004Publication date: May 5, 2005Inventors: Junichiro Yoshioka, Seiji Katsuoka, Masahiko Sekimoto, Yasuhiko Endo, Yugang Guo