Abstract: First, a silicon germanium single-crystalline layer and a silicon single-crystalline layer are formed on a main surface of a bond wafer by epitaxy. The overall surface of the bond wafer is oxidized for forming a silicon oxide layer. Then, a base wafer is bonded to the bond wafer. The bond wafer and the base wafer bonded to each other are heated for reinforcing adhesion therebetween. Then, the bond wafer is removed by plasma etching with chlorine gas while making the silicon germanium single-crystalline layer serve as a stopper. Thereafter the silicon germanium single-crystalline layer is polished by chemical mechanical polishing to have a thickness suitable for forming a device. Thus implemented is a method of manufacturing an SOI substrate by bonding capable of employing a layer having a crystal state with small irregularity for serving as a stopper having selectivity for single-crystalline silicon and effectively using the stopper as a device forming layer.

Abstract: A paste dispensing container comprising a cylindrical container having positioned therein a piston slidable along the walls of the container, a first end closed with a cap to seal paste within the container, a connecting portion at a second end of the container for connection with a pressurized fluid supply, and a leakage preventing cover having an air orifice covering the second end of the container. The paste dispensing container can be vacuum packaged in a gas-impermeable film for shipping and storage to prevent exposure of the paste contained therein to air.

Abstract: A chemically amplified positive resist composition capable of giving a resist film excellent in adhesion to a substrate;

Abstract: There is disclosed a curable resin composition that has an excellent fluidity prior to curing and that cures to form a molding resin that is flexible, highly moisture resistant, and strongly resistant to heat shock, said composition comprising(A) 100 weight parts of a curable resin; and(B) 0.1 to 500 weight parts of an epoxy group-containing silicone resin that has the general formula(R.sup.1 SiO.sub.3/2).sub.a (R.sup.2 R.sup.3 SiO.sub.2/2).sub.b (SiO.sub.4/2).sub.cwherein R.sup.1, R.sup.2 and R.sup.3 each represents a group selected from the group consisting of an epoxy group-containing organic group and a monovalent hydrocarbon group with the proviso that said epoxy group-containing organic groups comprise 0.1 to 40 mole percent of the total silicon-bonded organic groups in said silicone resin (B), a is a positive number, b is zero or a positive number, c is zero or a positive number, b/a has a value of zero to 10, c/(a+b+c) has a value of zero to 0.

Abstract: The thermosetting silicone composition of the instant invention is comprised of (a) a diorganopolysiloxane containing alkenyl groups, (b) an organohydrogenpolysiloxane, (c) a platinum catalyst-containing silicone resin fine particle catalyst comprised of (i) a thermoplastic silicone resin containing 5 to 90 mole % PhSiO.sub.3/2 siloxane units and 5 to 20 mole % MeViSiO.sub.2/2 siloxane units, wherein Ph denotes phenyl, Me denotes methyl and Vi denotes vinyl; said resin having a glass transition point of 40.degree. to 70.degree. C. and (ii) 0.05 to 2 wt % as platinum atoms of a platinum catalyst; and (d) a hydrosilation reaction inhibiting compound. The thermosetting silicone compositions have excellent storage stability at about room temperature, and cure at a fast rate when heated.

Abstract: A microparticle catalyst for hydrosilylation reactions which contains microparticles of an average particle diameter of 0.1 to 20 .mu.m made of a metallic catalyst for hydrosilylation reactions; a disiloxane having the general formula (R.sup.1 R.sup.2 ArSi).sub.2 O, wherein, R.sup.1 is an alkenyl group, R.sup.2 is a monovalent hydrocarbon group and Ar is an aryl group; and a resin having a glass transition temperature of 40.degree. to 200.degree. C. and thermosetting silicone composition containing the microparticle catalyst.

Abstract: The present invention relates to a hardenable organopolysiloxane composition having a viscosity of less than 30,000 Poise at 25.degree. C. comprising (A) 30 to 75 wt % of a silicone resin, (B) 70 to 25 wt % of a mercapto functional organopolysiloxane, (C) 0.1 to 10 parts by weight per 100 parts by weight of (A)+(B) of a mercapto functional organosilane, and (D) 0.01 to 10 parts by weight per 100 parts by weight of (A)+(B) of a condensation catalyst. The present invention also relates to an article of manufacture obtained by applying the hardenable organopolysiloxane composition to a substrate, exposing the composition and substrate to high energy radiation, and then applying a solid support to the coated substrate.

Abstract: A curable organopolysiloxane composition that maintains flowability under moisture-free and light blocking conditions, more rapidly forms a nonflowable adhesive when irradiated with high energy beams such as ultraviolet rays and electron beams, and forms an elastic body by further curing when exposed to atmospheric moisture. It also involves a method for adhering a substrate to an adherend using the composition. The curable organosiloxane composition has a viscosity of 3,000 Pa.s or less and is made up of a silicone resin containing no alkenyl groups, a polydiorganosiloxane having terminal units containing a mercapto group, an alkenyl-containing organopolysiloxane, and a condensation-reaction-promoting catalyst. An assembly which has a substrates adhered to an adherend is made by spreading the composition on the substrate, irradiating it with a high energy beam, contacting the irradiated surface with an adherend, and letting it stand in air, so that the substrate is adhered to the adherend.

Abstract: There is disclosed a curable resin composition that has an excellent fluidity prior to curing and that cures to form a molding resin that is flexible, highly moisture resistant, and strongly resistant to heat shock, said composition comprising(A) 100 weight parts of a curable resin; and(B) 0.1 to 500 weight parts of an epoxy group-containing silicone resin that has the general formula(R.sup.1 SiO.sub.3/2).sub.a (R.sup.2 R.sup.3 SiO.sub.2/2).sub.b (SiO.sub.4/2).sub.cwherein R.sup.1, R.sup.2 and R.sup.3 each represents a group selected from the group consisting of an epoxy group-containing organic group and a monovalent hydrocarbon group with the proviso that said epoxy group-containing organic groups comprise 0.1 to 40 mole percent of the total silicon-bonded organic groups in said silicone resin (B), a is a positive number, b is zero or a positive number, c is zero or a positive number, b/a has a value of zero to 10, c/(a+b+c) has a value of zero to 0.

Abstract: In a linear sensor, a charge transfer part is disposed between a one-dimensional array of photodetectors and an overflow drain and includes a CCD having four or more transfer gates for each photodetector for transferring signal charges from the photodetector array in a direction of the photodetector array, transfer gates controlling charge transfer from the photodetectors to the CCD, and shutter gates for controlling charge transfer from the charge transfer part to the overflow drain. Each transfer gate is disposed between each photodetector and a prescribed one of the four or more transfer gates, and each shutter gate is disposed between the prescribed transfer gate and the overflow drain. The four or more CCD transfer gates are controlled by four or more phase driving clocks.

Abstract: A long heating pipe is laid along a conveyor pipe and in contact with the outer surface thereof. The heating pipe is provided with an outer tube which has an operating fluid hermetically contained therein, and a steam tube which is inserted through the outer tube. A container is provided to accumulate condensation created as a result of the liquefaction of vapor fed through the steam tube of the heating pipe. This container has a temperature sensing valve located therein. The temperature sensing valve is closed if the condensation within the container more rises in temperature than predetermined, and this valve is opened if the condensation within the container more decreases in temperature than predetermined. This temperature sensing valve is communicatively connected to the downstream side end portion of the steam tube of the heating pipe, which is inserted into the container.

Abstract: In a linear sensor, a charge transfer part is disposed between a one-dimensional array of photodetectors and an overflow drain and includes a CCD having four or more transfer gates for each photodetector for transferring signal charges from the photodetector array in a direction of the photodetector array, transfer gates controlling charge transfer from the photodetectors to the CCD, and shutter gates for controlling charge transfer from the charge transfer part to the overflow drain. Each transfer gate is disposed between each photodetector and a prescribed one of the four or more transfer gates, and each shutter gate is disposed between the prescribed transfer gate and the overflow drain. The four or more CCD transfer gates are controlled by four or more phase driving clocks.

Abstract: Silicone resins containing monorganosiloxane and diorganosiloxane units and exhibiting reproducible values of molecular weight and dispersity are prepared by condensing a mixture of hydrolyzed silanes, adjusting the solids content of the condensed resin and then subjecting the resultant product to a re-equilibration reaction in the presence of an alkali metal compound.

Abstract: The invention provides a method for manufacturing an alkoxy radical-containing silicone resin wherein the molecular weight, viscosity, thermal transition point, and alkoxy radical content can be easily controlled. The method of the instant invention comprises combining under anhydrous conditions, (A) an alkoxysilane represented by the formula R.sup.4.sub.a Si(OR.sup.5).sub.4-a or its partial hydrolysis product wherein R.sup.4 is selected consisting of a monovalent hydrocarbon radical and a monovalent halogenated hydrocarbon radical, R.sup.5 is selected from the group consisting of an alkyl radical containing 1 to 6 carbon atoms, and a has a value of 0 to 3; and (B) an organopolysiloxane or a mixture of organopolysiloxanes selected from the group consisting of organopolysiloxanes that are made of siloxane units selected from the group consisting of R.sup.1 SiO3.sub./2 and R.sup.2 R.sup.3 SiO and mixtures thereof wherein R.sup.1, R.sup.2 and R.sup.

Abstract: A solid state imaging element includes a plurality of photodetectors arranged in a two-dimensional array on a semiconductor substrate, first and second charge transfer circuits for transferring signal charges in a vertical direction and a horizontal direction, respectively, a plurality of transfer gates for controlling charge transfer from the photodetectors to the first charge transfer circuit, a scanner for controlling switching of the transfer gates, a plurality of bus lines connecting the transfer gates with the scanner, and a bus line breakage checking circuit. The bus line breakage checking circuit includes a plurality of transistors connected in series with respective bus lines, a test pad connected with the bus lines through the transistors, and a voltage applying pad for applying a voltage to control switching of the transistors. Therefore, the breakage of a bus line can be detected in a wafer test without actually operating the element, whereby time and money are saved.