Abstract: A memory system includes: a semiconductor storage device including a memory cell array that includes memory cells and a temperature counter configured to increase a count value thereof at a rate that depends on a temperature of the memory cell array; and a memory controller configured to acquire the count value from the semiconductor storage device and reserve a refresh operation for a written memory cell of the memory cell array when a cumulative value of the count value, which is accumulated from when data was written to the memory cell to when the count value is acquired, exceeds a predetermined value.

Abstract: A semiconductor device includes a thermoplastic resin case, a semiconductor chip mounted within the thermoplastic resin case, a metal terminal having a wire bonding surface and an opposing contact surface, and a wire connected between the wire bonding surface and the semiconductor chip. The contact surface of the metal terminal is thermoplastically bonded at an area to the inside of the thermoplastic resin case.

Abstract: A stacked type semiconductor memory device of having a structure in which a plurality of semiconductor chips is stacked and a desired semiconductor chip can be selected by assigning a plurality of chip identification numbers different from each other are individually assigned to the plurality of semiconductor chips comprising: a plurality of operation circuits which is connected in cascade in a stacking order of the plurality of semiconductor chips and outputs the plurality of identification numbers different from each other by performing a predetermined operation; and a plurality of comparison circuits which detects whether or not each the identification number and a chip selection address commonly connected to each the semiconductor chip are equal to each other by comparing them.

Abstract: A semiconductor device includes a thermoplastic resin case, a semiconductor chip mounted within the thermoplastic resin case, a metal terminal having a wire bonding surface and an opposing contact surface, and a wire connected between the wire bonding surface and the semiconductor chip. The contact surface of the metal terminal is thermoplastically bonded at an area to the inside of the thermoplastic resin case.

Abstract: A semiconductor device includes a thermoplastic resin case, a semiconductor chip mounted within the thermoplastic resin case, a metal terminal having a wire bonding surface and an opposing contact surface, and a wire connected between the wire bonding surface and the semiconductor chip. The contact surface of the metal terminal is thermoplastically bonded at an area to the inside of the thermoplastic resin case.

Abstract: A stacked type semiconductor memory device of having a structure in which a plurality of semiconductor chips is stacked and a desired semiconductor chip can be selected by assigning a plurality of chip identification numbers different from each other are individually assigned to the plurality of semiconductor chips comprising: a plurality of operation circuits which is connected in cascade in a stacking order of the plurality of semiconductor chips and outputs the plurality of identification numbers different from each other by performing a predetermined operation; and a plurality of comparison circuits which detects whether or not each the identification number and a chip selection address commonly connected to each the semiconductor chip are equal to each other by comparing them.

Abstract: A stacked type semiconductor memory device of having a structure in which a plurality of semiconductor chips is stacked and a desired semiconductor chip can be selected by assigning a plurality of chip identification numbers different from each other are individually assigned to the plurality of semiconductor chips comprising: a plurality of operation circuits which is connected in cascade in a stacking order of the plurality of semiconductor chips and outputs the plurality of identification numbers different from each other by performing a predetermined operation; and a plurality of comparison circuits which detects whether or not each the identification number and a chip selection address commonly connected to each the semiconductor chip are equal to each other by comparing them.

Abstract: A semiconductor memory device is constituted of a plurality of fuses (or anti-fuses) used for internal voltage adjustment or timing adjustment after manufacturing, a selector for sequentially selecting the fuses, and a single-direction latch circuit for latching a fuse breakdown determination result which is produced by determining whether or not each fuse selected by the selector is broken down and which is varied in a single direction from the low level to the high level or in a single direction from the high level to the low level. The semiconductor memory device allows the fuse breakdown determination to progress with a high reliability by use of a relatively small chip area and to cope with a failure in which one or more fuses are accidentally short-circuited to an unwanted potential.

Abstract: To provide a polyester resin container with a fracturable portion that has improved openability and to provide its production method. In the polyester resin container with a fracturable portion, in which the material of the container is polyester resin, which comprises a mouth portion 20 contiguous to the container body and a fracturable portion 30 located above the mouth portion 20 integrally, which is equipped with a fracturable structure that can be opened by fracturing the boundary part between the opening end 22 of the mouth portion 20 and the fracturable portion 30; a groove 40 is formed approximately perpendicular to the outer surface of the boundary part between the opening end 22 of the mouth portion 20 and the fracturable portion 30 of the container, and the intrinsic viscosity of the polyester resin located at the periphery of the groove 40 is lowered than the intrinsic viscosity of the polyester resin located at a location other than the periphery of the groove 40.

Abstract: An electric power semiconductor device including first and second circuit patterns formed on main surfaces of first and second insulating substrates, respectively, first and second semiconductor chips mounted on the first and second circuit patterns, respectively, a multilayer electrode plate assembly disposed between the first and second insulating substrates, having first, second and third electrode terminals provided with a distance from each other, a first connecting conductor made by wire bonding for connecting the first and second semiconductor chips to the first and second electrode terminals, and a second connecting conductor having an extending portion extended from a part of the third electrode terminal to be connected to the second circuit pattern, and the connection between the extending portion of the third electrode terminal and the second circuit pattern is implemented by a solder.

Abstract: A storage section stores a netlist representing a test object circuit. An extracting section extracts, from the netlist stored in the storage section, a subnetlist representing a periodic circuit which is included in the test object circuit and which outputs a periodic output signal corresponding to a periodic input signal. An analyzing section performs transient analysis of the periodic circuit represented by the subnetlist extracted by the extracting section, for one period of the periodic output signal outputted by the periodic circuit. A simulation section performs transient analysis of the test object circuit represented by the netlist stored in the storage section on the basis of the result of the analysis performed by the analyzing section.

Abstract: A semiconductor device including: an insulating substrate including a ceramic substrate having first and second principal surfaces, a first metallic conductor fixed on the first principal surface, and a second metallic conductor fixed on the second principal surface; a semiconductor element disposed on the first metallic conductor on the first principal surface; and a base plate connected to the second metallic conductor on the second principal surface, and on which the insulating substrate being disposed. The second metallic conductor includes a joint area connected to the second principal surface, and a non-joint area formed around the joint area.

Abstract: In a three-dimensional stacked memory having through electrodes, no optimal layer arrangement, bank arrangement, control methods have been established, and thus optimal methods are desired to be established. A stacked memory includes memory core layers, an interposer, and an IF chip. By stacking memory core layers having the same arrangement, it is possible to cope with both of no-parity operation and parity operation. Further, bank designation irrespective of the number of stacks of the memory core layers can be achieved by assignment of a row address and a bank address. Further, the IF chip has refresh counters for performing a refresh control of the stacked memory. This arrangement provides a stacked memory including stacked memory core layers having through electrodes.

Abstract: A power semiconductor module comprising: a power semiconductor element; a case for receiving the power semiconductor element; a control terminal which is connected to a control electrode of the power semiconductor element, the control terminal is installed in a state of protruding from an upper surface of the case; and a conductive spring which is inserted into the control terminal so that an inner surface of the spring makes contact with at least a part of the side surface of the control terminal, the conductive spring is electrically connected to a printed substrate placed as opposed to the upper surface of the case by making pressurization contact with the printed substrate.

Abstract: An image forming processing circuit and an image forming apparatus having a clock stop function of the invention perform, in an image forming processing process, supply of a clock for processing only in a period in which the clock is required and stop the supply of the clock for processing in a period in which the clock for processing is not required. An ASIC itself realizes a low power consumption function (a clock stop function) without requiring control from a CPU or the like as in the conventional sleep function. Thus, it is possible to effectively reduce power consumption of the ASIC compared with that in the past.

Abstract: The present invention provides a page image managing technique that enables editing of N-in-1-arranged page images. A page image managing apparatus includes: a number-of-pages-information acquiring unit configured to acquire number-of-input-pages information indicating the number of arrayed pages of plural page images arrayed in a reading target original document; an image processing unit configured to slice, on the basis of the number-of-input-pages information acquired by the number-of-pages-information acquiring unit, the plural page images from a read image of the original document and apply image processing corresponding to the number-of-input-pages information acquired by the number-of-pages-information acquiring unit to the respective sliced page images; and a storage control unit configured to cause a predetermined storage area to store the respective plural page images processed by the image processing unit as separate page images.

Abstract: An electric power semiconductor device including first and second circuit patterns formed on main surfaces of first and second insulating substrates, respectively, first and second semiconductor chips mounted on the first and second circuit patterns, respectively, a multilayer electrode plate assembly disposed between the first and second insulating substrates, having first, second and third electrode terminals provided with a distance from each other, a first connecting conductor made by wire bonding for connecting the first and second semiconductor chips to the first and second electrode terminals, and a second connecting conductor having an extending portion extended from a part of the third electrode terminal to be connected to the second circuit pattern, and the connection between the extending portion of the third electrode terminal and the second circuit pattern is implemented by a solder.

Abstract: An electric power semiconductor device including first and second circuit patterns formed on main surfaces of first and second insulating substrates, respectively, first and second semiconductor chips mounted on the first and second circuit patterns, respectively, a multilayer electrode plate assembly disposed between the first and second insulating substrates, having first, second and third electrode terminals provided with a distance from each other, a first connecting conductor made by wire bonding for connecting the first and second semiconductor chips to the first and second electrode terminals, and a second connecting conductor having an extending portion extended from a part of the third electrode terminal to be connected to the second circuit pattern, and the connection between the extending portion of the third electrode terminal and the second circuit pattern is implemented by a solder.

Abstract: A semiconductor memory device is constituted of a plurality of fuses (or anti-fuses) used for internal voltage adjustment or timing adjustment after manufacturing, a selector for sequentially selecting the fuses, and a single-direction latch circuit for latching a fuse breakdown determination result which is produced by determining whether or not each fuse selected by the selector is broken down and which is varied in a single direction from the low level to the high level or in a single direction from the high level to the low level. The semiconductor memory device allows the fuse breakdown determination to progress with a high reliability by use of a relatively small chip area and to cope with a failure in which one or more fuses are accidentally short-circuited to an unwanted potential.

Abstract: A semiconductor device includes a thermoplastic resin case, a semiconductor chip mounted within the thermoplastic resin case, a metal terminal having a wire bonding surface and an opposing contact surface, and a wire connected between the wire bonding surface and the semiconductor chip. The contact surface of the metal terminal is thermoplastically bonded at an area to the inside of the thermoplastic resin case.