Abstract: Processes for producing copy protection for an integrated circuit are provided. To avoid unauthorized copying of an integrated circuit, an effective and reliable copy protection are provided. The process includes the steps of providing a substrate that has semiconductor structures on at least a first side of the substrate, providing a material for coating the substrate, and coating the substrate with a copy-protect layer. In one embodiment, the copy-protect layer is produced by applying a silicate glass by evaporation coating. Thus, an etching process that dissolves the copy-protect layer also attacks the substrate so that the semiconductor structures are at least partially destroyed.

Abstract: A process for joining substrates having electrical, semiconducting, mechanical and/or optical components, and to a composite element is provided. The process is to be suitable for substrates that are to be joined substantially irrespective of material and for sensitive substrates. According to the process, a raised frame, in particular formed from anodically bondable glass, is applied by evaporation coating to one of the two substrates in order to serve as a joining element.

Abstract: A process for producing electrical contact connections for a component integrated in a substrate material is provided, the substrate material having a first surface region, and at least one terminal contact being arranged at least partially in the first surface region for each component, which is distinguished in particular by application of a covering to the first surface region and production of at least one contact passage which, in the substrate material, runs transversely with respect to the first surface region, in which process, in order to form at least one contact location in a second surface region which is to be provided, at least one electrical contact connection from the contact location to at least one of the terminal contacts is produced via the respective contact passages.

Abstract: In order to be able to measure topographies on wafers or devices in a fashion free from destruction, the invention provides a method for measuring three-dimensional topographic structures (22) on wafers (2) or devices in which with the aid of a confocal microscope (1) at least one fluorescing topographic structure (22) is scanned with excitation light, and the fluorescence light emitted from the focal point (17) in the focal plane (19) of the objective (15) and excited by the excitation light is detected, and measured data are obtained from the position of the focal point (17) and the detected fluorescence signal.

Abstract: At least one shielding device, which protects the vacuum chamber walls and/or the components arranged in the chamber from undesired deposits of the layer starting material is arranged in the vacuum chamber of a coating installation according to the invention in which vitreous, glass-ceramic and/or ceramic layers are applied to substrates by deposition from the gas phase. It is important that in the event of temperature changes in the vacuum chamber, the expansion or contraction of the shielding device corresponds to the expansion or contraction of the vitreous, glass-ceramic or ceramic layer or deposits.

Abstract: A process for producing a coated substrate or a product having a coated substrate is provided. The process includes coating at least one metallic surface with a glass, the substrate being coated with an evaporation-coating glass at least on the metallic surface.

Abstract: The invention relates to a cleanroom-capable coating system for PVD or CVD processes having at least one vacuum coating chamber, in which vitreous, glass-ceramic and/or ceramic layers deposited. A first opening of the vacuum coating chamber is connected via a separately evacuable vacuum airlock chamber (load lock) to a cleanroom, the vacuum airlock chamber comprising transport means for delivering substrates into the vacuum coating chamber and for taking substrates out of the vacuum coating chamber, and a second opening of the vacuum coating chamber connects the vacuum coating chamber to a grayroom area separated from the cleanroom.

Abstract: A process produces microelectromechanical components from a substrate that has a first side and a second side which is substantially opposite from the first side, and at least the first side has at least one microelectromechanical element. The process includes the step of providing at least one conductive passage into the substrate, connecting the first side to the second side, and securing at least one support to the first side of the substrate, with the at least one electrically conductive passage uncovered by thinning the substrate material with the mechanical stability being ensured by the support.

Abstract: To improve the radio-frequency properties of radio-frequency substrates or radio-frequency conductor arrangements, the invention proposes a glass material for producing insulation layers for radio-frequency substrates or radio-frequency conductor arrangements, which, as an applied layer, in particular with a layer thickness in the range between 0.05 ?m and 5 mm, has a loss factor tan ? of less than or equal to 70*10?4 in at least a frequency range above 1 GHz.

Abstract: In order to achieve an integration of functional structures into the housing of electronic components, provision is made of a method for producing an electronic component comprising at least one semiconductor element having at least one sensor-technologically active and/or emitting device on at least one side, the method comprising the following steps: provision of at least one die on a wafer, production of at least one patterned support having at least one structure which is functional for the sensor-technologically active and/or emitting device, joining together of the wafer with the at least one support, so that that side of the die which has the sensor-technologically active and/or emitting device faces the support, separation of the die.

Abstract: A method for producing an electronic component is provided. The method includes providing at least one die on a wafer, the at least one die having at least one sensor-technologically active and/or emitting device on at least a first side; producing at least one patterned support having at least one structure which is functional for the at least one sensor-technologically active and/or emitting device; joining the wafer with the at least one patterned support so that the first side faces the at least one patterned support; and separating the at least one die from the wafer.

Abstract: The invention relates to processes for producing copy protection for an integrated circuit. To avoid unauthorized copying of an integrated circuit, it is an object of the invention to provide an effective and reliable copy protection. The invention proposes a process comprising the steps of providing a substrate (1) which has semiconductor structures (2) on at least a first side (1a) of the substrate (1), providing a material (23) for coating the substrate (1), coating the substrate (1) with a copy-protect layer (4). It has proven particularly advantageous for the copy-protect layer (4) to be produced by applying a silicate glass by evaporation coating, since this means that an etching process which dissolves the copy-protect layer also attacks the substrate (1), in such a manner that the semiconductor structures (2) are at least partially destroyed.

Abstract: A process produces microelectromechanical components from a substrate that has a first side and a second side which is substantially opposite from the first side, and at least the first side has at least one microelectromechanical element. The process includes the step of providing at least one conductive passage into the substrate, connecting the first side to the second side, and securing at least one support to the first side of the substrate, with the at least one electrically conductive passage uncovered by thinning the substrate material with the mechanical stability being ensured by the support.

Abstract: A process produces microelectromechanical components from a substrate that has a first side and a second side which is substantially opposite from the first side, and at least the first side has at least one microelectromechanical element. The process includes the step of providing at least one conductive passage into the substrate, connecting the first side to the second side, and securing at least one support to the first side of the substrate, with the at least one electrically conductive passage uncovered by thinning the substrate material with the mechanical stability being ensured by the support.

Abstract: The invention is based on the object of providing a process for producing microstructures in glass or layers similar to glass. For this purpose, an auxiliary substrate (10, 20) having a structured surface (20a). is used, the surface defining a negative mold for the product which is to be produced. Then, a layer (30) of glass or a material similar to glass is applied to the structured surface (20a) of the auxiliary substrate by evaporation coating. Then, the auxiliary substrate is removed, for example by wet-chemical means, in such a way that the positive structure is uncovered. The invention makes it possible to produce excellent micro-channels and optical microstructures, such as micro-lenses.

Abstract: The invention relates to a process for joining substrates having electrical, semiconducting, mechanical and/or optical components, and to a composite element. The process is to be suitable for the substrates which are to be joined substantially irrespective of material and in particular also for sensitive substrates, is to have a high chemical and physical stability and/or is to produce a hermetic cavity. According to the invention, a raised frame, in particular formed from anodically bondable glass, is applied by evaporation coating to one of the two substrates in order to serve as a joining element.

Abstract: The invention provides a process for producing a substrate having a conductor arrangement that is suitable for radio-frequency applications, with improved radio-frequency properties. For this purpose, the process includes the steps of: depositing a structured glass layer having at least one opening over a contact-connection region by evaporation coating on the substrate, and applying at least one conductor structure to the structured glass layer so that the at least one conductor has electrical contact with the contact-connection region.

Abstract: A method for the patterned coating of a substrate with at least one surface is provided. The method is suitable for the rapid and inexpensive production of precise patterns. The method includes the steps of: producing at least one negatively patterned first coating on the at least one surface, depositing at least one second layer, which includes a material with a vitreous structure, on the surface, and at least partially removing the first coating.

Abstract: To encapsulate electronic modules in a manner which is substantially resistant to water diffusion yet is carried out at moderate temperatures below 300° C., preferably below 150° C., the invention provides a process for forming a housing for electronic modules, in particular sensors, integrated circuits and optoelectronic components; comprising the steps of: providing a substrate (1), of which at least a first substrate side (1a) is to be encapsulated, providing a vapor-deposition glass source (20), arranging the first substrate side (1a) in such a manner with respect to the vapor-deposition glass source that the first substrate side (1a) can be vapor-coated; vapor-coating the first substrate side with a glass layer (4).

Abstract: The invention is therefore based on the object of providing a substrate having a metallic surface and a vitreous coating. Accordingly, the invention provides a process for producing a coated substrate or a product having a coated substrate which has at least one metallic surface coated with a glass, the substrate being coated with an evaporation-coating glass at least on the metallic surface.