Patents by Inventor Jwei Liu

Jwei Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070177246
    Abstract: One embodiment provides an anchor to hold getter materials in place within a micromechanical device package substrate, said anchor comprising: a first cavity face; and a second cavity face. The cavity faces define an anchor cavity and mechanically retain a getter away from a region holding the micromechanical device. Another embodiment provides an anchor to hold a getter in place within a micromechanical device package. The anchor comprises: a package substrate; and a member attached to the package substrate, the member shaped to provide mechanical retention of the getter material formed over said member. Another embodiment provides a micromechanical device package comprising: a package substrate; a package lid enclosing a package cavity; a micromechanical device in the package cavity; and a getter anchor in the package cavity. Other embodiments provide methods of packaging and forming packages having a getter anchor. One getter anchor is formed in a substrate 906 comprised of at least three layers.
    Type: Application
    Filed: April 7, 2007
    Publication date: August 2, 2007
    Applicant: Texas Instruments Incorporated
    Inventors: Roger Robbins, Jwei Liu, Jack Smith, Edward Fisher, Joyce Holton
  • Publication number: 20070110947
    Abstract: An improved method for fabricating a window frame/window piece assembly is disclosed in this application. A window frame having an opening in its inner portion is provided. According to one aspect, the window frame can be formed from a unitary piece of sheet metal. A transparent piece is attached to the inner portion of the window frame through a molding process. According to one embodiment, the window frame is placed within a mold such that the inner portion of the window frame projects into an inner cavity inside the mold. After the mold has been closed, a transparent material is injected into the inner cavity so that it bonds with the inner portion of the window frame. After the bond of between the transparent material and the window frame is set, the window frame/window piece assembly is removed from the mold. According to another embodiment, a plurality of window frames may be loaded into a single mold so that a plurality of window frame/window piece assemblies can be fabricated in a single batch.
    Type: Application
    Filed: January 16, 2007
    Publication date: May 17, 2007
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Bradley Haskett, John O'Connor, Jwei Liu
  • Publication number: 20060138642
    Abstract: One embodiment provides an anchor to hold getter materials in place within a micromechanical device package substrate, said anchor comprising: a first cavity face; and a second cavity face. The cavity faces define an anchor cavity and mechanically retain a getter away from a region holding the micromechanical device. Another embodiment provides an anchor to hold a getter in place within a micromechanical device package. The anchor comprises: a package substrate; and a member attached to the package substrate, the member shaped to provide mechanical retention of the getter material formed over said member. Another embodiment provides a micromechanical device package comprising: a package substrate; a package lid enclosing a package cavity; a micromechanical device in the package cavity; and a getter anchor in the package cavity. Other embodiments provide methods of packaging and forming packages having a getter anchor. One getter anchor is formed in a substrate 906 comprised of at least three layers.
    Type: Application
    Filed: January 31, 2006
    Publication date: June 29, 2006
    Inventors: Roger Robbins, Jwei Liu, Jack Smith, Edward Fisher, Joyce Holton
  • Publication number: 20050185252
    Abstract: An improved window frame and window piece for a micromirror assembly is disclosed herein. The window frame includes a stress-relieving contour positioned in the middle of the frame that can absorb the mechanical stresses applied to the window frame from the ceramic base and from the window piece. The window frame may be comprised of a single piece of sheet metal that has been stamped to include a stress-relieving contour. The stress-relieving contour may be comprised of a variety of shapes, including a ā€œUā€ shape, an inverted ā€œUā€ shape, a curved step shape, or other combinations thereof.
    Type: Application
    Filed: April 28, 2005
    Publication date: August 25, 2005
    Inventors: Bradley Haskett, John O'Connor, Steven Smith, Mark Miller, Ivan Kmecko, Jwei Liu, Edward Fisher, Frank Armstrong, Daniel Estabrook, Jeffrey Faris
  • Publication number: 20050158918
    Abstract: A package that resists creation of particles in a package cavity. The package is ideally suited for use with microelectromechanical devices. A package according to one embodiment of the present invention contains a mechanical device (302), for example a micromirror device, attached to the floor (304) of the package substrate (306). Epoxy (308) typically is used to attach the device (302). Electrical connections are provided by bond wires (310) connecting bond pads (312) on the substrate (306) with bond pads on the device (302). A window (314) is attached to the substrate (306) to form a cavity (316) around the device. A thin masking layer (318) on portions of the package cavity surface prevents the surface from generating particles. The thin masking layer (318) may be any material that resists particle generation. Malleable metals are ideal.
    Type: Application
    Filed: March 1, 2005
    Publication date: July 21, 2005
    Inventors: Jwei Liu, John O'Connor