Patents by Inventor K. Reed Gleason
K. Reed Gleason has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9874585Abstract: Resilient electrical interposers that may be utilized to form a plurality of electrical connections between a first device and a second device, as well as systems that may utilize the resilient electrical interposers and methods of use and/or fabrication thereof. The resilient electrical interposers may include a resilient dielectric body with a plurality of electrical conduits contained therein. The plurality of electrical conduits may be configured to provide a plurality of electrical connections between a first surface of the electrical interposer and/or the resilient dielectric body and a second, opposed, surface of the electrical interposer and/or the resilient dielectric body. The systems and methods disclosed herein may provide for improved vertical compliance, improved contact force control, and/or improved dimensional stability of the resilient electrical interposers.Type: GrantFiled: June 30, 2015Date of Patent: January 23, 2018Assignee: Cascade Microtech, Inc.Inventors: Kenneth R. Smith, Mike Jolley, Eric Strid, Peter Hanaway, K. Reed Gleason, Koby L. Duckworth
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Patent number: 9372214Abstract: High frequency interconnect structures, electronic assemblies that utilize high frequency interconnect structures, and methods of operating the same. The high frequency interconnect structures include a plurality of dielectric waveguides and are configured to communicatively connect a plurality of transmitters with a plurality of receivers and to convey a plurality of signals therebetween. The plurality of signals may include a plurality of electromagnetic waves and may have a frequency of at least 200 GHz. The high frequency interconnect structures further may be configured to decrease a potential for crosstalk between a first signal that is conveyed by a first dielectric waveguide of the plurality of dielectric waveguides and a second signal that is conveyed by a second dielectric waveguide of the plurality of dielectric waveguides, such as through control of a passband of the first dielectric waveguide relative to the second dielectric waveguide and/or the use of a crosstalk mitigation structure.Type: GrantFiled: May 31, 2012Date of Patent: June 21, 2016Assignee: Cascade Microtech, Inc.Inventors: Eric W. Strid, Richard L. Campbell, Kenneth R. Smith, K. Reed Gleason, Kooho Jung
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Publication number: 20150301082Abstract: Resilient electrical interposers that may be utilized to form a plurality of electrical connections between a first device and a second device, as well as systems that may utilize the resilient electrical interposers and methods of use and/or fabrication thereof. The resilient electrical interposers may include a resilient dielectric body with a plurality of electrical conduits contained therein. The plurality of electrical conduits may be configured to provide a plurality of electrical connections between a first surface of the electrical interposer and/or the resilient dielectric body and a second, opposed, surface of the electrical interposer and/or the resilient dielectric body. The systems and methods disclosed herein may provide for improved vertical compliance, improved contact force control, and/or improved dimensional stability of the resilient electrical interposers.Type: ApplicationFiled: June 30, 2015Publication date: October 22, 2015Inventors: Kenneth R. Smith, Mike Jolley, Eric Strid, Peter Hanaway, K. Reed Gleason, Koby L. Duckworth
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Patent number: 9099449Abstract: Resilient electrical interposers that may be utilized to form a plurality of electrical connections between a first device and a second device, as well as systems that may utilize the resilient electrical interposers and methods of use and/or fabrication thereof. The resilient electrical interposers may include a resilient dielectric body with a plurality of electrical conduits contained therein. The plurality of electrical conduits may be configured to provide a plurality of electrical connections between a first surface of the electrical interposer and/or the resilient dielectric body and a second, opposed, surface of the electrical interposer and/or the resilient dielectric body. The systems and methods disclosed herein may provide for improved vertical compliance, improved contact force control, and/or improved dimensional stability of the resilient electrical interposers.Type: GrantFiled: January 8, 2015Date of Patent: August 4, 2015Assignee: Cascade Microtech, Inc.Inventors: Kenneth R. Smith, Mike Jolley, Eric Strid, Peter Hanaway, K. Reed Gleason, Koby L. Duckworth
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Publication number: 20150114925Abstract: Resilient electrical interposers that may be utilized to form a plurality of electrical connections between a first device and a second device, as well as systems that may utilize the resilient electrical interposers and methods of use and/or fabrication thereof. The resilient electrical interposers may include a resilient dielectric body with a plurality of electrical conduits contained therein. The plurality of electrical conduits may be configured to provide a plurality of electrical connections between a first surface of the electrical interposer and/or the resilient dielectric body and a second, opposed, surface of the electrical interposer and/or the resilient dielectric body. The systems and methods disclosed herein may provide for improved vertical compliance, improved contact force control, and/or improved dimensional stability of the resilient electrical interposers.Type: ApplicationFiled: January 8, 2015Publication date: April 30, 2015Inventors: Kenneth R. Smith, Mike Jolley, Eric Strid, Peter Hanaway, K. Reed Gleason, Koby L. Duckworth
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Patent number: 8970240Abstract: Resilient electrical interposers that may be utilized to form a plurality of electrical connections between a first device and a second device, as well as systems that may utilize the resilient electrical interposers and methods of use and/or fabrication thereof. The resilient electrical interposers may include a resilient dielectric body with a plurality of electrical conduits contained therein. The plurality of electrical conduits may be configured to provide a plurality of electrical connections between a first surface of the electrical interposer and/or the resilient dielectric body and a second, opposed, surface of the electrical interposer and/or the resilient dielectric body. The systems and methods disclosed herein may provide for improved vertical compliance, improved contact force control, and/or improved dimensional stability of the resilient electrical interposers.Type: GrantFiled: November 2, 2011Date of Patent: March 3, 2015Assignee: Cascade Microtech, Inc.Inventors: Kenneth R. Smith, Mike Jolley, Eric Strid, Peter Hanaway, K. Reed Gleason, Koby L. Duckworth
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Patent number: 8451017Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: GrantFiled: June 18, 2010Date of Patent: May 28, 2013Assignee: Cascade Microtech, Inc.Inventors: K. Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Publication number: 20130015871Abstract: Systems, devices, and methods for two-sided testing of electronic devices. These systems, devices, and methods may include the use of a test fixture that is configured to electrically connect a back side electrical pad of a device under test with an auxiliary pad that faces in a different direction than the back side electrical pad. Additionally or alternatively, these systems, devices, and methods also may include the use of a probe head that is configured to form an electrical connection with both the auxiliary pad and a front side electrical pad of the device under test. The systems, devices, and methods also may include providing a test signal to the device under test, receiving a resultant signal from the device under test, and/or analyzing the resultant signal.Type: ApplicationFiled: July 5, 2012Publication date: January 17, 2013Applicant: Cascade Microtech, Inc.Inventors: Tim Cleary, Peter Hanaway, Eric Strid, David Leslie, Eric Hill, Ken Smith, K. Reed Gleason
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Publication number: 20120306587Abstract: High frequency interconnect structures, electronic assemblies that utilize high frequency interconnect structures, and methods of operating the same. The high frequency interconnect structures include a plurality of dielectric waveguides and are configured to communicatively connect a plurality of transmitters with a plurality of receivers and to convey a plurality of signals therebetween. The plurality of signals may include a plurality of electromagnetic waves and may have a frequency of at least 200 GHz. The high frequency interconnect structures further may be configured to decrease a potential for crosstalk between a first signal that is conveyed by a first dielectric waveguide of the plurality of dielectric waveguides and a second signal that is conveyed by a second dielectric waveguide of the plurality of dielectric waveguides, such as through control of a passband of the first dielectric waveguide relative to the second dielectric waveguide and/or the use of a crosstalk mitigation structure.Type: ApplicationFiled: May 31, 2012Publication date: December 6, 2012Applicant: Cascade Microtech, Inc.Inventors: Eric W. Strid, Richard L. Campbell, Kenneth R. Smith, K. Reed Gleason, Kooho Jung
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Publication number: 20120112779Abstract: Resilient electrical interposers that may be utilized to form a plurality of electrical connections between a first device and a second device, as well as systems that may utilize the resilient electrical interposers and methods of use and/or fabrication thereof. The resilient electrical interposers may include a resilient dielectric body with a plurality of electrical conduits contained therein. The plurality of electrical conduits may be configured to provide a plurality of electrical connections between a first surface of the electrical interposer and/or the resilient dielectric body and a second, opposed, surface of the electrical interposer and/or the resilient dielectric body. The systems and methods disclosed herein may provide for improved vertical compliance, improved contact force control, and/or improved dimensional stability of the resilient electrical interposers.Type: ApplicationFiled: November 2, 2011Publication date: May 10, 2012Applicant: Cascade Microtech, Inc.Inventors: Kenneth R. Smith, Mike Jolley, Eric Strid, Peter Hanaway, K. Reed Gleason, Koby L. Duckworth
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Patent number: 7898273Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.Type: GrantFiled: February 17, 2009Date of Patent: March 1, 2011Assignee: Cascade Microtech, Inc.Inventors: K. Reed Gleason, Tim Lesher, Mike Andrews, John Martin
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Patent number: 7893704Abstract: A membrane probing assembly includes a support element having an incompressible forward support tiltably coupled to a rearward base and a membrane assembly, formed of polyimide layers, with its central region interconnected to the support by an elastomeric layer. Flexible traces form data/signal lines to contacts on the central region. Each contact comprises a rigid beam and a bump located in off-centered location on the beam, which bump includes a contacting portion. After initial touchdown of these contacting portions, further over-travel of the pads causes each beam to independently tilt locally so that different portions of each beam move different distances relative to the support thus driving each contact into lateral scrubbing movement across the pad thereby clearing away oxide buildup. The elastomeric member backed by the incompressible support ensures sufficient scrub pressure and reliable tilt recovery of each contact without mechanical straining of the beam.Type: GrantFiled: March 20, 2009Date of Patent: February 22, 2011Assignee: Cascade Microtech, Inc.Inventors: K. Reed Gleason, Kenneth R. Smith, Mike Bayne
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Publication number: 20100253377Abstract: A probe suitable for probing a semiconductor wafer that includes an active circuit. The probe may include a flexible interconnection between the active circuit and a support structure. The probe may impose a relatively low capacitance on the device under test.Type: ApplicationFiled: June 16, 2010Publication date: October 7, 2010Applicant: Cascade Microtech, Inc.Inventors: Eric Strid, K. Reed Gleason
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Patent number: 7759953Abstract: A probe suitable for probing a semiconductor wafer that includes an active circuit. The probe may include a flexible interconnection between the active circuit and a support structure. The probe may impose a relatively low capacitance on the device under test.Type: GrantFiled: August 14, 2008Date of Patent: July 20, 2010Assignee: Cascade Microtech, Inc.Inventors: Eric Strid, K. Reed Gleason
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Patent number: 7618590Abstract: A fluid dispensing apparatus and system for facilitating dispensing small volume, fluid samples to microfluidic devices.Type: GrantFiled: June 26, 2006Date of Patent: November 17, 2009Assignee: Cascade Microtech, Inc.Inventors: K. Reed Gleason, Peter Navratil, John Martin, John Dunklee, Cali Sartor, Thane Allison
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Publication number: 20090267625Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.Type: ApplicationFiled: February 17, 2009Publication date: October 29, 2009Inventors: K. Reed Gleason, Tim Lesher, Mike Andrews, John Martin
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Publication number: 20090224783Abstract: A membrane probing assembly includes a support element having an incompressible forward support tiltably coupled to a rearward base and a membrane assembly, formed of polyimide layers, with its central region interconnected to the support by an elastomeric layer. Flexible traces form data/signal lines to contacts on the central region. Each contact comprises a rigid beam and a bump located in off-centered location on the beam, which bump includes a contacting portion. After initial touchdown of these contacting portions, further over-travel of the pads causes each beam to independently tilt locally so that different portions of each beam move different distances relative to the support thus driving each contact into lateral scrubbing movement across the pad thereby clearing away oxide buildup. The elastomeric member backed by the incompressible support ensures sufficient scrub pressure and reliable tilt recovery of each contact without mechanical straining of the beam.Type: ApplicationFiled: March 20, 2009Publication date: September 10, 2009Inventors: K. Reed Gleason, Kenneth R. Smith, Mike Bayne
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Patent number: 7550983Abstract: A membrane probing assembly includes a support element having an incompressible forward support tiltably coupled to a rearward base and a membrane assembly, formed of polyimide layers, with its central region interconnected to the support by an elastomeric layer. Flexible traces form data/signal lines to contacts on the central region. Each contact comprises a rigid beam and a bump located in off-centered location on the beam, which bump includes a contacting portion. After initial touchdown of these contacting portions, further over-travel of the pads causes each beam to independently tilt locally so that different portions of each beam move different distances relative to the support thus driving each contact into lateral scrubbing movement across the pad thereby clearing away oxide buildup. The elastomeric member backed by the incompressible support ensures sufficient scrub pressure and reliable tilt recovery of each contact without mechanical straining of the beam.Type: GrantFiled: May 25, 2006Date of Patent: June 23, 2009Assignee: Cascade Microtech, Inc.Inventors: K. Reed Gleason, Kenneth R. Smith, Mike Bayne
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Patent number: 7541821Abstract: A membrane probing assembly includes a support element having an incompressible forward support tiltably coupled to a rearward base and a membrane assembly, formed of polyimide layers, with its central region interconnected to the support by an elastomeric layer. Flexible traces form data/signal lines to contacts on the central region. Each contact comprises a rigid beam and a bump located in off-centered location on the beam, which bump includes a contacting portion. After initial touchdown of these contacting portions, further over-travel of the pads causes each beam to independently tilt locally so that different portions of each beam move different distances relative to the support thus driving each contact into lateral scrubbing movement across the pad thereby clearing away oxide buildup. The elastomeric member backed by the incompressible support ensures sufficient scrub pressure and reliable tilt recovery of each contact without mechanical straining of the beam.Type: GrantFiled: August 29, 2007Date of Patent: June 2, 2009Assignee: Cascade Microtech, Inc.Inventors: K. Reed Gleason, Kenneth R. Smith, Mike Bayne
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Patent number: 7518387Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.Type: GrantFiled: September 27, 2007Date of Patent: April 14, 2009Assignee: Cascade Microtech, Inc.Inventors: K. Reed Gleason, Tim Lesher, Eric W. Strid, Mike Andrews, John Martin, John Dunklee, Leonard Hayden, Amr M. E. Safwat