Patents by Inventor K. Reed Gleason
K. Reed Gleason has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7501842Abstract: A probe for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies may include a dielectric substrate that supports a signal path interconnecting test instrumentation and a probe tip and a ground path that shields both the signal path and the probe tip.Type: GrantFiled: October 19, 2007Date of Patent: March 10, 2009Assignee: Cascade Microtech, Inc.Inventors: K. Reed Gleason, Tim Lesher, Mike Andrews, John Martin
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Patent number: 7498829Abstract: A probe for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies may include a dielectric substrate that supports a signal path interconnecting test instrumentation and a probe tip and a ground path that shields both the signal path and the probe tip.Type: GrantFiled: October 19, 2007Date of Patent: March 3, 2009Assignee: Cascade Microtech, Inc.Inventors: K. Reed Gleason, Tim Lesher, Mike Andrews, John Martin
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Patent number: 7489149Abstract: A probe for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies may include a dielectric substrate that supports a signal path interconnecting test instrumentation and a probe tip and a ground path that shields both the signal oath and the probe tip.Type: GrantFiled: October 24, 2007Date of Patent: February 10, 2009Assignee: Cascade Microtech, Inc.Inventors: K. Reed Gleason, Tim Lesher, Eric W. Strid, Mike Andrews, John Martin, John Dunklee, Leonard Hayden, Amr M. E. Safwat
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Patent number: 7482823Abstract: A probe for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies may include a dielectric substrate that supports a signal path interconnecting test instrumentation and a probe tip and a ground path that shields both the signal path and the probe tip.Type: GrantFiled: October 24, 2007Date of Patent: January 27, 2009Assignee: Cascade Microtech, Inc.Inventors: K. Reed Gleason, Tim Lesher, Eric W. Strid, Mike Andrews, John Martin, John Dunklee, Leonard Hayden, Amr M. E. Safwat
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Publication number: 20080309358Abstract: A probe suitable for probing a semiconductor wafer that includes an active circuit. The probe may include a flexible interconnection between the active circuit and a support structure. The probe may impose a relatively low capacitance on the device under test.Type: ApplicationFiled: August 14, 2008Publication date: December 18, 2008Inventors: Eric Strid, K. Reed Gleason
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Patent number: 7436194Abstract: A probe measurement system having low, stable contact resistance for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.Type: GrantFiled: October 24, 2007Date of Patent: October 14, 2008Assignee: Cascade Microtech, Inc.Inventors: K. Reed Gleason, Tim Lesher, Eric W. Strid, Mike Andrews, John Martin, John Dunklee, Leonard Hayden, Amr M. E. Safwat
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Patent number: 7427868Abstract: A probe suitable for probing a semiconductor wafer that includes an active circuit. The probe may have a rigid probing member and include a flexible interconnection between the active circuit and a support structure. The active circuit may have a relatively low capacitance as seen by the device under test.Type: GrantFiled: December 21, 2004Date of Patent: September 23, 2008Assignee: Cascade Microtech, Inc.Inventors: Eric Strid, K. Reed Gleason
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Patent number: 7394269Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.Type: GrantFiled: August 3, 2007Date of Patent: July 1, 2008Assignee: Cascade Microtech, Inc.Inventors: K. Reed Gleason, Tim Lesher, Mike Andrews, John Martin
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Patent number: 7321233Abstract: An interconnect assembly for evaluating a probe measurement network includes a base, respective inner and outer probing areas in mutually coplanar relationship on the upper face of the base, a reference junction, and a high-frequency transmission structure connecting the probing areas and the reference junction so that high-frequency signals can be uniformly transferred therebetween. A preferred method for evaluating the signal channels of the network includes connecting a reference unit to the reference junction and successively positioning each device-probing end that corresponds to a signal channel of interest on the inner probing area.Type: GrantFiled: January 11, 2007Date of Patent: January 22, 2008Assignee: Cascade Microtech, Inc.Inventors: Eric W. Strid, Jerry B. Schappacher, Dale E. Carlton, K. Reed Gleason
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Patent number: 7304488Abstract: A shielded probe for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies. The probe may include a probe tip that extends through a dielectric substrate that supports on a first surface a signal path to test instrumentation and on a second surface a ground path that shields both the signal path and the probe tip.Type: GrantFiled: December 1, 2006Date of Patent: December 4, 2007Assignee: Cascade Microtech, Inc.Inventors: K. Reed Gleason, Tim Lesher, Eric W. Strid, Mike Andrews, John Martin, John Dunklee, Leonard Hayden, Amr M. E. Safwat
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Patent number: 7271603Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies. The probe measurement system preferably includes a probe having a conductive path extending between the first and second surfaces of a membrane and a probe contact electrically connected to the conductive path.Type: GrantFiled: March 28, 2006Date of Patent: September 18, 2007Assignee: Cascade Microtech, Inc.Inventors: K. Reed Gleason, Tim Lesher, Mike Andrews, John Martin
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Patent number: 7164279Abstract: An interconnect assembly for evaluating a probe measurement network includes a base, respective inner and outer probing areas in mutually coplanar relationship on the upper face of the base, a reference junction, and a high-frequency transmission structure connecting the probing areas and the reference junction so that high-frequency signals can be uniformly transferred therebetween. A preferred method for evaluating the signal channels of the network includes connecting a reference unit to the reference junction and successively positioning each device-probing end that corresponds to a signal channel of interest on the inner probing area.Type: GrantFiled: December 9, 2005Date of Patent: January 16, 2007Assignee: Cascade Microtech, Inc.Inventors: Eric W. Strid, Jerry B. Schappacher, Dale E. Carlton, K. Reed Gleason
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Patent number: 7161363Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.Type: GrantFiled: May 18, 2004Date of Patent: January 9, 2007Assignee: Cascade Microtech, Inc.Inventors: K. Reed Gleason, Tim Lesher, Eric W. Strid, Mike Andrews, John Martin, John Dunklee, Leonard Hayden, Amr M. E. Safwat
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Patent number: 7109731Abstract: A membrane probing assembly includes a support element having an incompressible forward support tiltably coupled to a rearward base and a membrane assembly, formed of polyimide layers, with its central region interconnected to the support by an elastomeric layer. Flexible traces form data/signal lines to contacts on the central region. Each contact comprises a rigid beam and a bump located in off-centered location on the beam, which bump includes a contacting portion. After initial touchdown of these contacting portions, further over-travel of the pads causes each beam to independently tilt locally so that different portions of each beam move different distances relative to the support thus driving each contact into lateral scrubbing movement across the pad thereby clearing away oxide buildup. The elastomeric member backed by the incompressible support ensures sufficient scrub pressure and reliable tilt recovery of each contact without mechanical straining of the beam.Type: GrantFiled: June 17, 2005Date of Patent: September 19, 2006Assignee: Cascade Microtech, Inc.Inventors: K. Reed Gleason, Kenneth R. Smith, Mike Bayne
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Patent number: 7057404Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies. The probe measurement system preferably includes a probe having a conductive path between the first and second sides of a substrate and a probe contact electrically connected to the conductive path.Type: GrantFiled: May 23, 2003Date of Patent: June 6, 2006Assignee: Sharp Laboratories of America, Inc.Inventors: K. Reed Gleason, Tim Lesher, Mike Andrews, John Martin
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Patent number: 6987398Abstract: An interconnect assembly for evaluating a probe measurement network includes a base, respective inner and outer probing areas in mutually coplanar relationship on the upper face of the base, a reference junction, and a high-frequency transmission structure connecting the probing areas and the reference junction so that high-frequency signals can be uniformly transferred therebetween. A preferred method for evaluating the signal channels of the network includes connecting a reference unit to the reference junction and successively positioning each device-probing end that corresponds to a signal channel of interest on the inner probing area.Type: GrantFiled: September 28, 2004Date of Patent: January 17, 2006Assignee: Cascade Microtech, Inc.Inventors: Eric W. Strid, Jerry B. Schappacher, Dale E. Carlton, K. Reed Gleason
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Patent number: 6927585Abstract: A membrane probing assembly includes a support element having an incompressible forward support tiltably coupled to a rearward base and a membrane assembly, formed of polyimide layers, with its central region interconnected to the support by an elastomeric layer. Flexible traces form data/signal lines to contacts on the central region. Each contact comprises a rigid beam and a bump located in off-centered location on the beam, which bump includes a contacting portion. After initial touchdown of these contacting portions, further over-travel of the pads causes each beam to independently tilt locally so that different portions of each beam move different distances relative to the support thus driving each contact into lateral scrubbing movement across the pad thereby clearing away oxide buildup. The elastomeric member backed by the incompressible support ensures sufficient scrub pressure and reliable tilt recovery of each contact without mechanical straining of the beam.Type: GrantFiled: May 20, 2002Date of Patent: August 9, 2005Assignee: Cascade Microtech, Inc.Inventors: K. Reed Gleason, Kenneth R. Smith, Mike Bayne
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Publication number: 20040232927Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.Type: ApplicationFiled: May 18, 2004Publication date: November 25, 2004Inventors: K. Reed Gleason, Tim Lesher, Eric W. Strid, Mike Andrews, John Martin, John Dunklee, Leonard Hayden, Amr M. E. Safwat
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Patent number: 6815963Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.Type: GrantFiled: May 23, 2003Date of Patent: November 9, 2004Assignee: Cascade Microtech, Inc.Inventors: K. Reed Gleason, Tim Lesher, Eric W. Strid, Mike Andrews, John Martin, John Dunklee, Leonard Hayden, Amr M. E. Safwat
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Patent number: 6803779Abstract: An interconnect assembly for evaluating a probe measurement network includes a base, respective inner and outer probing areas in mutually coplanar relationship on the upper face of the base, a reference junction, and a high-frequency transmission structure connecting the probing areas and the reference junction so that high-frequency signals can be uniformly transferred therebetween despite, for example, variable positioning of the device-probing ends of the network on the probing areas. A preferred method for evaluating the signal channels of the network includes connecting a reference unit to the reference junction and successively positioning each device-probing end that corresponds to a signal channel of interest on the inner probing area.Type: GrantFiled: June 11, 2003Date of Patent: October 12, 2004Assignee: Cascade Microtech, Inc.Inventors: Eric W. Strid, Jerry B. Schappacher, Dale E. Carlton, K. Reed Gleason