Patents by Inventor Kae Dong Back
Kae Dong Back has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20130253271Abstract: Disclosed is an endoscope having a rotating device to axially rotate a bending member. The endoscope includes a flexible member which is freely bendable upon receiving external force, a bending member provided at a front end of the flexible member, the bending member being bendable with one degree of freedom, a rotating device rotatably coupled to the flexible member in an axial direction of the flexible member and serving to rotate the bending member in the axial direction, and an operating unit connected to the rotating device and having a rotation operation unit to rotate the rotating device.Type: ApplicationFiled: November 2, 2011Publication date: September 26, 2013Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hee Moon Jeong, Jin Ho Lee, Kae Dong Back
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Patent number: 8051561Abstract: A method of manufacturing an image drum includes fixing a control circuit board inside the drum body so that a plurality of terminals of the control circuit board are located in the slot formed longitudinally on the drum body, forming an insulation layer to the entire external surface of the drum body, forming connection parts by removing parts of the insulation layer where the terminals of the control circuit board are formed, forming electrode forming grooves including the insulation layer as a base on the external surface of the drum body comprising the connection parts thereon, and forming a plurality of ring electrodes to be connected to respective terminals among the plurality of the terminals, respectively, through the connection parts.Type: GrantFiled: June 5, 2008Date of Patent: November 8, 2011Assignees: Samsung Electronics Co., Ltd., Samsung Electro-Mechanics Co., Ltd.Inventors: Eung-yeoul Yoon, Kae-dong Back, Kyu-ho Shin, Jin-seung Choi
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Patent number: 7926177Abstract: A method of forming a hydrophobic coating layer on a surface of a nozzle plate of an inkjet printhead includes forming a plurality of nozzles in the nozzle plate, each of the nozzles having an exit, stacking a film on the surface of the nozzle plate to cover the exit of each of the nozzles, forming a predetermined metal layer on an inner wall of each of the nozzles and an inner surface of the film covering the exit of each of the nozzles using a plating method, removing the film from the surface of the nozzle plate, forming a hydrophobic coating layer on the surface of the nozzle plate to cover the metal layer exposed through the exit of each of the nozzles, and removing the metal layer formed on the inner wall of each of the nozzles and the hydrophobic coating layer formed on the surface of the metal layer.Type: GrantFiled: June 20, 2006Date of Patent: April 19, 2011Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Sung-gyu Kang, Kae-dong Back, Seung-mo Lim, Jae-woo Chung
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Publication number: 20110058852Abstract: A charging device and an electrophotographic image forming apparatus including the same. A charging electrode of the charging device includes a porous insulating layer including a plurality of hollow rods vertically formed on a substrate formed of a conductive material, and a conductive nano structure formed in the hollow rods of the porous insulating layer. A grid electrode is supported by a spacer and is separated from the nano structure of the charging electrode. Furthermore, the charging electrode of the charging device may include a plurality of protrusions formed on a substrate, a porous insulating layer formed on the plurality of protrusions, and a conductive nano structure formed in hollow rods of the porous insulating layer.Type: ApplicationFiled: September 7, 2010Publication date: March 10, 2011Applicant: Samsung Electronics Co., LtdInventors: Hee-moon Jeong, Kae-dong Back, Jin-ho Lee
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Publication number: 20110049095Abstract: A method of forming a hydrophobic coating layer on a surface of a nozzle plate of an inkjet printhead includes forming a plurality of nozzles in the nozzle plate, each of the nozzles having an exit, stacking a film on the surface of the nozzle plate to cover the exit of each of the nozzles, forming a predetermined metal layer on an inner wall of each of the nozzles and an inner surface of the film covering the exit of each of the nozzles using a plating method, removing the film from the surface of the nozzle plate, forming a hydrophobic coating layer on the surface of the nozzle plate to cover the metal layer exposed through the exit of each of the nozzles, and removing the metal layer formed on the inner wall of each of the nozzles and the hydrophobic coating layer formed on the surface of the metal layer.Type: ApplicationFiled: November 8, 2010Publication date: March 3, 2011Applicant: Samsung Electronics Co., LtdInventors: Sung-gyu Kang, Kae-dong Back, Seung-mo Lim, Jae-Woo Chung
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Patent number: 7828707Abstract: An image drum for selectively adsorbing toner in a printing apparatus is provided. A method and a configuration of ring electrodes formed on an outside of a drum body is also provided. That is, a control board is mounted inside the drum body, of which a plurality of terminals is externally exposed in the cylindrical drum body, and a photocurable resin is coated on the circumferential surface. Ring electrodes are then formed on circumferential surface of the drum body, by rotating the drum body and allowing an ultraviolet ray through the mask pattern onto the drum body to harden the liquid photocurable resin after contacting a mask-patterned mold mask to the circumferential surface of the drum body.Type: GrantFiled: September 13, 2006Date of Patent: November 9, 2010Assignee: Samsung Electronics Co., Ltd.Inventors: Chang Seung Lee, Kwang Choon Ro, Kae Dong Back, Kyu Ho Shin, Jong Kwang Kim, Won Kyoung Choi, Ki Deok Bae, Soon Cheol Kweon
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Patent number: 7794799Abstract: A method for manufacturing an array plate for biomolecules includes coating a surface of a substrate with a hydrophobic material to form a hydrophobic layer having initial hydrophobic properties, etching the hydrophobic layer through an etch mask placed thereon to form a hydrophilic binding site, removing the etch mask, and processing the remaining region of the hydrophobic layer to recover the initial hydrophobic properties. A method for manufacturing a biochip using this array plate, includes processing the surface of the hydrophilic binding site of the array plate to increase an affinity of biomolecules to the hydrophilic binding site, and applying a solution containing biomolecules to the surface of the hydrophilic binding site.Type: GrantFiled: May 15, 2003Date of Patent: September 14, 2010Assignee: Samsung Electronics Co., Ltd.Inventors: Woon-bae Kim, Chang-ho Cho, Kae-dong Back, Hwan-young Choi
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Patent number: 7786573Abstract: A packaging chip formed with plural wafers. The packaging chip includes plural wafers stacked in order and plural interconnection electrodes directly connecting the plural wafers from an upper surface of an uppermost wafer of the plural wafers to the other wafers. At least one or more of the plural wafers mounts a predetermined circuit device thereon. Further, at least one or more wafers of the plural wafers have a cavity of a predetermined size. Meanwhile, the packaging chip further includes plural pads independently arranged on the upper surface of the uppermost wafer one another and electrically connected to the plural interconnection electrodes respectively. Accordingly, the present invention can enhance the performance and reliability of a packaging chip and improve fabrication yield.Type: GrantFiled: July 6, 2006Date of Patent: August 31, 2010Assignee: Samsung Electronics Co., Ltd.Inventors: Min-seog Choi, Kae-dong Back, In-sang Song, Woon-bae Kim, Byung-gil Jeong, Kyu-dong Jung
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Patent number: 7784177Abstract: An image drum manufacturing method including: providing a hollow cylindrical mold having a plurality of mold grooves circumferentially cut in its inner circumferential surface and a core portion having a smaller diameter than a hollow of the mold and having a slit-shaped combination groove; filling a conductive material into the mold grooves of the mold; inserting a control unit for individually applying a voltage to each terminal in the combination groove of the core portion, so that a conductive pattern corresponding to the conductive material is partially exposed; inserting the core portion into the mold so that the conductive pattern corresponds to the conductive material filled into each mold groove; and forming a drum body to be integrally formed with the control unit and the conductive material by filling a molten plastic into a space between the mold and the core portion.Type: GrantFiled: June 6, 2006Date of Patent: August 31, 2010Assignee: Samsung Electronics Co., Ltd.Inventors: Kae Dong Back, Ki Deok Bae, Chang Youl Moon, Kyu Ho Shin, Soon Cheol Kweon, Won Kyoung Choi, Chang Seung Lee
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Publication number: 20100020153Abstract: Provided are an image drum and a method of manufacturing the image drum. The image drum includes multiple ring electrodes arranged along a longitudinal direction of a drum body and on an outer circumferential surface of the drum body. The ring electrodes are separated from each other. Between the ring electrodes there are ring insulator molds. The image drum can be manufactured by patterning a seed layer on the outer surface of the drum body, forming multiple ring insulator molds on the seed layer, and depositing a conductive material between the ring insulator molds to form the ring electrodes.Type: ApplicationFiled: May 8, 2009Publication date: January 28, 2010Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: EUNG-YEOUL YOON, Kae-Dong Back, Jin-Seung Choi
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Patent number: 7625693Abstract: A method of fabricating a one-way transparent optical system by which external light is effectively intercepted and internal light passes nearly without loss is provided. The method includes: forming a silver halide on a transparent substrate; aligning a mask in which a predetermined pattern is formed, on the transparent substrate and exposing the silver halide using the mask; developing and fixing the exposed silver halide and forming a plurality of light-absorbing materials on the transparent substrate; and forming protrusion structures having a shape of a convex lens shape for refracting incident light toward a corresponding light-absorbing material of the light-absorbing materials, on the transparent substrate on which the light-absorbing materials are formed.Type: GrantFiled: December 7, 2005Date of Patent: December 1, 2009Assignee: Samsung Electronics Co., Ltd.Inventors: O-gweon Seo, Kae-dong Back, Chang-seung Lee, Kyu-sik Kim, Duck-su Kim, Byoung-ho Cheong
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Patent number: 7579685Abstract: A wafer level packaging cap and method thereof for a wafer level packaging are provided. The wafer level packaging cap covering a device wafer with a device thereon, includes a cap wafer having on a bottom surface a cavity providing a space for receiving the device, and integrally combined with the device wafer, a plurality of metal lines formed on the bottom surface of the cap wafer to correspond to a plurality of device pads formed on the device wafer to be electrically connected to the device, a plurality of buffer portions connected to the plurality of metal lines and comprising a buffer wafer with a plurality of grooves and a metal filled in the plurality of grooves, a plurality of connection rods electrically connected to the plurality of buffer portions and penetrating the cap wafer from a top portion of the buffer portion, and a plurality of cap pads formed on a top surface of the cap wafer and electrically connected to a plurality of connection rods.Type: GrantFiled: January 26, 2006Date of Patent: August 25, 2009Assignee: Samsung Electronics Co., Ltd.Inventors: Moon-chul Lee, Woon-bae Kim, Kae-dong Back, Qian Wang, Jun-sik Hwang, Kyu-dong Jung
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Publication number: 20090119917Abstract: A method of manufacturing an image drum includes fixing a control circuit board inside the drum body using a fixing member so that a plurality of terminals of the control circuit board are located in the slot formed longitudinally on the drum body, forming an insulation layer by applying a sensitizer to the entire external surface of the drum body, forming connection parts by removing parts of the insulation layer where the terminals of the control circuit board are formed using photolithography processing, forming electrode forming grooves including the insulation layer as a base on the external surface of the drum body comprising the connection parts thereon, and forming a plurality of ring electrodes to be connected to respective terminals among the plurality of the terminals, respectively, through the connection parts by applying a fluent conductive substance to the external surface of the drum body comprising the electrode forming grooves thereon, and by filling the electrode forming grooves with the fluType: ApplicationFiled: June 5, 2008Publication date: May 14, 2009Applicants: Samsung Electronics Co., Ltd., Samsung Electro-Mechanics Co., Ltd.Inventors: Eung-yeoul YOON, Kae-dong BACK, Kyu-ho SHIN, Jin-seung CHOI
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Patent number: 7510968Abstract: A cap for a semiconductor device package, including a body formed at a predetermined thickness with a cavity. The cap further includes a first seed layer formed on an inner circumference of a first via hole formed at a predetermined depth from the cavity formation surface of the body, a second seed layer formed on an inner circumference of a second via hole formed at a predetermined depth from the opposite surface to the cavity formation surface of the body, and plating materials filled in the first via hole and the second via hole.Type: GrantFiled: April 28, 2006Date of Patent: March 31, 2009Assignee: Samsung Electronics Co., Ltd.Inventors: Moon-chul Lee, Jong-oh Kwon, Kae-dong Back, Qian Wang, Jun-sik Hwang, Kyu-dong Jung
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Patent number: 7489327Abstract: An image forming apparatus that may be easily and inexpensively manufactured is provided. The image forming apparatus includes: a toner supply unit; an image forming element to which toner is adsorbed from the toner supply unit; an image developing unit disposed on an outer side of the image forming element, wherein said image developing unit selectively separates from the image forming element at least a part of the toner adsorbed to the image forming element in order to develop an image on the image forming element; and a toner return unit which returns the toner separated from the image forming element by the image developing unit to the toner supply unit.Type: GrantFiled: June 22, 2006Date of Patent: February 10, 2009Assignee: Samsung Electronics Co., Ltd.Inventors: Soon Cheol Kweon, Kyu Ho Shin, Kae Dong Back, Chang Youl Moon, Ki Deok Bae, Won Kyoung Choi, Chang Seung Lee
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Publication number: 20080156651Abstract: Provided are a method of forming a phase change layer, a method of manufacturing a storage node using the method of forming a phase change layer, and a method of manufacturing a phase change memory device using the method of manufacturing a storage node. The method of forming a phase change layer may use an electrochemical deposition (ECD) method. The method of forming the phase change layer may include forming an electrolyte by mixing a solvent and precursors, each precursor containing an element of the phase change layer, dipping an anode plate and a cathode plate in the electrolyte to be spaced apart from each other, wherein the cathode plate may be a substrate on which the phase change layer is to be deposited, setting deposition conditions of the phase change layer; and supplying a voltage between the anode plate and the cathode plate.Type: ApplicationFiled: December 12, 2007Publication date: July 3, 2008Inventors: Youn-seon Kang, Kae-dong Back, Woong-chul Shin, Seung-jin Oh
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Publication number: 20080136889Abstract: An image forming element and its manufacturing apparatus and method are disclosed, in which manufacturing process steps can be simplified to reduce the cost and improve productivity. The manufacturing method of an image forming element includes respectively providing a mold and an image drum, forming line shaped conductive paste patterns on the mold, and transferring the conductive paste patterns from the mold onto the image drum.Type: ApplicationFiled: April 13, 2007Publication date: June 12, 2008Applicant: SAMSUNG ELECTRONICS CO., LTDInventors: Eung-Yeoul Yoon, Kae Dong Back, Kyu Ho Shin, Jin Seung Choi, Soon Cheol Kweon, Su Ho Shin, Ki Hwan Kwon, Chang Youl Moon
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Publication number: 20070144009Abstract: An image drum for selectively adsorbing toner in a printing apparatus is provided. A method and a configuration of ring electrodes formed on an outside of a drum body is also provided. That is, a control board is mounted inside the drum body, of which a plurality of terminals is externally exposed in the cylindrical drum body, and a photocurable resin is coated on the circumferential surface. Ring electrodes are then formed on circumferential surface of the drum body, by rotating the drum body and allowing an ultraviolet ray through the mask pattern onto the drum body to harden the liquid photocurable resin after contacting a mask-patterned mold mask to the circumferential surface of the drum body.Type: ApplicationFiled: September 13, 2006Publication date: June 28, 2007Inventors: Chang Seung Lee, Kwang Choon Ro, Kae Dong Back, Kyu Ho Shin, Jong Kwang Kim, Won Kyoung Choi, Ki Deok Bae, Soon Cheol Kweon
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Publication number: 20070137776Abstract: An image drum manufacturing method including: providing a hollow cylindrical mold having a plurality of mold grooves circumferentially cut in its inner circumferential surface and a core portion having a smaller diameter than a hollow of the mold and having a slit-shaped combination groove; filling a conductive material into the mold grooves of the mold; inserting a control unit for individually applying a voltage to each terminal in the combination groove of the core portion, so that a conductive pattern corresponding to the conductive material is partially exposed; inserting the core portion into the mold so that the conductive pattern corresponds to the conductive material filled into each mold groove; and forming a drum body to be integrally formed with the control unit and the conductive material by filling a molten plastic into a space between the mold and the core portion.Type: ApplicationFiled: June 6, 2006Publication date: June 21, 2007Inventors: Kae Dong Back, Ki Deok Bae, Chang Youl Moon, Kyu Ho Shin, Soon Cheol Kweon, Won Kyoung Choi, Chang Seung Lee
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Publication number: 20070120889Abstract: A method of forming a hydrophobic coating layer on a surface of a nozzle plate of an inkjet printhead includes forming a plurality of nozzles in the nozzle plate, each of the nozzles having an exit, stacking a film on the surface of the nozzle plate to cover the exit of each of the nozzles, forming a predetermined metal layer on an inner wall of each of the nozzles and an inner surface of the film covering the exit of each of the nozzles using a plating method, removing the film from the surface of the nozzle plate, forming a hydrophobic coating layer on the surface of the nozzle plate to cover the metal layer exposed through the exit of each of the nozzles, and removing the metal layer formed on the inner wall of each of the nozzles and the hydrophobic coating layer formed on the surface of the metal layer.Type: ApplicationFiled: June 20, 2006Publication date: May 31, 2007Inventors: Sung-gyu KANG, Kae-dong Back, Seung-mo Lim, Jae-woo Chung