Patents by Inventor Kae Dong Back

Kae Dong Back has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130253271
    Abstract: Disclosed is an endoscope having a rotating device to axially rotate a bending member. The endoscope includes a flexible member which is freely bendable upon receiving external force, a bending member provided at a front end of the flexible member, the bending member being bendable with one degree of freedom, a rotating device rotatably coupled to the flexible member in an axial direction of the flexible member and serving to rotate the bending member in the axial direction, and an operating unit connected to the rotating device and having a rotation operation unit to rotate the rotating device.
    Type: Application
    Filed: November 2, 2011
    Publication date: September 26, 2013
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hee Moon Jeong, Jin Ho Lee, Kae Dong Back
  • Patent number: 8051561
    Abstract: A method of manufacturing an image drum includes fixing a control circuit board inside the drum body so that a plurality of terminals of the control circuit board are located in the slot formed longitudinally on the drum body, forming an insulation layer to the entire external surface of the drum body, forming connection parts by removing parts of the insulation layer where the terminals of the control circuit board are formed, forming electrode forming grooves including the insulation layer as a base on the external surface of the drum body comprising the connection parts thereon, and forming a plurality of ring electrodes to be connected to respective terminals among the plurality of the terminals, respectively, through the connection parts.
    Type: Grant
    Filed: June 5, 2008
    Date of Patent: November 8, 2011
    Assignees: Samsung Electronics Co., Ltd., Samsung Electro-Mechanics Co., Ltd.
    Inventors: Eung-yeoul Yoon, Kae-dong Back, Kyu-ho Shin, Jin-seung Choi
  • Patent number: 7926177
    Abstract: A method of forming a hydrophobic coating layer on a surface of a nozzle plate of an inkjet printhead includes forming a plurality of nozzles in the nozzle plate, each of the nozzles having an exit, stacking a film on the surface of the nozzle plate to cover the exit of each of the nozzles, forming a predetermined metal layer on an inner wall of each of the nozzles and an inner surface of the film covering the exit of each of the nozzles using a plating method, removing the film from the surface of the nozzle plate, forming a hydrophobic coating layer on the surface of the nozzle plate to cover the metal layer exposed through the exit of each of the nozzles, and removing the metal layer formed on the inner wall of each of the nozzles and the hydrophobic coating layer formed on the surface of the metal layer.
    Type: Grant
    Filed: June 20, 2006
    Date of Patent: April 19, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sung-gyu Kang, Kae-dong Back, Seung-mo Lim, Jae-woo Chung
  • Publication number: 20110058852
    Abstract: A charging device and an electrophotographic image forming apparatus including the same. A charging electrode of the charging device includes a porous insulating layer including a plurality of hollow rods vertically formed on a substrate formed of a conductive material, and a conductive nano structure formed in the hollow rods of the porous insulating layer. A grid electrode is supported by a spacer and is separated from the nano structure of the charging electrode. Furthermore, the charging electrode of the charging device may include a plurality of protrusions formed on a substrate, a porous insulating layer formed on the plurality of protrusions, and a conductive nano structure formed in hollow rods of the porous insulating layer.
    Type: Application
    Filed: September 7, 2010
    Publication date: March 10, 2011
    Applicant: Samsung Electronics Co., Ltd
    Inventors: Hee-moon Jeong, Kae-dong Back, Jin-ho Lee
  • Publication number: 20110049095
    Abstract: A method of forming a hydrophobic coating layer on a surface of a nozzle plate of an inkjet printhead includes forming a plurality of nozzles in the nozzle plate, each of the nozzles having an exit, stacking a film on the surface of the nozzle plate to cover the exit of each of the nozzles, forming a predetermined metal layer on an inner wall of each of the nozzles and an inner surface of the film covering the exit of each of the nozzles using a plating method, removing the film from the surface of the nozzle plate, forming a hydrophobic coating layer on the surface of the nozzle plate to cover the metal layer exposed through the exit of each of the nozzles, and removing the metal layer formed on the inner wall of each of the nozzles and the hydrophobic coating layer formed on the surface of the metal layer.
    Type: Application
    Filed: November 8, 2010
    Publication date: March 3, 2011
    Applicant: Samsung Electronics Co., Ltd
    Inventors: Sung-gyu Kang, Kae-dong Back, Seung-mo Lim, Jae-Woo Chung
  • Patent number: 7828707
    Abstract: An image drum for selectively adsorbing toner in a printing apparatus is provided. A method and a configuration of ring electrodes formed on an outside of a drum body is also provided. That is, a control board is mounted inside the drum body, of which a plurality of terminals is externally exposed in the cylindrical drum body, and a photocurable resin is coated on the circumferential surface. Ring electrodes are then formed on circumferential surface of the drum body, by rotating the drum body and allowing an ultraviolet ray through the mask pattern onto the drum body to harden the liquid photocurable resin after contacting a mask-patterned mold mask to the circumferential surface of the drum body.
    Type: Grant
    Filed: September 13, 2006
    Date of Patent: November 9, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chang Seung Lee, Kwang Choon Ro, Kae Dong Back, Kyu Ho Shin, Jong Kwang Kim, Won Kyoung Choi, Ki Deok Bae, Soon Cheol Kweon
  • Patent number: 7794799
    Abstract: A method for manufacturing an array plate for biomolecules includes coating a surface of a substrate with a hydrophobic material to form a hydrophobic layer having initial hydrophobic properties, etching the hydrophobic layer through an etch mask placed thereon to form a hydrophilic binding site, removing the etch mask, and processing the remaining region of the hydrophobic layer to recover the initial hydrophobic properties. A method for manufacturing a biochip using this array plate, includes processing the surface of the hydrophilic binding site of the array plate to increase an affinity of biomolecules to the hydrophilic binding site, and applying a solution containing biomolecules to the surface of the hydrophilic binding site.
    Type: Grant
    Filed: May 15, 2003
    Date of Patent: September 14, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Woon-bae Kim, Chang-ho Cho, Kae-dong Back, Hwan-young Choi
  • Patent number: 7786573
    Abstract: A packaging chip formed with plural wafers. The packaging chip includes plural wafers stacked in order and plural interconnection electrodes directly connecting the plural wafers from an upper surface of an uppermost wafer of the plural wafers to the other wafers. At least one or more of the plural wafers mounts a predetermined circuit device thereon. Further, at least one or more wafers of the plural wafers have a cavity of a predetermined size. Meanwhile, the packaging chip further includes plural pads independently arranged on the upper surface of the uppermost wafer one another and electrically connected to the plural interconnection electrodes respectively. Accordingly, the present invention can enhance the performance and reliability of a packaging chip and improve fabrication yield.
    Type: Grant
    Filed: July 6, 2006
    Date of Patent: August 31, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Min-seog Choi, Kae-dong Back, In-sang Song, Woon-bae Kim, Byung-gil Jeong, Kyu-dong Jung
  • Patent number: 7784177
    Abstract: An image drum manufacturing method including: providing a hollow cylindrical mold having a plurality of mold grooves circumferentially cut in its inner circumferential surface and a core portion having a smaller diameter than a hollow of the mold and having a slit-shaped combination groove; filling a conductive material into the mold grooves of the mold; inserting a control unit for individually applying a voltage to each terminal in the combination groove of the core portion, so that a conductive pattern corresponding to the conductive material is partially exposed; inserting the core portion into the mold so that the conductive pattern corresponds to the conductive material filled into each mold groove; and forming a drum body to be integrally formed with the control unit and the conductive material by filling a molten plastic into a space between the mold and the core portion.
    Type: Grant
    Filed: June 6, 2006
    Date of Patent: August 31, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kae Dong Back, Ki Deok Bae, Chang Youl Moon, Kyu Ho Shin, Soon Cheol Kweon, Won Kyoung Choi, Chang Seung Lee
  • Publication number: 20100020153
    Abstract: Provided are an image drum and a method of manufacturing the image drum. The image drum includes multiple ring electrodes arranged along a longitudinal direction of a drum body and on an outer circumferential surface of the drum body. The ring electrodes are separated from each other. Between the ring electrodes there are ring insulator molds. The image drum can be manufactured by patterning a seed layer on the outer surface of the drum body, forming multiple ring insulator molds on the seed layer, and depositing a conductive material between the ring insulator molds to form the ring electrodes.
    Type: Application
    Filed: May 8, 2009
    Publication date: January 28, 2010
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: EUNG-YEOUL YOON, Kae-Dong Back, Jin-Seung Choi
  • Patent number: 7625693
    Abstract: A method of fabricating a one-way transparent optical system by which external light is effectively intercepted and internal light passes nearly without loss is provided. The method includes: forming a silver halide on a transparent substrate; aligning a mask in which a predetermined pattern is formed, on the transparent substrate and exposing the silver halide using the mask; developing and fixing the exposed silver halide and forming a plurality of light-absorbing materials on the transparent substrate; and forming protrusion structures having a shape of a convex lens shape for refracting incident light toward a corresponding light-absorbing material of the light-absorbing materials, on the transparent substrate on which the light-absorbing materials are formed.
    Type: Grant
    Filed: December 7, 2005
    Date of Patent: December 1, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: O-gweon Seo, Kae-dong Back, Chang-seung Lee, Kyu-sik Kim, Duck-su Kim, Byoung-ho Cheong
  • Patent number: 7579685
    Abstract: A wafer level packaging cap and method thereof for a wafer level packaging are provided. The wafer level packaging cap covering a device wafer with a device thereon, includes a cap wafer having on a bottom surface a cavity providing a space for receiving the device, and integrally combined with the device wafer, a plurality of metal lines formed on the bottom surface of the cap wafer to correspond to a plurality of device pads formed on the device wafer to be electrically connected to the device, a plurality of buffer portions connected to the plurality of metal lines and comprising a buffer wafer with a plurality of grooves and a metal filled in the plurality of grooves, a plurality of connection rods electrically connected to the plurality of buffer portions and penetrating the cap wafer from a top portion of the buffer portion, and a plurality of cap pads formed on a top surface of the cap wafer and electrically connected to a plurality of connection rods.
    Type: Grant
    Filed: January 26, 2006
    Date of Patent: August 25, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Moon-chul Lee, Woon-bae Kim, Kae-dong Back, Qian Wang, Jun-sik Hwang, Kyu-dong Jung
  • Publication number: 20090119917
    Abstract: A method of manufacturing an image drum includes fixing a control circuit board inside the drum body using a fixing member so that a plurality of terminals of the control circuit board are located in the slot formed longitudinally on the drum body, forming an insulation layer by applying a sensitizer to the entire external surface of the drum body, forming connection parts by removing parts of the insulation layer where the terminals of the control circuit board are formed using photolithography processing, forming electrode forming grooves including the insulation layer as a base on the external surface of the drum body comprising the connection parts thereon, and forming a plurality of ring electrodes to be connected to respective terminals among the plurality of the terminals, respectively, through the connection parts by applying a fluent conductive substance to the external surface of the drum body comprising the electrode forming grooves thereon, and by filling the electrode forming grooves with the flu
    Type: Application
    Filed: June 5, 2008
    Publication date: May 14, 2009
    Applicants: Samsung Electronics Co., Ltd., Samsung Electro-Mechanics Co., Ltd.
    Inventors: Eung-yeoul YOON, Kae-dong BACK, Kyu-ho SHIN, Jin-seung CHOI
  • Patent number: 7510968
    Abstract: A cap for a semiconductor device package, including a body formed at a predetermined thickness with a cavity. The cap further includes a first seed layer formed on an inner circumference of a first via hole formed at a predetermined depth from the cavity formation surface of the body, a second seed layer formed on an inner circumference of a second via hole formed at a predetermined depth from the opposite surface to the cavity formation surface of the body, and plating materials filled in the first via hole and the second via hole.
    Type: Grant
    Filed: April 28, 2006
    Date of Patent: March 31, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Moon-chul Lee, Jong-oh Kwon, Kae-dong Back, Qian Wang, Jun-sik Hwang, Kyu-dong Jung
  • Patent number: 7489327
    Abstract: An image forming apparatus that may be easily and inexpensively manufactured is provided. The image forming apparatus includes: a toner supply unit; an image forming element to which toner is adsorbed from the toner supply unit; an image developing unit disposed on an outer side of the image forming element, wherein said image developing unit selectively separates from the image forming element at least a part of the toner adsorbed to the image forming element in order to develop an image on the image forming element; and a toner return unit which returns the toner separated from the image forming element by the image developing unit to the toner supply unit.
    Type: Grant
    Filed: June 22, 2006
    Date of Patent: February 10, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Soon Cheol Kweon, Kyu Ho Shin, Kae Dong Back, Chang Youl Moon, Ki Deok Bae, Won Kyoung Choi, Chang Seung Lee
  • Publication number: 20080156651
    Abstract: Provided are a method of forming a phase change layer, a method of manufacturing a storage node using the method of forming a phase change layer, and a method of manufacturing a phase change memory device using the method of manufacturing a storage node. The method of forming a phase change layer may use an electrochemical deposition (ECD) method. The method of forming the phase change layer may include forming an electrolyte by mixing a solvent and precursors, each precursor containing an element of the phase change layer, dipping an anode plate and a cathode plate in the electrolyte to be spaced apart from each other, wherein the cathode plate may be a substrate on which the phase change layer is to be deposited, setting deposition conditions of the phase change layer; and supplying a voltage between the anode plate and the cathode plate.
    Type: Application
    Filed: December 12, 2007
    Publication date: July 3, 2008
    Inventors: Youn-seon Kang, Kae-dong Back, Woong-chul Shin, Seung-jin Oh
  • Publication number: 20080136889
    Abstract: An image forming element and its manufacturing apparatus and method are disclosed, in which manufacturing process steps can be simplified to reduce the cost and improve productivity. The manufacturing method of an image forming element includes respectively providing a mold and an image drum, forming line shaped conductive paste patterns on the mold, and transferring the conductive paste patterns from the mold onto the image drum.
    Type: Application
    Filed: April 13, 2007
    Publication date: June 12, 2008
    Applicant: SAMSUNG ELECTRONICS CO., LTD
    Inventors: Eung-Yeoul Yoon, Kae Dong Back, Kyu Ho Shin, Jin Seung Choi, Soon Cheol Kweon, Su Ho Shin, Ki Hwan Kwon, Chang Youl Moon
  • Publication number: 20070144009
    Abstract: An image drum for selectively adsorbing toner in a printing apparatus is provided. A method and a configuration of ring electrodes formed on an outside of a drum body is also provided. That is, a control board is mounted inside the drum body, of which a plurality of terminals is externally exposed in the cylindrical drum body, and a photocurable resin is coated on the circumferential surface. Ring electrodes are then formed on circumferential surface of the drum body, by rotating the drum body and allowing an ultraviolet ray through the mask pattern onto the drum body to harden the liquid photocurable resin after contacting a mask-patterned mold mask to the circumferential surface of the drum body.
    Type: Application
    Filed: September 13, 2006
    Publication date: June 28, 2007
    Inventors: Chang Seung Lee, Kwang Choon Ro, Kae Dong Back, Kyu Ho Shin, Jong Kwang Kim, Won Kyoung Choi, Ki Deok Bae, Soon Cheol Kweon
  • Publication number: 20070137776
    Abstract: An image drum manufacturing method including: providing a hollow cylindrical mold having a plurality of mold grooves circumferentially cut in its inner circumferential surface and a core portion having a smaller diameter than a hollow of the mold and having a slit-shaped combination groove; filling a conductive material into the mold grooves of the mold; inserting a control unit for individually applying a voltage to each terminal in the combination groove of the core portion, so that a conductive pattern corresponding to the conductive material is partially exposed; inserting the core portion into the mold so that the conductive pattern corresponds to the conductive material filled into each mold groove; and forming a drum body to be integrally formed with the control unit and the conductive material by filling a molten plastic into a space between the mold and the core portion.
    Type: Application
    Filed: June 6, 2006
    Publication date: June 21, 2007
    Inventors: Kae Dong Back, Ki Deok Bae, Chang Youl Moon, Kyu Ho Shin, Soon Cheol Kweon, Won Kyoung Choi, Chang Seung Lee
  • Publication number: 20070120889
    Abstract: A method of forming a hydrophobic coating layer on a surface of a nozzle plate of an inkjet printhead includes forming a plurality of nozzles in the nozzle plate, each of the nozzles having an exit, stacking a film on the surface of the nozzle plate to cover the exit of each of the nozzles, forming a predetermined metal layer on an inner wall of each of the nozzles and an inner surface of the film covering the exit of each of the nozzles using a plating method, removing the film from the surface of the nozzle plate, forming a hydrophobic coating layer on the surface of the nozzle plate to cover the metal layer exposed through the exit of each of the nozzles, and removing the metal layer formed on the inner wall of each of the nozzles and the hydrophobic coating layer formed on the surface of the metal layer.
    Type: Application
    Filed: June 20, 2006
    Publication date: May 31, 2007
    Inventors: Sung-gyu KANG, Kae-dong Back, Seung-mo Lim, Jae-woo Chung