Patents by Inventor Kai An

Kai An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10779442
    Abstract: The disclosure is related to a method for verifying an immersion cooling system. The immersion cooling system includes a first sensor, a second sensor and at least one third sensor. The method includes: obtaining a first difference value; determining whether the first difference value is smaller than a first threshold value; determining that the first sensor and the second sensor are in normal operation when the first difference value is smaller than the first threshold value; when the first difference value is not smaller than the first threshold value, determining an operating condition of the first sensor or the second sensor according to a relationship between a sensor value of the at least one third sensor and the sensor value of the first sensor, or a relationship between the sensor value of the at least one third sensor and the sensor value of the second sensor.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: September 15, 2020
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Kai-Yang Tung, Hung-Ju Chen
  • Patent number: 10778997
    Abstract: A method of coding video data is provided to include resetting one or more tables including motion candidates before coding video blocks that are in a first video region of a picture in a video; coding a video block in the first video region, and determining whether to update the one or more tables using motion information derived for the video block; deriving motion information for a subsequent video block to the video block in the first video region; and coding the subsequent video block using the motion information derived for the subsequent video block; wherein one or more candidates from the one or more table are selectively checked during a motion candidate list construction process which is used to derive the motion information for the subsequent video block.
    Type: Grant
    Filed: February 27, 2020
    Date of Patent: September 15, 2020
    Assignees: BEIJING BYTEDANCE NETWORK TECHNOLOGY CO., LTD., BYTEDANCE INC.
    Inventors: Li Zhang, Kai Zhang, Hongbin Liu, Yue Wang
  • Patent number: 10775696
    Abstract: Organometallic precursors are described for the formation of high resolution lithography patterning coatings based on metal oxide hydroxide chemistry. The precursor compositions generally comprise ligands readily hydrolysable by water vapor or other OH source composition under modest conditions. The organometallic precursors generally comprise a radiation sensitive organo ligand to tin that can result in a coating that can be effective for high resolution patterning at relatively low radiation doses and is particularly useful for EUV patterning. The precursors compositions are readily processable under commercially suitable conditions. Solution phase processing with in situ hydrolysis or vapor based deposition can be used to form the coatings.
    Type: Grant
    Filed: January 3, 2019
    Date of Patent: September 15, 2020
    Assignee: Inpria Corporation
    Inventors: Stephen T. Meyers, Jeremy T. Anderson, Brian J. Cardineau, Joseph B. Edson, Kai Jiang, Douglas A. Keszler, Alan J. Telecky
  • Patent number: 10777252
    Abstract: A method and apparatus for performing opportunistic refreshes of memory banks is disclosed. Refresh circuitry in a memory controller performs a refresh on each bank of a multi-bank memory at least once during a given refresh interval. At the beginning of an interval, memory banks for which there are no pending transactions (e.g., reads or writes) may be refreshed. During a first portion of the interval, refresh may be skipped for memory banks for which transactions are pending. In a second portion of the interval, refreshes are performed on memory banks that have not been refreshed during the interval, which may cause some memory transactions to be delayed.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: September 15, 2020
    Assignee: Apple Inc.
    Inventors: Peter Fu, Gregory S. Mathews, Kai Lun Hsuing, Shane J. Keil
  • Patent number: 10776538
    Abstract: Electronic system level (ESL) design and verification of the present disclosure is utilized to provide an electronic simulation and modeling of function safety and fault management of an electronic device. A method for simulating a safety circuit includes providing an electronic architectural design to perform one or more functional behaviors of the electronic device in accordance with an electronic design specification. The method further includes modeling the safety circuit of the electronic architectural design and one or more other electronic circuits of the electronic architectural design that communicate with the safety circuit. The method further includes simulating, using the modeling, operation of the safety circuit while the electronic architectural design is performing the one or more functional behaviors. The method also includes determining whether the simulated operation of the safety circuit satisfies the electronic design specification.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: September 15, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Kai-Yuan Ting, Sandeep Kumar Goel, Yun-Han Lee, Mei Wong, Hsin-Cheng Chen
  • Publication number: 20200283826
    Abstract: Provided herein are methods, compositions, and kits for forming amplification products. In various embodiments provided herein, transposomes comprising transposases are used in forming tagged polynucleotides for downstream amplification and polynucleotide processing steps.
    Type: Application
    Filed: March 19, 2020
    Publication date: September 10, 2020
    Inventors: Yalei WU, Wai Ho LEE, Kai Qin LAO
  • Publication number: 20200286825
    Abstract: A package structure includes a redistribution circuit structure, at least one semiconductor die, an insulating encapsulation, insulators, and metallic patterns. The at least one semiconductor die is located on and electrically connected to the redistribution circuit structure. The insulating encapsulation encapsulates the at least one semiconductor die and located on the redistribution circuit structure. The insulators are located on the redistribution circuit structure, wherein the insulators are separated and spaced apart from each other, wherein edges of each of the insulators are distant from edges of the at least one semiconductor die by an offset in a stacking direction of the redistribution circuit structure and the insulating encapsulation. Each of the metallic patterns is located on a respective one of the insulators.
    Type: Application
    Filed: May 24, 2020
    Publication date: September 10, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chien-Ling Hwang, Chun-Lin Lu, Kai-Chiang Wu
  • Publication number: 20200281538
    Abstract: The disclosure refers to a method of operating a receiver for receiving analyte data from a biosensor monitoring an analyte by detecting analyte values, the method comprising: in a receiver (1), receiving analyte values detected by a biosensor (8) monitoring an analyte in intervals of time for which a first interval time is applied; receiving a present analyte value in the receiver (1); providing a rate of change for the analyte values; determining a future analyte value based on the present analyte value, the first interval time, and the rate of change; providing an analyte value range for the analyte values; setting a second interval time, the second interval time being shorter than the first interval time, if the future analyte value is outside the analyte value range, and longer than or equal to the first interval time, if the future analyte value is within the analyte value range; and in the receiver (1), receiving one or more following analyte values in intervals of time for which the second interval ti
    Type: Application
    Filed: March 29, 2017
    Publication date: September 10, 2020
    Inventors: Kai-Oliver Schwenker, Carsten Mueglitz, Andreas HUber-Toth, Felix Bootz
  • Publication number: 20200282682
    Abstract: The present invention provides a high-pressure piston-cylinder assembly for compaction treatment comprising a cylinder comprising a plurality of sections which are longitudinally stacked and joined to form the cylinder; a piston configured for moving in and along the cylinder; and a base configured for being coupled with the cylinder to provide mechanical support to the cylinder; wherein each of the sections includes one or more releasing channels for releasing of liquid or gas fluid generated during compaction treatment. The high-pressure piston-cylinder assembly is sealed by one seal having a helical coiled sealing ring structure tightly encircling the piston, and another seal encircling a cylindrical sealing block protruded from the base and into the cylinder. The resulting piston-cylinder assembly can be more effectively manufactured, has better durability and tolerance in high-pressure operation.
    Type: Application
    Filed: March 9, 2019
    Publication date: September 10, 2020
    Inventors: Stanley Moon Kai Ko, Kyong Tae Chang
  • Publication number: 20200281805
    Abstract: The present invention relates to a massage apparatus. More particularly, the invention relates to a massage apparatus which maintains the applied force of a massage head. The apparatus has massage head that is attached to a movable block. The movable block can be repositioned to apply force to a subject. A force sensor constantly transmits applied force readings to a microprocessor which maintains the applied force by adjusting the position of the movable block relative the subject's body.
    Type: Application
    Filed: October 3, 2018
    Publication date: September 10, 2020
    Inventors: Chen QIU, Yizhong ZHANG, Lui KAI
  • Publication number: 20200286905
    Abstract: A memory die including a three-dimensional array of memory elements and a logic die including a peripheral circuitry that support operation of the three-dimensional array of memory elements can be bonded by die-to-die bonding to provide a bonded assembly. External bonding pads for the bonded assembly can be provided by forming recess regions through the memory die or through the logic die to physically expose metal interconnect structures within interconnect-level dielectric layers. The external bonding pads can include, or can be formed upon, a physically exposed subset of the metal interconnect structures. Alternatively or additionally, laterally-insulated external connection via structures can be formed through the bonded assembly to multiple levels of the metal interconnect structures. Further, through-dielectric external connection via structures extending through a stepped dielectric material portion of the memory die can be physically exposed, and external bonding pads can be formed thereupon.
    Type: Application
    Filed: March 4, 2019
    Publication date: September 10, 2020
    Inventors: James KAI, Murshed CHOWDHURY, Koichi MATSUNO, Johann ALSMEIER
  • Publication number: 20200288172
    Abstract: Aspects of the disclosure include a video encoding device that includes a processing circuit configured to receive a first block corresponding to a first color space component and a second block corresponding to a second color space component. The processing circuit is configured to determine transform settings for processing a first transformed block and a second transformed block corresponding to the first and second blocks, respectively. The processing circuit is configured to generate a first syntax element set to be signaled in association with the first color space component, and to generate a second syntax element set to be signaled in association with the second color space component, where the first syntax element set indicates a first transform setting for processing the first transformed block, and the second syntax element set indicates a second transform setting for processing the second transformed block.
    Type: Application
    Filed: May 22, 2020
    Publication date: September 10, 2020
    Applicant: Media Tek Singapore Pte. Ltd.
    Inventors: Han Huang, Kai Zhang
  • Publication number: 20200285455
    Abstract: A multiple storage node system including a first and second node is provided. The first node includes a first baseboard management controller (BMC), a first flash ROM configured to store a first flash image, and a first switch device configured to connect the first BMC to the first flash ROM. The second node includes an exact configuration of the first node. The first BMC is connected to the second switch device, and the second flash image is the same as the first flash.
    Type: Application
    Filed: March 6, 2019
    Publication date: September 10, 2020
    Inventors: Kai-Yeh PAN, Chun-Ching YU, Shuen-Hung WANG
  • Publication number: 20200286808
    Abstract: A plug-in type power module includes a power unit and a heat-transfer unit vertically disposed on the power unit and extending outwardly away from two sides of the power unit. A first ceramic layer is disposed between the power unit and the heat-transfer unit. Therefore, heat generated by the power unit can be transferred from the first ceramic layer to the heat-transfer unit to increase the speed of heat dissipation. A subsystem having the plug-in type power module is also provided.
    Type: Application
    Filed: May 26, 2020
    Publication date: September 10, 2020
    Inventors: Shu-Jung Yang, Yu-Lin Chao, Chun-Kai Liu, Ming Kaan Liang, Jiin Shing Perng
  • Publication number: 20200287332
    Abstract: A female connector and a transmission wafer are provided. The female connector includes a housing and a plurality of transmission wafers inserted into the housing. Each of the transmission wafers includes an insulating frame, a plurality of grounding terminals fixed to the insulating frame, and a first shielding member and a second shielding member respectively disposed on two opposite sides of the insulating frame. In each of the transmission wafers, the second shielding member is disposed on a front end portion of the insulating frame, and the first and second shielding members are electrically connected to the grounding terminals so as to be electrically connected to each other through the grounding terminals. The second shielding member of one of any two adjacent transmission wafers is abutted against and electrically connected to the first shielding member of the other one of the any two adjacent transmission wafers.
    Type: Application
    Filed: September 12, 2019
    Publication date: September 10, 2020
    Inventors: CHIH-WEI CHEN, CHUNG-NAN PAO, YUEH-LIN YANG, YU-HSIUNG LIN, KAI WU, YAN-BO LIN
  • Publication number: 20200282827
    Abstract: A drive unit for an electric vehicle, having an electric machine and a three-speed shift transmission with first, second and third shift elements, and two planetary sets which are coupled with each other. The first planetary set has a first sun gear shaft, first ring gear shaft and a first carrier shaft. The second planetary set has a second sun gear shaft, a second ring gear shaft and second carrier shaft. The first carrier shaft is fixed to the second ring gear shaft. The first sun gear shaft can be driven by an electric machine. The first ring gear shaft is fixed and output takes place via the second carrier shaft. The first shift elements are actuated to engage a first gear, the second shift elements are actuated to engage the second gear and the third shift elements are actuated to engage the third gear.
    Type: Application
    Filed: March 6, 2020
    Publication date: September 10, 2020
    Inventors: Johannes KALTENBACH, Stefan RENNER, Kai BORNTRÄGER, Michael TRÜBENBACH, Stefan SPÜHLER, Johannes GLÜCKLER
  • Publication number: 20200282641
    Abstract: The invention relates to a 3D hot-melt printing process for producing a three-dimensional product (P) substantially from a polymer powder or polymer filaments, the product being built up in layers by application of polymer plies of powder or filament onto a respectively previously produced ply and selective local heating of predetermined points on the ply by means of a sintering or melting temperature of the powder or of the filaments and sintering or melting of the melted points with the underlying layer. The polymer ply which is in each case newly applied and optionally at least one underlying layer is preheated by planar or travelling irradiation of short- or medium-wave IR radiation to a temperature with a predetermined difference for sintering or melting temperature.
    Type: Application
    Filed: October 18, 2018
    Publication date: September 10, 2020
    Applicant: Value & Intellectual Properties Management GMBH
    Inventors: Kai K.O. Bär, Andreas Geitner
  • Publication number: 20200286772
    Abstract: A wafer holder and a wafer transfer apparatus, system and method are disclosed. The wafer holder is mounted onto the wafer transfer apparatus and includes a holder body and a sucker. The holder body defines a first opening, while the sucker includes a first skirt. The first skirt is located on one side of the holder body and connected to the first opening. A groove is formed at a joint between the first skirt and the first opening. The groove is located at an outer side of the first skirt, and is able to relief stresses produced at a base portion of the sucker during deformation of the first skirt.
    Type: Application
    Filed: March 29, 2018
    Publication date: September 10, 2020
    Inventors: Gang WANG, Rongjun ZHANG, Xiaoyu JIANG, Yichao SHI, Kai LIU, Junpeng CHEN
  • Publication number: 20200285396
    Abstract: Embodiments include receiving an indication of a data storage module to be associated with a tenant of a distributed storage system, allocating a partition of a disk for data of the tenant, creating a first association between the data storage module and the disk partition, creating a second association between the data storage module and the tenant, and creating rules for the data storage module based on one or more policies configured for the tenant. Embodiments further include receiving an indication of a type of subscription model selected for the tenant, and selecting the disk partition to be allocated based, at least in part, on the subscription model selected for the tenant. More specific embodiments include generating a storage map indicating the first association between the data storage module and the disk partition and indicating the second association between the data storage module and the tenant.
    Type: Application
    Filed: May 20, 2020
    Publication date: September 10, 2020
    Inventors: Johnu George, Kai Zhang, Yathiraj B. Udupi, Debojyoti Dutta
  • Publication number: 20200281647
    Abstract: Systems and methods for non-thermal ablation of tissue are provided. A non-implantable minimally invasive system for treatment of tissue in a body via direct current ablation is provided including a catheter, a plurality of electrodes for deployment through the catheter, a power source for applying power to the electrodes, and a fixation element for maintaining the catheter in a treatment position during treatment of the tissue. A minimally invasive method for treating tissue in a body via direct current ablation is provided including inserting a catheter into the body such that a portion of the catheter remains outside of the body, deploying a fixation element to fix the catheter in a treatment position, deploying a plurality of electrodes through the catheter, applying power to the plurality of electrodes, using the electrodes to apply a current to the tissue, and removing the catheter from the body.
    Type: Application
    Filed: March 2, 2020
    Publication date: September 10, 2020
    Inventors: Benjamin R. Fruland, Kai Kroll, Tom A. Nelson, Stephen K. Sundquist, Michael C. Holtz