Kai Chew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
Abstract: A substantially lead-free solder, comprising: from around 96.8% to around 99.3% tin; from around 0.2 % to around 3.0% copper; and from around 0.02% to around 0.12% silicon.
Type:
Application
Filed:
February 12, 2007
Publication date:
June 7, 2007
Applicants:
Quantum Chemical Technologies (Singapore) Pte. Ltd., Singapore Asahi Chemical & Solder Industries Pte. Ltd.
Abstract: A substantially lead-free solder, comprising: from around 96.8% to around 99.3% tin; from around 0.2% to around 3.0% copper; and from around 0.02% to around 0.12% silicon.
Type:
Application
Filed:
January 28, 2005
Publication date:
April 27, 2006
Applicant:
Quantum Chemical Technologies (Singapore) Pte. Ltd
© 2025 Justia
