Abstract: Aspects of the present disclosure address systems and methods for routing an integrated circuit design based on a maximum turn constraint. Data describing an integrated circuit is accessed. The integrated circuit design comprises a net specifying a connection between a first pin and a second pin. A maximum turn constraint is accessed. The maximum turn constraint specifies a maximum number of turns for connection paths generated in routing the integrated circuit design. The net is routed based on the maximum turn constraint. The routing of the net results in a routed net comprising a connection path between the first pin and the second pin that includes a number of turns that satisfy the maximum turn constraint. A layout instance for the integrated circuit design is generated based in part on the routed net.

Abstract: Lamination systems and methods of fabricating devices are disclosed. The lamination system includes multiple processing modules for delaminating a backgrinding (BG) from a surface of the wafer and laminating a dicing tape on the surface of the wafer. The system includes a wafer receiving module which is configured to hold the wafer in place with a position chuck throughout the delamination and lamination process. By using a single positioning chuck, more efficient processing is achieved. For example, there is no need to re-lign the wafer when it is moved from one chuck to another.

Abstract: A wafer adaptor ring assembly for adapting an adapted sized wafer for plasma dicing by a plasma etch chamber designed for dicing a designed sized wafer, which is larger than the adapted sized wafer is disclosed. The wafer adaptor ring assembly includes a primary wafer ring designed for plasma dicing the designed sized wafer by the plasma, an adhesive sheet attached to a bottom surface of the primary wafer ring, and an adapted sized wafer disposed on the adhesive sheet between the primary wafer ring and the adapted sized wafer. A method for forming the wafer adaptor ring assembly is also disclosed.

Abstract: A multi-chip MIMO radar system includes a plurality of transmitters and a plurality of receivers. Each of the pluralities of transmitters and receivers are arranged across a plurality of chips. The multi-chip MIMO radar system is configured to provide an exemplary chip synchronization such that the transmitters and receivers of each chip of the radar system are synchronized with the transmitters and receivers of every other chip of the radar system.

Abstract: A manufacturing system includes a substrate disposed on a conveyer system. The conveyer system includes a pair of side supports. The substrate is moved on the conveyer system until the substrate is disposed over a bottom support block. The bottom support block is raised to physically contact the substrate. A transfer arm module is provided. The transfer arm module includes a flat bottom surface and an opening formed in the flat bottom surface. The transfer arm module is disposed with the flat bottom surface physically contacting the substrate opposite the bottom support block. A vacuum is enabled through the opening of the transfer arm module. The substrate is lifted off the bottom support block using the vacuum. The substrate is moved over a printing pallet using the transfer arm module. The vacuum is disabled when the substrate is in a positioning area of the printing pallet.

Abstract: A multi-chip MIMO radar system includes a plurality of transmitters and a plurality of receivers. Each of the pluralities of transmitters and receivers are arranged across a plurality of chips. The multi-chip MIMO radar system is configured to provide an exemplary chip synchronization such that the transmitters and receivers of each chip of the radar system are synchronized with the transmitters and receivers of every other chip of the radar system.

Abstract: A manufacturing system includes a substrate disposed on a conveyer system. The conveyer system includes a pair of side supports. The substrate is moved on the conveyer system until the substrate is disposed over a bottom support block. The bottom support block is raised to physically contact the substrate. A transfer arm module is provided. The transfer arm module includes a flat bottom surface and an opening formed in the flat bottom surface. The transfer arm module is disposed with the flat bottom surface physically contacting the substrate opposite the bottom support block. A vacuum is enabled through the opening of the transfer arm module. The substrate is lifted off the bottom support block using the vacuum. The substrate is moved over a printing pallet using the transfer arm module. The vacuum is disabled when the substrate is in a positioning area of the printing pallet.

Abstract: Various embodiments provide for multi-threaded network routing of a circuit design based on partitioning networks of the circuit design, which can enable partitioning routing tasks for the circuit design. More particularly, some embodiments iteratively partition networks of a circuit design into groups of networks, which enable various embodiments to schedule routing tasks for those groups of networks to available threads such that no two networks of the circuit design with overlapping routing regions are routed at the same time, and such that idle time of each thread (e.g., time where thread has no work or is waiting for another thread to finish) can be minimized.

Abstract: A first carrier has a first plate. A tape is disposed on the first plate. A second plate is disposed over the first plate. The second plate has a trench aligned to the tape and an opening formed through the second plate over the tape. A singulated semiconductor package is disposed on the tape in the opening of the second plate. A second carrier has a static datum and a movable datum. The movable datum is moved toward the static datum. An aperture substrate is disposed around the static datum and movable datum. A manufacturing process is performed on the aperture substrate.

Abstract: A wafer adaptor ring assembly for adapting an adapted sized wafer for plasma dicing by a plasma etch chamber designed for dicing a designed sized wafer, which is larger than the adapted sized wafer is disclosed. The wafer adaptor ring assembly includes a primary wafer ring designed for plasma dicing the designed sized wafer by the plasma, an adhesive sheet attached to a bottom surface of the primary wafer ring, and an adapted sized wafer disposed on the adhesive sheet between the primary wafer ring and the adapted sized wafer. A method for forming the wafer adaptor ring assembly is also disclosed.

Abstract: A wafer adaptor ring assembly for adapting an adapted sized wafer for plasma dicing by a plasma etch chamber designed for dicing a designed sized wafer, which is larger than the adapted sized wafer is disclosed. The wafer adaptor ring assembly includes a primary wafer ring designed for plasma dicing the designed sized wafer by the plasma, an adhesive sheet attached to a bottom surface of the primary wafer ring, and an adapted sized wafer disposed on the adhesive sheet between the primary wafer ring and the adapted sized wafer. A system for assembling and disassembling the wafer adaptor ring assembly is also disclosed.

Abstract: Various embodiments provide for routing a circuit design based on adjusting a routing demand. More specifically, some embodiments implement routing demand smoothing of a grid cell, routing overflow spreading of a grid cell, or some combination of both prior to detailed routing of a circuit design, which can result in improved detailed routing over conventional routing techniques.

Abstract: A method for forming a semiconductor package is disclosed. The method includes providing a package substrate having top and bottom major package substrate surfaces, the top major package surface including a die attach region. A die having first and second major die surfaces is attached onto the die attach region. The second major die surface is attached to the die attach region. The first major die surface includes an die active region and a cover adhesive region surrounding the die active region. The method also includes applying a cover adhesive to the cover adhesive region on the first major die surface. A protective cover with first and second major cover surfaces and side surfaces is attached to the die using the cover adhesive. The second major cover surface contacts the cover adhesive. The protective cover covers the die active region. The protective cover includes a discontinuity on at least one of the side surfaces.

Abstract: A soft-start control circuit is provided. The soft-start control circuit includes a load switch, a driving unit and a filtering unit. The first terminal of the load switch is configured to receive an input voltage. The control terminal of the load switch is configured to receive a switching signal and perform switching between on and off according to the switching signal, thereby performing a soft-start operation. The second terminal of the load switch is configured to provide a switched voltage. The driving unit is configured to provide a switching signal according to a control signal and release a parasitic charge stored in the load switch when the load switch is turned off. The filtering unit is configured to convert the switched voltage into an output voltage.

Abstract: Various embodiments described herein provide for routing of wires of a network of a circuit design based on pin placement within a routing blockage. In particular, various embodiments provide a routing solution for a circuit design with zero blockage violation when there is no pin inside routing blockage of the circuit design, and uses a parameter (e.g., an adjustable parameter) that controls accuracy at which a routing process handles a pin (e.g., as placed by a placement stage) in routing blockage of the circuit design. For example, the parameter can control how much detour is acceptable when handling routing for a pin inside a routing blockage.

Abstract: Various embodiments provide for routing a network of a circuit design based on at least one of a placement blockage or a layer-assigned network of a circuit design. For instance, some embodiments route a network of a circuit design (e.g., clock net, date net) by generating a congestion map based on modeling layer-assigned networks, considering (e.g., accounting for) routing congestion based on a placement blockage of the circuit design, or some combination of both.

Abstract: Various embodiments provide for routing a network of a circuit design based on at least one of via spacing or pin density. For instance, some embodiments route a net of a circuit design (e.g., data nets, clock nets) by generating a congestion map based on modeling via spacing, modeling pin density, or some combination of both.

Abstract: Various embodiments provide for assigning a clock pin to a clock tap within a circuit design based on connectivity between circuit devices of the circuit design. For some embodiments, an initial clock tap assignment, between a clock tap of a circuit design and a clock pin of the circuit design, is accessed as input, and a modified clock tap assignment (between the clock tap and another clock pin of the circuit design) can be generated based on one or more of the following considerations: a clock tap assignment should try to assign clock pins of connected circuit devices to the same clock tap; a clock tap assignment should try to assign clock pins of connected circuit devices having the critical timing problems; a clock tap assignment should try to assign clock pins of connected circuit devices to clock taps with longer common path length.

Abstract: A soft-start control circuit is provided. The soft-start control circuit includes a load switch, a driving unit and a filtering unit. The first terminal of the load switch is configured to receive an input voltage. The control terminal of the load switch is configured to receive a switching signal and perform switching between on and off according to the switching signal, thereby performing a soft-start operation. The second terminal of the load switch is configured to provide a switched voltage. The driving unit is configured to provide a switching signal according to a control signal and release a parasitic charge stored in the load switch when the load switch is turned off. The filtering unit is configured to convert the switched voltage into an output voltage.

Abstract: A soft-start control circuit is provided. The soft-start control circuit includes a load switch, a driving unit and a filtering unit. The first terminal of the load switch is configured to receive an input voltage. The control terminal of the load switch is configured to receive a switching signal and perform switching between on and off according to the switching signal, thereby performing a soft-start operation. The second terminal of the load switch is configured to provide a switched voltage. The driving unit is configured to provide a switching signal according to a control signal and release a parasitic charge stored in the load switch when the load switch is turned off. The filtering unit is configured to convert the switched voltage into an output voltage.