Abstract: A leadframe for a leadless package comprises a plurality of package areas, a plurality of slots, a plurality of connection portions, a plurality of openings, and a tape (film). Each package area comprises a plurality of package units, each of which comprises a die pad and a plurality of leads surrounding the die pad. The plurality of slots are disposed around each of the package units. The plurality of connection portions connect the plurality of package areas. The plurality of openings are disposed on the plurality of connection portions, and are aligned with some of the plurality of slots. The tape (film) fixes the plurality of package areas, the plurality of connection portions, the plurality of die pads, and the plurality of leads in place.

Abstract: A system for cooling electronic components includes a cold plate having a channel through which a fluid coolant is transported, a plurality of bosses each receiving an electronic, optical, or other heat-generating component, and a plurality of fin structures, at least three of which are adjacently disposed in a sequential order on the cold plate. Each fin structure contacts a boss, and has a fin inlet and a fin outlet in fluid communication with a section of the channel for supplying the area around the boss with coolant and cooling the component seated on the boss. A portion of the channel defines a serpentine path for transporting the fluid coolant to the at least three sequential fin structures in a non-sequential order. Sections of the channel in the serpentine path further transport the coolant in opposite directions, thus enhancing heat transfer and temperature equilibration across the cold plate.

Abstract: A method for making a ultra-thin fin heat sink includes the following steps. First, a continuous elongated heat sink bar is made by, the extrusion procedure wherein such heat sink bar is formed with a plurality of parallel closely spaced ultra-thin fins integrally extending from a base. Liquid type wax is injected into the space between every two adjacent fins until such space is completely filled with the wax. The wax is solidified after a while, and then the whole assembly including the heat sink bar with the inner wax generally becomes a whole solid reinforced structure which can bear the traditional sawing procedure. Via a fixture, the assembly is sawed/cut to pieces of the predetermined length. The cut pieces are successively heated to have the inner solid wax liquefied and leave from the heat sink unit.

Abstract: A retaining clamp device (10) for use with a heat sink (40) of the CPU (50) unit includes a clip (12) and an associated spring (30) attached to the clip (12) wherein the clip (12) includes an elongated main body (14) with a pair of locking tags (18) downward extending at two opposite ends thereof to respectively cooperate with the lugs (62) on the side walls (64) of the socket (60) under the CPU (50) for latching the retaining clamp device (10) unto the CPU (50) set while the spring (30) is in a wave-like form and positioned between the main body (14) of the clip (12) and the top surface (48) of the heat sink (40) so as to exert the sufficient biasing force firmly pressing the heat sink (40) against the CPU (50) for efficient heat transfer thereof, by means of its deformation derived from the less space/height between the main body (14) of the clip (12) and the top surface (48) of the heat sink (40) in comparison with the original height of the spring (30).