Abstract: A thermal imaging surface processing auxiliary system applicable for apparatus using a grinding tool to perform surface processing, includes a thermal imaging sensor and a computing device. The thermal imaging sensor photographs at least one of the grinding tool and the workpiece to generate thermal image. The computing device obtains a temperature change of an observation area in the thermal image. When the temperature change is not greater than a preset critical value, the computing device controls the apparatus to move the grinding tool toward the workpiece at a speed greater than a preset processing speed. When the temperature change is greater than the preset critical value, the computing device controls the apparatus to move the grinding tool toward the workpiece at the preset processing speed, wherein the observation area corresponds to a portion other than the contact portion between the grinding tool and the workpiece.

Abstract: Methods and systems for fiber identification include emitting a pump pulse on a fiber using a transponder. A Brillouin gain spectrum of reflected radiation from the pump pulse is measured using the transponder. A fiber type is determined corresponding to the Brillouin gain spectrum.

Abstract: This disclosure describes systems, methods, and devices related to enhanced channel access. A device may send a Multi-User Request to Send (MU-RTS) frame on a basic service set (BSS) primary channel to an overlapping basic service set (OBSS). The device may receive a Clear to Send (CTS) frame in response to the MU-RTS frame on the BSS primary channel. The device may initiate a switch to a non-primary channel access (NPCA) primary channel upon detection of a physical (PHY) preamble. The device may maintain NPCA operation on the NPCA primary channel until a network allocation vector (NAV) expires. The device may announce a location and bandwidth of the NPCA primary channel to associated stations (STAs).

Abstract: An electronic device has a peripheral region and includes a substrate, a first metal layer, and a protrusion structure. The first metal layer is disposed on the substrate and comprises a first portion and a second portion. The protrusion structure is disposed on the substrate and in the peripheral region. The first portion is not overlapped with the protrusion structure, the second portion is overlapped with the protrusion structure, and an end of the second portion is located in the protrusion structure and higher than the first portion in a normal direction of the substrate.

Abstract: A high-efficiency mold temperature control system includes a dielectric heating module, a cooling module, and a flow control module. The dielectric heating module includes a heating circuit, a dielectric heater, a high-frequency power supply, a high-temperature heat medium storage tank, and a heat circulation pump. The cooling module includes a cooling circuit, a heat exchanger, a low-temperature heat medium storage tank, and a cold circulation pump. The flow control module includes multiple thermal switch valves and multiple cooling switch valves to control a high-temperature heat medium to the heating circuit or control a low-temperature heat medium to the cooling circuit. Through the design of the dielectric heating module, the high-temperature heat medium can be rapidly heated and the overall heating efficiency can be enhanced, thereby rapidly heating or cooling a mold and controlling the rapid heating and cooling of the mold.

Abstract: Aspects of the present disclosure describe distributed fiber optic sensing (DFOS)/distributed acoustic sensing (DAS) systems, methods, and structures exhibiting a sensitivity enhancement via MIMO sampling and phase recombination.

Abstract: Disclosed are systems and methods directed to transfer learning of cascaded EDFA models error accumulations in a multi-span system in which a two-step method using transfer learning is employed to reduce EDFA model error accumulation in a multi-span system. A first step of employs existing pretrained component-level ML-based EDFA models in chain to create a large synthetic dataset. The synthetic dataset includes all related features and labels for a specific end-to-end link. A source model is trained based on the large synthetic dataset. To accommodate a performance prediction gap between real link condition and the source model, which is trained on synthetic dataset, our method employs a second step that collects a few measurements from the real end-to-end link and makes few-shots learning to transfer the synthesis-data-based source model to real-data-based target model.

Abstract: An ultra-high reliability station (UHR STA) requests that medium access control (MAC) header protection padding be included in an MAC Protocol Data Unit (MPDU). A protected control frame may be received from the UHR AP comprising an MPDU that includes a MAC header protection padding field. The MAC header protection padding field may comprise padding to allow for additional time for the processing circuitry to compute the MIC before sending the ACK. For multi-link operations (MLOs) when MAC header protection padding is used, each link may be configured with an independent replay counter and a different key is used for the protected control frame and a protected MAC header in each link. The independent replay counter in each link is reset to zero when the key is derived or rekeyed and set to a packet or sequence number (PN or SN) of the protected control frame or protected MAC header when the MIC is verified.

Abstract: This disclosure describes systems, methods, and devices related to using padding bits for protecting trigger frames, block acknowledgement request frames, and block acknowledgement frames in Wi-Fi. A device may generate padding bits of a trigger frame, a block acknowledgment request frame, or a block acknowledgement frame; generate one or more fields signaling that the padding bits are present in the trigger frame, the block acknowledgement request frame, or the block acknowledgement frame; and cause to send the trigger frame, the block acknowledgement request frame, or the block acknowledgement frame to one or more STAs, the trigger frame, the block acknowledgement request frame, or the block acknowledgement frame including the one or more fields and the padding bits.

Abstract: A neutron measuring method includes placing a conversion material on a first positioning component, in which the conversion material includes a radioactive region. A radiation dosimeter is placed on a second positioning component. The first positioning component and the second positioning component are overlapped such that the radioactive region of the conversion material is exposed to the radiation dosimeter.

Abstract: Disclosed are systems, methods, and structures that increase overall sensing reach of a DFOS system and reduces system cost without sacrificing sensed signal quality by employing a cascaded arrangement of DFOS interrogators and operating method providing backscattering DFOS, maintaining each span within a desired length which can advantageously be determined by signal quality, pulse rate, or other factors such as physical layout. The cascaded DFOS interrogators work independently while sharing the pulse light produced by the first interrogator in a cascaded series of interrogators. The light is amplified in successive fiber spans and a circulator may be employed to cut-off any backscattered signal.

Abstract: This disclosure outlines systems, methods, and devices for roaming data restriction. A device receives a transition request frame from a non-access point multi-link device (non-AP MLD), detailing capabilities and operational parameters for establishing links as a target access point multi-link device (target AP MLD). It then sends a transition response frame to the non-AP MLD, including metadata for context transfer, such as authentication parameters, replay counters, reordering buffer states, and transmission sequence numbers. During the transition, the device communicates with the non-AP MLD as the target AP MLD, receiving forwarded data context from a current access point multi-link device (current AP MLD). It manages data transfer operations by forwarding uplink data from the current AP MLD to the non-AP MLD and transmitting downlink data directly to the non-AP MLD.

Abstract: This disclosure describes systems, methods, and devices related to KEK frame encryption. A device may identify, within a received authentication frame, a capability bit in a Robust Security Network Extension Element (RSNXE) indicating peer device support for Key Encryption Key (KEK) derivation during an authentication frame exchange. The device may derive the KEK during the authentication frame exchange based on mutual support for KEK derivation and derivation of a Pairwise Transient Key Security Association (PTKSA) during the exchange. The device may use a cryptographic key protection process for deriving the KEK. The device may encrypt a portion of the authentication frame using the derived KEK.

Abstract: A cross-shape transfer blade is configured to, in operation, be mounted or coupled to an end of a transfer robot arm (TRA). The cross-shape robot or transfer blade includes a plurality of raised regions to contact a backside of a workpiece or thin workpiece such that the cross-shape transfer blade supports and transports the respective workpeice between various locations within a semiconductor manufacturing plant (FAB). The cross-shape transfer blade includes a first prong structure, a second prong structure, a first wing structure, and a second wing structure. Respective ones of the plurality of raised regions are at corresponding ones of the first prong structure, the second prong structure, the first wing structure, and the second wing structure minimizing contact between the backside of the workpiece or thin workpiece and the cross-shape transfer blade when the workpiece or thin workpiece is being transferred, transported, and supported by the cross-shape transfer blade.

Abstract: A transfer method for micro flip chips includes forming a first bonding member on a surface of one side of a second electrical connection piece of each of a plurality of micro flip chips facing away from a temporary substrate to which they are adhered. The micro flip chips are transferred onto a drive substrate. The second electrical connection pieces of the micro flip chips are connected to a corresponding one of first electrical connection pieces of the drive substrate via the first bonding members. The micro flip chips are inspected to determine bad point positions of defective chips on the drive substrate. The first bonding member is irradiated at each bad point position by laser and the defective chip is removed. The method ensures stable bonding between the micro flip chips and the drive substrate and prevents the first electrical connection pieces from being damaged by laser irradiation.

Abstract: This disclosure describes systems, methods, and devices related to using encrypted 802.11 association. A device may identify a beacon received from an access point (AP), the beacon including an indication of an authentication and key manager (AKM); transmit, to the AP, an 802.11 authentication request including an indication of parameters associated with the AKM; identify an 802.11 authentication response received from the AP based on the 802.11 authentication request, the 802.11 authentication response including a message integrity check (MIC) using a key confirmation key (KCK) and an indication that the parameters have been selected by the AP; transmit, to the AP, an 802.11 association request encrypted by a security key based on an authenticator address of the AP; and identify an 802.11 association response received from the AP based on the 802.11 association request, the 802.11 association response encrypted by the security key.

Abstract: A computer implemented method manages execution of jobs on virtual machines. Processor units identify a job for scheduling. The processor units identify host machines with free cores on which the virtual machines are allocated. The processor units determine a number of free cores on the host machines. The processor units determine whether a host machine in the host machines having a number of host attributes needed by the job has free cores and idle cores available for backfilling the job based on a predicted core usage for the job in response to an absence of a sufficient number of free cores being available to meet predicted core usage. The processor units dispatch the job to a virtual machine on the host machine in response to the host machine having the number of host attributes and the free cores and idle cores available for backfilling the job.

Abstract: This disclosure describes systems, methods, and devices related to high throughput (HT) control information. A device may determine a frame comprising HT control information. The device may determine to extend a size of the HT control information. The device may cause to generate a management or data frame for sending to a first station device of one or more station devices, the management or data frame comprising extended high throughput (HT) control information, define a new control identification (ID) associated with the extended HT control information, and cause to send the management or data frame to the first station device.

Abstract: This disclosure describes systems, methods, and devices related to multi-link operation. A device may configure a single N×N transmit (TX)/receive (RX) radio to a plurality of 1×1 TX/RX radios, where N is a positive integer. The device may monitor a first channel of a plurality of channels to determine its availability. The device may monitor a second channel of the plurality of channels to determine its availability. The device may identify a first control frame received from an access point (AP) multi-link device (MLD) on the second channel. The device may cause to send a second control frame to the AP MLD on the second channel. The device may configure back to a single N×N TX/RX radio to receive a data frame.

Abstract: An electronic device and a display panel are provided. The display panel includes a substrate, a light-emitting unit, a blocking structure and an encapsulation layer. The substrate has a through hole, a display area, and a non-display area disposed between the through hole and the display area. The light-emitting unit is arranged on the display area. The blocking structure is arranged on the non-display area. The encapsulation layer extends from the display area to the non-display area, and includes an organic layer and a first inorganic layer. A portion of the organic layer is disposed between the blocking structure and the first inorganic layer.