Abstract: A fluidized-bed reactor for the chemical vapor deposition of a coating on a substrate surface is described. The reactor enables high rates of deposition and a highly homogeneous coating by modifying the boundary layer formed between the gasified reactive gas stream and the substrate. The boundary layer is minimized by the presence of an exhaust outlet placed in close proximity to the center of the surface of the substrate and/or the presence of a gas inlet capable of injecting a tangential stream of gas which results in a swirling radial flow of reactive gas. Methods of forming a metal coating on a surface of a substrate using the reactor are provided as well.