Abstract: A photomask includes a plurality of main patterns, a plurality of first sub-resolution assist feature patterns and a plurality of second sub-resolution assist feature patterns. The first sub-resolution assist feature patterns are located aside the main patterns. The second sub-resolution assist feature patterns are disposed between and connected to adjacent two of the first sub-resolution assist feature patterns.

Abstract: A foldable device may include a foldable layer and a hinge mechanism. The hinge mechanism may include at least one gear module that provides for synchronized movement of the hinge mechanism about a central plane of the hinge mechanism. A lock module may be coupled the hinge mechanism. The lock module may include a cam and a plate including a plurality of recesses. The lock module may selectively lock the hinge mechanism, and the foldable device, in one of a plurality of positions, based on a position of the cam in one of the recesses.

Abstract: An example computing device includes a flexible display coupled to a housing that includes a support plate having a first joint coupled to a first end of the support plate and a second joint coupled to a second end of the support plate. A slide module has a slot that guides a linear slide movement of the second joint along a linear path of movement within the slot as the support plate pivots about the first joint, where the support plate moves according to the first joint and the second joint to support at least the portion of the flexible display when the flexible display is unfolded and moves according to the first joint and the second joint to create a gap between at least a portion of the support plate and at least the portion of the flexible display when the flexible display is folded.

Abstract: Disclosed is a gripping mechanism including a first bracket, a second bracket, a first guide rod, a third bracket, an actuating module, a gripping block and two grippers. The second bracket is connected to the first bracket. The third bracket is connected to the second bracket. The actuating module is disposed on the third bracket. The gripping block is slidably disposed on the third bracket and is connected to the actuating module. The two grippers are fixed on the terminal end of the third bracket distal from the first bracket and the second bracket, wherein the gripping block is located between the actuating module and the two grippers and the actuating module is adapted to drive the gripping block to slide close to or slide away from the two grippers. A mobile robot is also disclosed.

Abstract: Disclosed is a gripping mechanism including a first bracket, a second bracket, a first guide rod, a third bracket, an actuating module, a gripping block and a gripper. The second bracket is pivotally connected to the first bracket. The first guide rod is fixed on the second bracket. The third bracket is slidably connected to the first guide rod. The actuating module is disposed on the third bracket. The gripping block is slidably disposed on the third bracket, wherein the gripping block is connected to the actuating module. The gripper is fixed on the third bracket, wherein the actuating module is located between the first guide rod and the gripping block, and the gripping block is located between the actuating module and the gripper. A mobile robot is also disclosed.

Abstract: A ring oscillator with an overstress solution is shown, which includes a plurality of oscillation units connected in a ring, and two capacitors. The first capacitor has a first terminal and a second terminal that are respectively coupled to a first node and a second node of the ring. The second node is an input terminal of a first-stage oscillation unit. The first node is an output terminal of a later-stage oscillation unit. The first signal at the first node is generated by inverting an input signal coupled to the input terminal of the first-stage oscillation unit an even number of times. The second capacitor is coupled between the second node and the ground terminal.

Abstract: A photomask includes a plurality of main patterns, a plurality of first sub-resolution assist feature patterns and a plurality of second sub-resolution assist feature patterns. The first sub-resolution assist feature patterns are located aside the main patterns. The second sub-resolution assist feature patterns are disposed between and connected to adjacent two of the first sub-resolution assist feature patterns.

Abstract: A foldable device may include a foldable layer and a hinge mechanism. The hinge mechanism may include at least one synchronizing module, at least one torsion module, and a cover module. The at least one synchronizing module may include a synchronizing gear assembly including a first linking gear in meshed engagement with a first rotating link, a second linking gear in meshed engagement with a second rotating link, and at least one intermediate gear in meshed engagement with the first linking gear and the second linking gear. The first rotating link may be coupled to a first housing of a computing device and the second rotating link may be coupled to a second housing of the computing device. The meshed engagement of the first and second rotating links may provide of synchronized, symmetric movement of the first and second housings about a central axis of the computing device.

Abstract: A coupled inductor including a first coil wound around a first pillar, a second coil wound around a second pillar, a gap magnetic body between the first coil and second coil and comprised of magnetic powders, a first magnetic body on the first coil opposite to the gap magnetic body, and a second magnetic body on the second coil opposite to the gap magnetic body, wherein the first magnetic body, first coil, gap magnetic body, second coil and second magnetic body are stacked sequentially in a first direction, and a ratio of a thickness of the gap magnetic body in the first direction to mean particle size D90 of the magnetic powders in gap magnetic body is between 2-30 or between 0-0.75.

Abstract: A photomask includes a plurality of main patterns, a plurality of first sub-resolution assist feature patterns and a plurality of second sub-resolution assist feature patterns. The first sub-resolution assist feature patterns are located aside the main patterns. The second sub-resolution assist feature patterns are disposed between and connected to adjacent two of the first sub-resolution assist feature patterns.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, an epitaxial layer, a well region, an insulating structure, an upper electrode layer, and a lower electrode layer. The substrate has the first conductivity type. The epitaxial layer is disposed on the substrate and has the first conductivity type. There is a protruding structure on the upper portion of the epitaxial layer. The well region is disposed in the epitaxial layer. The well region has the second conductivity type. The insulating structure is disposed on the sidewall of the protruding structure. The upper electrode layer surrounds the protruding structure and is electrically connected to the epitaxial layer and the well region. The lower electrode layer is disposed under the substrate and opposite to the epitaxial layer.

Abstract: Systems and methods are provided for scanning a dental impression to obtain a digital model of a patient's dentition as an input to computer aided design (CAD) and computer aided manufacturing (CAM) methods for producing dental prostheses.

Abstract: A microcontroller includes a setting unit, an encoder, a modulation circuit, and a digital-to-analog converter. The setting unit outputs a control signal. The encoder outputs a digital signal that is encoded. The modulation circuit loads at least one carrier signal on the digital signal at the logic high level and/or the logic low level according to the control signal to generate a modulated digital signal. The digital-to-analog converter converts the modulated digital signal into an analog signal, and outputs the analog signal for transmission.

Abstract: A control circuit and a method of calibrating a signal converter (such as DAC) are disclosed. The control circuit can be an existing control circuit, so no additional calibration circuit is required and the circuit area can be reduced. The control circuit can be an embedded microcontroller or other type of microcontroller. In general, the microcontroller includes an analog comparator and an arithmetic unit. With the combination of using the arithmetic unit to execute firmware program codes and using of the analog comparator, the control circuit is able to calibrate the signal converter.

Abstract: A signal generation circuit including a first control circuit, a second control circuit, an arbiter circuit, and a digital-to-analog converter (DAC) circuit is provided. The first control circuit stores a first string of data. The first control circuit enables a first trigger signal in response to a first event occurring. The second control circuit stores a second string of data. The second control circuit enables a second trigger signal in response to a second event occurring. The arbiter circuit reads the first or second control circuit according to the order of priority to use the first string of data or the second string of data as a digital input in response to the first and second trigger signals being enabled. The DAC circuit converts the digital input to generate an analog output.

Abstract: A method for identifying a signal transmission device includes: reading attribute information from a memory device by a first device of a signal processing system, wherein the attribute information records information regarding at least one attribute of the signal transmission device that is coupled between the first device and a second device of the signal processing system; determining the at least one attribute of the signal transmission device by the first device according to the attribute information; and setting a maximum value or a minimum value of a signal output by the first device or the second device according to the at least one attribute.

Abstract: An ultraviolet disinfection apparatus being integral to existing pipe system is provided, comprising a hollow body with at least two open ends and an arbitrary cross-section, a UV module and a control module. The hollow body is configured for receiving the UV module, and to communicate with at least one end of a pipe structure such that a medium passing therethrough will not leak. The hollow body has an inner surface and an outer surface; the inner surface includes one or more interior structures defined by one or more partition walls for sub-dividing hollow space of the hollow body into at least two relatively smaller hollow spaces. The UV module comprises one or more UV LED arrays arranged independently or severally on the inner surface and/or the interior structures to increase UV exposure to the medium. The control module is remotely connected to the UV module outside the hollow body.

Abstract: An example computing device includes a flexible display coupled to a housing that includes a support plate having a first joint coupled to a first end of the support plate and a second joint coupled to a second end of the support plate. A slide module has a slot that guides a linear slide movement of the second joint along a linear path of movement within the slot as the support plate pivots about the first joint, where the support plate moves according to the first joint and the second joint to support at least the portion of the flexible display when the flexible display is unfolded and moves according to the first joint and the second joint to create a gap between at least a portion of the support plate and at least the portion of the flexible display when the flexible display is folded.

Abstract: A phase shift mask suitable for forming a via pattern on a transferred object is provided. The phase shift mask has a first pattern region and a second pattern region. The phase shift mask includes a substrate and a phase shift pattern layer. The phase shift pattern layer is located on the substrate and is disposed corresponding to one of the first pattern region and the second pattern region. An optical phase difference corresponding to the first pattern region and the second pattern region is basically 180 degrees. The first pattern region has a via region away from the second pattern region. The second pattern region includes a plurality of strip patterns surrounding the via region.

Abstract: A control circuit and a method of calibrating a signal converter (such as DAC) are disclosed. The control circuit can be an existing control circuit, so no additional calibration circuit is required and the circuit area can be reduced. The control circuit can be an embedded microcontroller or other type of microcontroller. In general, the microcontroller includes an analog comparator and an arithmetic unit. With the combination of using the arithmetic unit to execute firmware program codes and using of the analog comparator, the control circuit is able to calibrate the signal converter.