Patents by Inventor Kai-Lin Chuang
Kai-Lin Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240137431Abstract: A packet sorting and reassembly circuit module, including a header parser, an information processing circuit, at least one state tracking and reassembly circuit, and an output arbiter, is provided. The header parser is configured to analyze multiple first packet segments to obtain header information corresponding to a first network packet, wherein the first network packet is transmitted based on a transmission control protocol (TCP) communication protocol. The information processing circuit is configured to transmit the first packet segments and sideband information corresponding to the first packet segments to a first state tracking and reassembly circuit among the at least one state tracking and reassembly circuit according to the header information. The first state tracking and reassembly circuit is configured to reassemble and sort the first packet segments according to the sideband information. The output arbiter is configured to output the first packet segments according to a sorting result.Type: ApplicationFiled: January 16, 2023Publication date: April 25, 2024Applicants: Chung Yuan Christian University, KGI Securities Co. Ltd.Inventors: Yu-Kuen Lai, Chao-Lin Wang, He-Ping Li, Cheng-Han Chuang, Kai-Po Chang
-
Publication number: 20230420520Abstract: In an embodiment, a device includes: first nanostructures; a first undoped semiconductor layer contacting a first dummy region of the first nanostructures; a first spacer on the first undoped semiconductor layer; a first source/drain region on the first spacer, the first source/drain region contacting a first channel region of the first nanostructures; and a first gate structure wrapped around the first channel region and the first dummy region of the first nanostructures.Type: ApplicationFiled: January 5, 2023Publication date: December 28, 2023Inventors: Tsung-Han Chuang, Zhi-Chang Lin, Shih-Cheng Chen, Jung-Hung Chang, Chien Ning Yao, Kai-Lin Chuang, Kuo-Cheng Chiang, Chih-Hao Wang
-
Publication number: 20230411527Abstract: A device includes a channel layer, a gate structure, a first source/drain epitaxial structure, a second source/drain epitaxial structure, and a sidewall spacer. The channel layer is over a substrate. The gate structure wraps around the channel layer. The first source/drain epitaxial structure and the second source/drain epitaxial structure are on opposite sides of the channel layer. The sidewall spacer is on a sidewall of the first source/drain epitaxial structure and includes a first dielectric layer and a second dielectric layer over the first dielectric layer and in contact with first source/drain epitaxial structure. The first dielectric layer and the second dielectric layer include different materials.Type: ApplicationFiled: June 17, 2022Publication date: December 21, 2023Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Shih-Cheng CHEN, Zhi-Chang LIN, Jung-Hung CHANG, Chien Ning YAO, Tsung-Han CHUANG, Kai-Lin CHUANG, Kuo-Cheng CHIANG
-
Publication number: 20230384211Abstract: A process tube device can detect the presence of any external materials that may reside within a fluid flowing in the tube. The process tube device detects the external materials in-situ which obviates the need for a separate inspection device to inspect the surface of a wafer after applying fluid on the surface of the wafer. The process tube device utilizes at least two methods of detecting the presence of external materials. The first is the direct measurement method in which a light detecting sensor is used. The second is the indirect measurement method in which a sensor utilizing the principles of Doppler shift is used. Here, contrary to the first method that at least partially used reflected or refracted light, the second method uses a Doppler shift sensor to detect the presence of the external material by measuring the velocity of the fluid flowing in the tube.Type: ApplicationFiled: July 28, 2023Publication date: November 30, 2023Inventors: Yu-Jen YANG, Chung-Pin CHOU, Yan-Cheng CHEN, Kai-Lin Chuang, Jun-Xiu Liu, Sheng-Ching Kao
-
Publication number: 20230369092Abstract: Some implementations described herein provide techniques and apparatuses for a semiconductor processing tool including an electrostatic chuck having a voltage-regulation system to regulate an electrical potential throughout regions of a semiconductor substrate positioned above the electrostatic chuck. The voltage-regulation system may determine that an electrical potential within a region of the semiconductor substrate does not satisfy a threshold. The voltage-regulation system may, based on determining that the electrical potential throughout the region does not satisfy the threshold, position one or more electrically-conductive pins within the region. While positioned within the region, the one or more electrically-conductive pins may change the electrical potential of the region.Type: ApplicationFiled: July 26, 2023Publication date: November 16, 2023Inventors: Chung-Pin CHOU, Kai-Lin CHUANG, Sheng-Wen HUANG, Yan-Cheng CHEN, Jun Xiu LIU
-
Patent number: 11764094Abstract: Some implementations described herein provide techniques and apparatuses for a semiconductor processing tool including an electrostatic chuck having a voltage-regulation system to regulate an electrical potential throughout regions of a semiconductor substrate positioned above the electrostatic chuck. The voltage-regulation system may determine that an electrical potential within a region of the semiconductor substrate does not satisfy a threshold. The voltage-regulation system may, based on determining that the electrical potential throughout the region does not satisfy the threshold, position one or more electrically-conductive pins within the region. While positioned within the region, the one or more electrically-conductive pins may change the electrical potential of the region.Type: GrantFiled: February 18, 2022Date of Patent: September 19, 2023Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chung-Pin Chou, Kai-Lin Chuang, Sheng-Wen Huang, Yan-Cheng Chen, Jun Xiu Liu
-
Publication number: 20230268215Abstract: Some implementations described herein provide techniques and apparatuses for a semiconductor processing tool including an electrostatic chuck having a voltage-regulation system to regulate an electrical potential throughout regions of a semiconductor substrate positioned above the electrostatic chuck. The voltage-regulation system may determine that an electrical potential within a region of the semiconductor substrate does not satisfy a threshold. The voltage-regulation system may, based on determining that the electrical potential throughout the region does not satisfy the threshold, position one or more electrically-conductive pins within the region. While positioned within the region, the one or more electrically-conductive pins may change the electrical potential of the region.Type: ApplicationFiled: February 18, 2022Publication date: August 24, 2023Inventors: Chung-Pin CHOU, Kai-Lin CHUANG, Sheng-Wen HUANG, Yan-Cheng CHEN, Jun Xiu LIU
-
Publication number: 20230178600Abstract: A method for forming a semiconductor device structure is provided. The semiconductor device structure includes a plurality of first nanostructures stacked over a substrate in a vertical direction. The semiconductor device structure includes a first bottom layer formed adjacent to the first nanostructures, and a first insulating layer formed over the first bottom layer. The semiconductor device structure includes a first source/drain (S/D) structure formed over the first insulating layer, and the first insulating layer is in direct contact with one of the first nanostructures.Type: ApplicationFiled: May 16, 2022Publication date: June 8, 2023Inventors: Tsung-Han Chuang, Zhi-Chang Lin, Shih-Cheng Chen, Jung-Hung Chang, Chien Ning Yao, Kai-Lin Chuang, Kuo-Cheng Chiang, Chih-Hao Wang
-
Publication number: 20230113269Abstract: A method for forming a semiconductor device structure is provided. The semiconductor device structure includes a plurality of first nanostructures stacked over a substrate in a vertical direction. The semiconductor device structure also includes a first bottom layer formed adjacent to the first nanostructures, and a first dielectric liner layer formed over the first bottom layer and adjacent to the first nanostructures. The semiconductor device structure further includes a first source/drain (S/D) structure formed over the first dielectric liner layer, and the first S/D structure is isolated from the first bottom layer by the first dielectric liner layer.Type: ApplicationFiled: March 3, 2022Publication date: April 13, 2023Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Jung-Hung CHANG, Zhi-Chang LIN, Shih-Cheng CHEN, Chien-Ning YAO, Tsung-Han CHUANG, Kai-Lin CHUANG, Kuo-Cheng CHIANG, Chih-Hao WANG
-
Publication number: 20230060183Abstract: A process tube device can detect the presence of any external materials that may reside within a fluid flowing in the tube. The process tube device detects the external materials in-situ which obviates the need for a separate inspection device to inspect the surface of a wafer after applying fluid on the surface of the wafer. The process tube device utilizes at least two methods of detecting the presence of external materials. The first is the direct measurement method in which a light detecting sensor is used. The second is the indirect measurement method in which a sensor utilizing the principles of Doppler shift is used. Here, contrary to the first method that at least partially used reflected or refracted light, the second method uses a Doppler shift sensor to detect the presence of the external material by measuring the velocity of the fluid flowing in the tube.Type: ApplicationFiled: August 30, 2021Publication date: March 2, 2023Inventors: Yu-Jen YANG, Chung-Pin CHOU, Kai-Lin CHUANG, Yan-Cheng CHEN, Sheng-Ching KAO, Jun-Xiu LIU
-
Publication number: 20220406632Abstract: An apparatus for inspecting a semiconductor substrate includes a rotatable base configured to support a substrate, and a nozzle arm includes a nozzle and a light monitoring device. The light monitoring device includes a laser transmitter and an array of light sensors arranged in the nozzle arm and facing the substrate. The light monitoring device is configured to transmit a laser pulse towards the substrate, wherein the laser pulse impinges on the substrate, receive a reflected laser pulse from the substrate, calculate whether one or more light sensors received the laser pulse, and calculate a distance between the light monitoring device and the substrate using the turnaround time for determining a process quality on the substrate.Type: ApplicationFiled: June 18, 2021Publication date: December 22, 2022Inventors: Chung-Pin CHOU, Kai-Lin CHUANG, Yan-Cheng CHEN, Jui Kuo LAI, Jun Xiu LIU
-
Publication number: 20220293443Abstract: A method of manufacturing a semiconductor device includes: receiving a workpiece on which the semiconductor device is manufactured; causing a nozzle to dispense a fluid toward a surface of the workpiece external to the nozzle, wherein the nozzle includes a first channel and a second channel that allow the fluid to flow through; emitting light, by a light source, from within the nozzle toward the surface while the nozzle is dispensing the fluid; receiving light reflected from the surface by a light sensor, the light source and the light sensor being disposed within the nozzle and opposite to each other, and the emitted light and the reflected light adapted to be contained within the fluid; and examining a status of the reflected light. The emitted light and the reflected light propagate in a direction parallel to a longitudinal axis of each of the first channel and the second channel.Type: ApplicationFiled: June 2, 2022Publication date: September 15, 2022Inventors: KAI-LIN CHUANG, TSUNG-CHI CHEN, PEI-JUNG CHANG, CHUN-WEI HUANG, JUN XIU LIU
-
Patent number: 11355370Abstract: A method of monitoring a fluid includes: applying the fluid from within a nozzle to a surface of a wafer outside of the nozzle; emitting light, by a light source, from the nozzle to the surface; receiving light reflected from the surface by a light sensor and causing the reflected light to propagate into the nozzle; and determining whether a variation of the fluid occurs according to the reflected light.Type: GrantFiled: December 10, 2019Date of Patent: June 7, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Kai-Lin Chuang, Tsung-Chi Chen, Pei-Jung Chang, Chun-Wei Huang, Jun Xiu Liu
-
Patent number: 11107671Abstract: A method includes disposing a semiconductor substrate over a chuck. The chuck has a plurality of holes therein. The semiconductor substrate has a first surface facing the chuck and a second surface opposite thereto. A liquid layer is formed flowing over a top surface of the chuck by supplying liquid to the top surface of the chuck through the holes of the chuck. The semiconductor substrate is moved toward the chuck such that the first surface of the semiconductor substrate is in contact with the liquid layer and the liquid layer flows between the first surface of the semiconductor substrate and the top surface of the chuck.Type: GrantFiled: April 22, 2019Date of Patent: August 31, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Wei-Chih Hsu, Kai-Lin Chuang, Yuan-Chi Chien, Jeng-Huei Yang, Jun-Xiu Liu
-
Publication number: 20200118852Abstract: A method of monitoring a fluid includes: applying the fluid from within a nozzle to a surface of a wafer outside of the nozzle; emitting light, by a light source, from the nozzle to the surface; receiving light reflected from the surface by a light sensor and causing the reflected light to propagate into the nozzle; and determining whether a variation of the fluid occurs according to the reflected light.Type: ApplicationFiled: December 10, 2019Publication date: April 16, 2020Inventors: KAI-LIN CHUANG, TSUNG-CHI CHEN, PEI-JUNG CHANG, CHUN-WEI HUANG, JUN XIU LIU
-
Patent number: 10504758Abstract: A nozzle for emitting a fluid comprises a channel, a light source and a light sensor. The channel is configured to flow the fluid. The light source is configured to emit light towards a surface on which the fluid is applied and the light sensor is configured to receive reflected light from the surface.Type: GrantFiled: February 14, 2014Date of Patent: December 10, 2019Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Kai-Lin Chuang, Tsung-Chi Chen, Pei-Jung Chang, Chun-Wei Huang, Jun Xiu Liu
-
Publication number: 20190252181Abstract: A method includes disposing a semiconductor substrate over a chuck. The chuck has a plurality of holes therein. The semiconductor substrate has a first surface facing the chuck and a second surface opposite thereto. A liquid layer is formed flowing over a top surface of the chuck by supplying liquid to the top surface of the chuck through the holes of the chuck. The semiconductor substrate is moved toward the chuck such that the first surface of the semiconductor substrate is in contact with the liquid layer and the liquid layer flows between the first surface of the semiconductor substrate and the top surface of the chuck.Type: ApplicationFiled: April 22, 2019Publication date: August 15, 2019Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Wei-Chih HSU, Kai-Lin CHUANG, Yuan-Chi CHIEN, Jeng-Huei YANG, Jun-Xiu LIU
-
Patent number: 10269557Abstract: An apparatus of processing a semiconductor substrate include a chuck, a holder, a liquid supplying system and a positive pressure unit. The chuck has a principal surface and at least a hole formed thereon. The holder is capable of holding a semiconductor substrate at a position above the principal surface. The liquid supplying system is configured to provide a liquid film onto the principal surface through the hole. The positive pressure unit is configured for providing a gas flow to a space over the chuck. A method of processing a semiconductor substrate is disclosed herein as well.Type: GrantFiled: October 20, 2015Date of Patent: April 23, 2019Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Wei-Chih Hsu, Kai-Lin Chuang, Yuan-Chi Chien, Jeng-Huei Yang, Jun-Xiu Liu
-
Publication number: 20170110315Abstract: An apparatus of processing a semiconductor substrate include a chuck, a holder, a liquid supplying system and a positive pressure unit. The chuck has a principal surface and at least a hole formed thereon. The holder is capable of holding a semiconductor substrate at a position above the principal surface. The liquid supplying system is configured to provide a liquid film onto the principal surface through the hole. The positive pressure unit is configured for providing a gas flow to a space over the chuck. A method of processing a semiconductor substrate is disclosed herein as well.Type: ApplicationFiled: October 20, 2015Publication date: April 20, 2017Inventors: Wei-Chih HSU, Kai-Lin CHUANG, Yuan-Chi CHIEN, Jeng-Huei YANG, Jun-Xiu LIU
-
Patent number: 9316901Abstract: A method for forming patterns includes the following steps. A first layout including a first target pattern and a first unprintable dummy pattern is provided. A second layout including a second target pattern and a second printable dummy pattern are provided, wherein at least part of the second printable dummy pattern overlaps the first unprintable dummy pattern exposure limit, such that the second printable dummy pattern cannot be formed in a wafer.Type: GrantFiled: April 23, 2014Date of Patent: April 19, 2016Assignee: UNITED MICROELECTRONICS CORP.Inventors: Hsin-Yu Chen, Chia-Wei Huang, Chun-Hsien Huang, Shih-Chun Tsai, Kai-Lin Chuang