Patents by Inventor Kai Paschkowski

Kai Paschkowski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10800957
    Abstract: Solvent-free polyurethane hot melt adhesives which can be obtained by reacting a composition including a polyether polyol, a polyester polyol, at least one poly(meth)acrylate, and one or more fillers, selected from kaolin, fumed silica, soot, and wollastonite, with a polyisocyanate. In comparison to similar adhesives without a filler content, the adhesives are characterized by significantly improved heat resistance properties while the remaining properties are comparable. Furthermore, in some cases, improved mechanical properties, such as an improved tear strength, could be observed by adding the fillers. The aforementioned hot melt adhesive compositions are therefore suitable in particular for applications in automotive construction, in the textile industry, and in the packaging industry, and in particular for adhering sandwich panels.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: October 13, 2020
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Martin Schmider, Kai Paschkowski, Jörg Plaumann
  • Patent number: 10767083
    Abstract: A hot-melt glue composition, including a) at least one atactic poly-?-olefin (APAO) that is solid at 25° C.; b) at least one hydrocarbon resin having a softening point of at least 80° C., measured in accordance with the ring-and-ball method according to DIN EN 1238; and c) at least one maleic-anhydride-grafted wax having a softening point of not more than 150° C., measured in accordance with the ring-and-ball method according to DIN EN 1238, which is a maleic-anhydride-grafted polypropylene wax or a maleic-anhydride-grafted polyethylene wax, wherein the proportion of the at least one maleic-anhydride-grafted wax in the hot-melt glue composition is at least 3 wt %. The hot-melt glue composition is characterized by a low reactivation temperature, together with high heat resistance and good adhesion to ABS and nonpolar polyolefin materials. The hot-melt glue composition is well suited for film lamination by vacuum deep-drawing lamination, in particular for applications in automobile construction.
    Type: Grant
    Filed: September 13, 2016
    Date of Patent: September 8, 2020
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Doreen Janke, Kai Paschkowski, Mathias Cordes, Dirk Urbach
  • Publication number: 20180346775
    Abstract: Solvent-free polyurethane hot melt adhesives which can be obtained by reacting a composition including a polyether polyol, a polyester polyol, at least one poly(meth)acrylate, and one or more fillers, selected from kaolin, fumed silica, soot, and wollastonite, with a polyisocyanate. In comparison to similar adhesives without a filler content, the adhesives are characterized by significantly improved heat resistance properties while the remaining properties are comparable. Furthermore, in some cases, improved mechanical properties, such as an improved tear strength, could be observed by adding the fillers. The aforementioned hot melt adhesive compositions are therefore suitable in particular for applications in automotive construction, in the textile industry, and in the packaging industry, and in particular for adhering sandwich panels.
    Type: Application
    Filed: December 21, 2016
    Publication date: December 6, 2018
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Martin SCHMIDER, Kai PASCHKOWSKI, Jörg PLAUMANN
  • Publication number: 20180251660
    Abstract: A hot-melt glue composition, including a) at least one atactic poly-?-olefin (APAO) that is solid at 25° C.; b) at least one hydrocarbon resin having a softening point of at least 80° C., measured in accordance with the ring-and-ball method according to DIN EN 1238; and c) at least one maleic-anhydride-grafted wax having a softening point of not more than 150° C., measured in accordance with the ring-and-ball method according to DIN EN 1238, which is a maleic-anhydride-grafted polypropylene wax or a maleic-anhydride-grafted polyethylene wax, wherein the proportion of the at least one maleic-anhydride-grafted wax in the hot-melt glue composition is at least 3 wt %. The hot-melt glue composition is characterized by a low reactivation temperature, together with high heat resistance and good adhesion to ABS and nonpolar polyolefin materials. The hot-melt glue composition is well suited for film lamination by vacuum deep-drawing lamination, in particular for applications in automobile construction.
    Type: Application
    Filed: September 13, 2016
    Publication date: September 6, 2018
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Doreen JANKE, Kai PASCHKOWSKI, Mathias CORDES, Dirk URBACH
  • Patent number: 9982173
    Abstract: A moisture-cured hot-melt adhesive can be formulated as a PUR-HM that is R-40 classification-free and stable during storage and processing, having a residual monomer content of less than 1 wt. % and having good cross-linking density and full-curing speed. The hot-melt adhesive is particularly suitable for vehicle construction in industrial manufacture, in particular of automobiles, in the textile or furniture industry or in the packaging industry.
    Type: Grant
    Filed: March 5, 2015
    Date of Patent: May 29, 2018
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Doreen Janke, Mathias Cordes, Kai Paschkowski
  • Patent number: 9932502
    Abstract: A hot melt adhesive composition is provided which contains at least one silane group-containing thermoplastic poly-?-olefin which is solid at 25° C. and at least one paraffin wax. The hot melt adhesive composition has only low adhesion to uncoated aluminum tool surfaces, wherein at the same time they have high final strengths and thermal stabilities comparable to conventional adhesives, as well as good resistance to environmental influences. The hot melt adhesive is suitable as a laminating adhesive for laminating films made of thermoplastic olefins, which have sufficient stability for subsequent deep-draw lamination.
    Type: Grant
    Filed: May 12, 2015
    Date of Patent: April 3, 2018
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Doreen Janke, Kai Paschkowski
  • Publication number: 20170002239
    Abstract: A moisture-cured hot-melt adhesive can be formulated as a PUR-HM that is R-40 classification-free and stable during storage and processing, having a residual monomer content of less than 1 wt. % and having good cross-linking density and full-curing speed. The hot-melt adhesive is particularly suitable for vehicle construction in industrial manufacture, in particular of automobiles, in the textile or furniture industry or in the packaging industry.
    Type: Application
    Filed: March 5, 2015
    Publication date: January 5, 2017
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Doreen JANKE, Mathias CORDES, Kai PASCHKOWSKI
  • Patent number: 9375895
    Abstract: The present invention relates to hotmelt adhesive compositions which comprise at least one thermoplastic, silane-grafted poly-?-olefin which is solid at 25° C. and at least one soft resin having a melting point or softening point between ?10° C. and 40° C. These hotmelt adhesive compositions are suitable in particular as laminating adhesives and, even in thin layers, have an extended open time but nevertheless build up a high early strength rapidly and lead to a heat-stable adhesive bond.
    Type: Grant
    Filed: April 28, 2009
    Date of Patent: June 28, 2016
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Kai Paschkowski, Mathias Cordes
  • Patent number: 9359534
    Abstract: A hot-melt adhesive composition, the use thereof, and a composite body including the hot-melt adhesive composition. The hot-melt adhesive composition includes a polyolefin P, which is solid at 25° C., a soft resin WH with a softening point between ?10° C. and 40° C., and a polar modified polyolefin wax PW.
    Type: Grant
    Filed: February 27, 2012
    Date of Patent: June 7, 2016
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Dirk Urbach, Kai Paschkowski, Martin Linnenbrink
  • Publication number: 20150240135
    Abstract: A hot melt adhesive composition is provided which contains at least one silane group-containing thermoplastic poly-?-olefin which is solid at 25° C. and at least one paraffin wax. The hot melt adhesive composition has only low adhesion to uncoated aluminum tool surfaces, wherein at the same time they have high final strengths and thermal stabilities comparable to conventional adhesives, as well as good resistance to environmental influences. The hot melt adhesive is suitable as a laminating adhesive for laminating films made of thermoplastic olefins, which have sufficient stability for subsequent deep-draw lamination.
    Type: Application
    Filed: May 12, 2015
    Publication date: August 27, 2015
    Applicant: Sika Technology AG
    Inventors: Doreen JANKE, Kai PASCHKOWSKI
  • Publication number: 20150232721
    Abstract: Described is moisture-reactive hot-melt adhesive compounds, including at least one polyurethane polymer P which is solid at room temperature and which has isocyanate groups, at least one polyaldimine ALD of the formula (Ia) or (Ib), and at least one acid K in the form of an organic monocarbon acid, or dicarbon acid, or an organic monosulphonic acid, or disulphonic acid, or a compound which can be hydrolyzed to give one of these acids. These hot-melt adhesive compounds cure without bubbles and exhibit exceptionally quick crosslinking speed and good strength after crosslinking.
    Type: Application
    Filed: May 1, 2015
    Publication date: August 20, 2015
    Inventors: Urs Burckhardt, Kai Paschkowski, Martin Linnenbrink, Sven Rosenau
  • Publication number: 20150225629
    Abstract: Hot-melt adhesive compositions are described that have at least one thermoplastic poly-?-olefin that is solid at 25° C. and silane groups, at least one thermoplastic poly-?-olefin that is solid at 25° C. and that does not contain silane groups, and at least one resin that is tackifying at 25° C. The product of the content of the thermoplastic poly-?-olefin with respect to the weight and the degree of grafting of the thermoplastic poly-?-olefin is ?0.06. In comparison to conventional hot-melt adhesive compositions based on poly-?-olefins, the described hot-melt adhesive compositions are characterized in that the hot-melt adhesive compositions can be reactivated after the processing and cross-linking. That is, the compositions can be put into a liquid or soft state by means of heat and pressure and can be processed well again.
    Type: Application
    Filed: September 11, 2013
    Publication date: August 13, 2015
    Inventors: Kai Paschkowski, Doreen Janke
  • Patent number: 8932721
    Abstract: The present invention relates to laminates of a plasticizer-containing plastic, obtained by bonding by means of a moisture-reactive hot-melt adhesive which comprises at least one aldimine and at least one polyurethane polymer which contains isocyanate groups and is solid at room temperature. The bonded assembly is notable for improved adhesive, particularly following heat/moisture storage or alternating storage. Preferred embodiments of such laminates are bonded films or film-laminated supports, the film preferably being a pPVC film.
    Type: Grant
    Filed: December 9, 2011
    Date of Patent: January 13, 2015
    Assignee: Sika Technology AG
    Inventors: Kai Paschkowski, Doreen Janke, Urs Burckhardt, Mario Slongo
  • Patent number: 8865822
    Abstract: A hot melt adhesive composition including a) at least one thermoplastic silane grafted poly-?-olefin that is solid at 25° C.; and b) at least one reaction product of a polyisocyanate having an isocyanate-reactive silane, wherein the isocyanate-reactive silane includes exactly one group reactive to an isocyanate group, selected from a hydroxyl group, a mercapto group, and an amino group, and wherein the reaction product includes a molecular weight Mw of less than 1500 g/mol.
    Type: Grant
    Filed: June 18, 2012
    Date of Patent: October 21, 2014
    Assignee: SIKA Technology AG
    Inventors: Kai Paschkowski, Doreen Janke
  • Patent number: 8673089
    Abstract: Methods of using an aldimine of formula (I) as cleaning agent or ingredient of a cleaning agent composition for reactive polyurethane compositions, especially for reactive polyurethane hot melt adhesives. It has been found that such cleaning agents can greatly reduce the quantity of wastes and in particular mixtures of blocked and nonblocked reactive polyurethane compositions can be used without problem for gluing, without the gluing being negatively influenced in its properties, especially its thermal stability.
    Type: Grant
    Filed: November 26, 2010
    Date of Patent: March 18, 2014
    Assignee: Sika Technology AG
    Inventors: Doreen Janke, Kai Paschkowski
  • Patent number: 8398809
    Abstract: The present invention relates to innovative amorphous polyurethane polymers of the formula (I) and also to hotmelt adhesive compositions based on them. The compositions are notable for greatly improved dimensional stability after application, and are ideally suited to the adhesive bonding of transparent substrates. The polymers are notable for rapid, bubble-free curing.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: March 19, 2013
    Assignee: Sika Technology AG
    Inventors: Doreen Janke, Kai Paschkowski
  • Patent number: 8389647
    Abstract: The present invention relates to a laminating adhesive composition, which contains a reaction product which contains isocyanate groups and which is obtained from the reaction of at least two specific polyester polyols, solid at room temperature, and a polyisocyanate. Particularly in the case of three-dimensionally deformed support material surfaces, the laminating adhesive compositions permit removal from the laminating mold at an elevated temperature.
    Type: Grant
    Filed: February 26, 2009
    Date of Patent: March 5, 2013
    Assignee: Sika Technology AG
    Inventor: Kai Paschkowski
  • Publication number: 20120315491
    Abstract: A hot melt adhesive composition including a) at least one thermoplastic silane grafted poly-?-olefin that is solid at 25° C.; and b) at least one reaction product of a polyisocyanate having an isocyanate-reactive silane, wherein the isocyanate-reactive silane includes exactly one group reactive to an isocyanate group, selected from a hydroxyl group, a mercapto group, and an amino group, and wherein the reaction product includes a molecular weight Mw of less than 1500 g/mol.
    Type: Application
    Filed: June 18, 2012
    Publication date: December 13, 2012
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Kai Paschkowski, Doreen Janke
  • Publication number: 20120245069
    Abstract: Methods of using an aldimine of formula (I) as cleaning agent or ingredient of a cleaning agent composition for reactive polyurethane compositions, especially for reactive polyurethane hot melt adhesives. It has been found that such cleaning agents can greatly reduce the quantity of wastes and in particular mixtures of blocked and nonblocked reactive polyurethane compositions can be used without problem for gluing, without the gluing being negatively influenced in its properties, especially its thermal stability.
    Type: Application
    Filed: November 26, 2010
    Publication date: September 27, 2012
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Doreen Janke, Kai Paschkowski
  • Patent number: 8263226
    Abstract: The present invention relates to moisture-curing hotmelt adhesive compositions which comprise at least one silane-functional polyurethane prepolymer of the formula (I). The compositions have neither heating nor curing bubbles and feature an exceptional viscosity stability at high temperatures. These hotmelt adhesives are therefore suitable especially for industrial manufacture and especially of transparent materials.
    Type: Grant
    Filed: December 22, 2006
    Date of Patent: September 11, 2012
    Assignee: Sika Technology AG
    Inventors: Sven Rosenau, Kai Paschkowski, Urs Burckhardt