Patents by Inventor Kai Paschkowski

Kai Paschkowski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120171466
    Abstract: A hot-melt adhesive composition, the use thereof, and a composite body including the hot-melt adhesive composition. The hot-melt adhesive composition includes a polyolefin P, which is solid at 25° C., a soft resin WH with a softening point between ?10° C. and 40° C., and a polar modified polyolefin wax PW.
    Type: Application
    Filed: February 27, 2012
    Publication date: July 5, 2012
    Applicant: Sika Technology AG
    Inventors: Dirk URBACH, Kai PASCHKOWSKI, Martin LINNENBRINK
  • Publication number: 20120107616
    Abstract: The present invention relates to laminates of a plasticizer-containing plastic, obtained by bonding by means of a moisture-reactive hot-melt adhesive which comprises at least one aldimine and at least one polyurethane polymer which contains isocyanate groups and is solid at room temperature. The bonded assembly is notable for improved adhesive, particularly following heat/moisture storage or alternating storage. Preferred embodiments of such laminates are bonded films or film-laminated supports, the film preferably being a pPVC film.
    Type: Application
    Filed: December 9, 2011
    Publication date: May 3, 2012
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Kai PASCHKOWSKI, Doreen JANKE, Urs BURCKHARDT, Mario SLONGO
  • Patent number: 8084527
    Abstract: The present invention relates to hotmelt adhesive compositions which comprise at least one thermoplastic polyolefin (P) which is solid at 25° C., and also at least one amide (A) of the formula (I) or (II). These hotmelt adhesive compositions are suitable more particularly for the adhesive bonding of polyolefin films. More particularly it is possible to form assemblies of a substrate (S) and polyolefins bonded with a hotmelt adhesive.
    Type: Grant
    Filed: November 12, 2008
    Date of Patent: December 27, 2011
    Assignee: Sika Technology AG
    Inventors: Kai Paschkowski, Joerg Plaumann
  • Publication number: 20110250012
    Abstract: A method is disclosed for manufacturing a roadway structure. To provide a good bond between plastic film and a bitumen-based support layer, an adhesive layer is provided that includes at least one fibrous material layer and one thermoplastic that is solid at room temperature. This method can allow for a rapid and efficient formation of a roadway structure.
    Type: Application
    Filed: May 27, 2011
    Publication date: October 13, 2011
    Applicant: Sika Technology AG
    Inventors: Kai PASCHKOWSKI, Dirk Urbach, Raphael Teysseire, Martin Linnenbrink
  • Publication number: 20110020634
    Abstract: The present invention relates to hotmelt adhesive compositions which comprise at least one thermoplastic, silane-grafted poly-?-olefin which is solid at 25° C. and at least one soft resin having a melting point or softening point between ?10° C. and 40° C. These hotmelt adhesive compositions are suitable in particular as laminating adhesives and, even in thin layers, have an extended open time but nevertheless build up a high early strength rapidly and lead to a heat-stable adhesive bond.
    Type: Application
    Filed: April 28, 2009
    Publication date: January 27, 2011
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Kai Paschkowski, Mathias Cordes
  • Publication number: 20100291368
    Abstract: The present invention relates to moisture-reactive hot-melt adhesive compounds, comprising at least one polyurethane polymer P which is solid at room temperature and which has isocyanate groups, at least one polyaldimine ALD of the formula (Ia) or (Ib), and at least one acid K in the form of an organic monocarbon acid, or dicarbon acid, or an organic monosulphonic acid, or disulphonic acid, or a compound which can be hydrolyzed to give one of these acids. These hot-melt adhesive compounds cure without bubbles and exhibit exceptionally quick crosslinking speed and good strength after crosslinking.
    Type: Application
    Filed: November 16, 2007
    Publication date: November 18, 2010
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Urs Burckhardt, Kai Paschkowski, Martin Linnenbrink, Sven Rosenau
  • Patent number: 7741425
    Abstract: The invention relates to relates to moisture-hardened hot melt adhesive which contains at least one polyurethane polymer of formula (I) which comprises aldimine groups and which is solid at room temperature, in addition to at least one polyurethane polymer P which comprises isocyanate groups, if q in formula (I) represents zero, or if X in formula (I) represents N—R8 with R8 as a substituent of formula (III). The compositions are characterised in that contain visibly less isocyanate monomers and are therefor particularly advantageous from a work-hygiene point of view.
    Type: Grant
    Filed: September 29, 2006
    Date of Patent: June 22, 2010
    Assignee: Sika Technology AG
    Inventors: Urs Burckhardt, Kai Paschkowski, Martin Linnenbrink, Doreen Janke
  • Publication number: 20100040894
    Abstract: The present invention relates to moisture-curing hotmelt adhesive compositions which comprise at least one silane-functional polyurethane prepolymer of the formula (I). The compositions have neither heating nor curing bubbles and feature an exceptional viscosity stability at high temperatures. These hotmelt adhesives are therefore suitable especially for industrial manufacture and especially of transparent materials.
    Type: Application
    Filed: December 22, 2006
    Publication date: February 18, 2010
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Sven Rosenau, Kai Paschkowski, Urs Burckhardt
  • Publication number: 20100006221
    Abstract: The present invention relates to innovative amorphous polyurethane polymers of the formula (I) and also to hotmelt adhesive compositions based on them. The compositions are notable for greatly improved dimensional stability after application, and are ideally suited to the adhesive bonding of transparent substrates. The polymers are notable for rapid, bubble-free curing.
    Type: Application
    Filed: June 30, 2009
    Publication date: January 14, 2010
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Doreen Janke, Kai Paschkowski
  • Publication number: 20090214875
    Abstract: The present invention relates to a laminating adhesive composition which contains a reaction product which contains isocyanate groups and which is obtained from the reaction of at least two specific polyester polyols, solid at room temperature, and a polyisocyanate. Particularly in the case of three-dimensionally deformed support material surfaces, the laminating adhesive compositions permit removal from the laminating mould at an elevated temperature.
    Type: Application
    Filed: February 26, 2009
    Publication date: August 27, 2009
    Applicant: SIKA TECHNOLOGY AG
    Inventor: Kai Paschkowski
  • Publication number: 20090142610
    Abstract: The present invention relates to hotmelt adhesive compositions which comprise at least one thermoplastic polyolefin (P) which is solid at 25° C., and also at least one amide (A) of the formula (I) or (II). These hotmelt adhesive compositions are suitable more particularly for the adhesive bonding of polyolefin films. More particularly it is possible to form assemblies of a substrate (S) and polyolefins bonded with a hotmelt adhesive.
    Type: Application
    Filed: November 12, 2008
    Publication date: June 4, 2009
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Kai Paschkowski, Joerg Plaumann
  • Publication number: 20080280145
    Abstract: The present invention relates to laminates of a plasticizer-containing plastic, obtained by bonding by means of a moisture-reactive hot-melt adhesive which comprises at least one aldimine and at least one polyurethane polymer which contains isocyanate groups and is solid at room temperature. The bonded assembly is notable for improved adhesive, particularly following heat/moisture storage or alternating storage. Preferred embodiments of such laminates are bonded films or film-laminated supports, the film preferably being a pPVC film.
    Type: Application
    Filed: May 2, 2008
    Publication date: November 13, 2008
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Kai Paschkowski, Doreen Scheidler, Urs Burckhardt, Mario Slongo
  • Publication number: 20080251204
    Abstract: The invention relates to relates to moisture-hardened hot melt adhesive which contains at least one polyurethane polymer of formula (I) which comprises aldimine groups and which is solid at room temperature, in addition to at least one polyurethane polymer P which comprises isocyanate groups, if q in formula (I) represents zero, or if X in formula (I) represents N—R8 with R8 as a substituent of formula (III). The compositions are characterised in that contain visibly less isocyanate monomers and are therefor particularly advantageous from a work-hygiene point of view.
    Type: Application
    Filed: September 29, 2006
    Publication date: October 16, 2008
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Urs Burckhardt, Kai Paschkowski, Martin Linnenbrink, Doreen Scheidler