Abstract: A method and a pattern for reducing interconnect failures are described. The method and pattern are used for a multilevel structure of metal/dielectric/metal. At least one assistant pattern is attached to one metal layer of the multilevel structure. A thermal stress gradient resulting from the assistant pattern can collect vacancies of the metal layer, so as to prevent stress-induced voids from generating at the bottom of a via plug which connects the two metal layers.

Abstract: Methods and apparatus for forming a semiconductor structure comprising a first layer on top of a substrate wherein the first layer defines conductive regions such as copper interconnect lines and non-conductive regions such as dielectric materials. The conductive regions are covered by a second layer of a material different than the first layer such as for example nickel and then the structure is heat treated such that the interconnect lines and second metal, such as a copper interconnect line and a nickel second layer, interact with each other to form an alloy layer. The alloy layer has superior qualities for adhering to both the copper interconnect lines and a subsequently deposited dielectric material.

Abstract: In a method of forming an integrated circuit, a sacrificial layer is formed over a substrate. The sacrificial layer has a gate trench formed therein and a first layer of a first material formed over the substrate in the gate trench. A second layer of a second material is formed over the first layer in the gate trench. The first and second layers are processed to form a layer of a high-K dielectric material.

Abstract: A computer system includes at least a server procedure and a client processor. The client processor includes plural applications which issue requests for execution of server procedures. A queue is present in the client processor and lists the requests. The client processor also includes plural input/output procedures which enable dispatch of requests to the server procedure. The client processor operates in conjunction with the I/O procedures, removes a request from the queue, and dispatches the request to the server procedure. The processor responds to occurrence of a time-out, with no response being received from the server procedure, to place the current request at the beginning of the queue so as to enable the I/O procedure to service a further request from the queue.