Abstract: A cooling system of server includes a tank and a pressure control device. The tank is configured to accommodate a dielectric fluid. The pressure control device is configured to regulate the pressure of the tank. The pressure control device includes a condenser, a dehumidifier, a gas storage chamber, and a valve. The condenser is connected to the tank. The dehumidifier is connected to the condenser. The gas storage chamber is connected to the dehumidifier. The valve is connected between the dehumidifier and the gas storage chamber. The valve is configured to communicate and not to communicate the dehumidifier and the gas storage chamber.

Abstract: A condenser includes a casing and pipes. The casing includes an inlet chamber, an outlet chamber, a first inlet, a first outlet, an accommodation space, a second inlet, and a second outlet. The first inlet and the first outlet are respectively in fluid communication with the inlet chamber and the outlet chamber. The accommodation space accommodates a coolant, and the second inlet and the second outlet are in fluid communication with the accommodation space not in fluid communication with the inlet chamber and the outlet chamber. The pipes are in the accommodation space and connect the inlet chamber with the outlet chamber, and a working fluid flows from the inlet chamber to the outlet chamber via the pipes. The first inlet is located closer to the second outlet than the first outlet, and the first outlet is located closer to the second inlet than the first inlet.

Abstract: A liquid level controlling apparatus includes a plurality of main sinks, a storage sink, a pump and a connection tube. One of the plurality of main sinks includes a transmission port and a first liquid level detector. The storage sink includes a delivery port and a second liquid level detector. The pump includes an outlet and an inlet. The connection tube includes an rehydration tube and an drain tube. The rehydration tube has a first rehydration section and a second rehydration section. The first rehydration section is connected between the delivery port and the inlet. The second rehydration section is connected between the outlet and the transmission port. The drain tube has a first drain section and a second drain section. The first drain section is connected between the transmission port and the inlet. The second drain section is connected between the outlet and the delivery port.

Abstract: A liquid level controlling system includes a main sink, a storage sink and a connection tube. The main sink includes a transmission port and a first liquid level detector. The transmission port is formed on a bottom of the main sink. The first liquid level detector is disposed on a top of the main sink. The storage sink includes a liquid outlet, a liquid inlet and a second liquid level detector. The connection tube is disposed between the main sink and the storage sink. The connection tube includes an rehydration tube and an drain tube. Two ends of the rehydration tube are respectively connected to the transmission port and the liquid outlet. Two ends of the drain tube are respectively connected to the transmission port and the liquid inlet.

Abstract: A rack temperature controlling method includes performing the following operations through a controller: obtaining a rack temperature data, calculating a temperature variant according to the rack temperature data, calculating a temperature deviation according to the temperature variant and a reference temperature, calculating a target speed according to the temperature deviation, and adjusting a speed of a fan to the target speed. A rack temperature controlling system including a thermometer and a controller is further provided. The thermometer measures and outputs a rack temperature data. The controller receives the rack temperature data, and calculates a temperature variant according to the rack temperature data. The controller further calculates a temperature deviation according to the temperature variant and a reference temperature, calculates a target speed according to the temperature deviation, and adjusts a speed of a fan to the target speed.

Abstract: A fan control method for controlling a set of fans of a system includes collecting M first sets of characteristic variables of a first period; inputting the M first sets of characteristic variables to a neural network to generate N third sets of characteristic variables of a second period corresponding to a second set of characteristic variables; adjusting the second set of characteristic variables to generate P adjusted second sets of characteristic variables to accordingly generate Q adjusted third sets of characteristic variables; generating an optimized second set of characteristic variables according to the N third sets of characteristic variables and the Q adjusted third sets of characteristic variables; generating a set of weights according to the optimized second set of characteristic variables; and controlling the set of fans according to the set of weights. The first period precedes the second period. M, N, P, Q are positive integers.

Abstract: An immersion cooling system and level control method thereof, comprising: provide a main tank with a first upper/lower level limit and a storage tank with a second upper/lower level limit, the connection site of the main tank is higher than that of the storage tank and the first upper level limit; measure the level of the two tanks; when the level of the main tank is lower than the first lower level limit and the level of the storage tank is higher than the second lower level limit, open a first valve and a pump so that the liquid is input into the main tank; and when the level of the main tank is higher than the first upper level limit and the level of the storage tank is not higher than the second upper level limit, open the second valve to allow liquid to enter the storage tank.

Abstract: A cooling system of server includes a tank, a case body, a multi-hole box, a first dehumidifying material, a first tube, and a second tube. The tank is configured to accommodate a dielectric fluid. The multi-hole box is disposed in the case body. The first dehumidifying material is disposed in the multi-hole box. The first tube includes a first gas-inlet/outlet end and a second gas-inlet/outlet end respectively connected to the tank and the case body. The second gas-inlet/outlet end is connected to the first dehumidifying material. The second tube includes a liquid-inlet end and a liquid-outlet end respectively connected to the case body and the tank.

Abstract: An electronic device connected to external heat dissipation device and including chassis, heat source, and heat dissipation assembly. Heat dissipation assembly includes evaporator, tubing, and liquid-cooling plate. Evaporator is in thermal contact with heat source. Tubing includes evaporation portion and condensation portion. Evaporation portion is in fluid communication with condensation portion and in thermal contact with evaporator. Liquid-cooling plate is disposed on chassis and spaced apart from heat source. Liquid-cooling plate includes liquid-cooling accommodation space and is configured to be in fluid communication with external heat dissipation device. Condensation portion is located in liquid-cooling accommodation space. Condensation portion includes first tube part, second tube part and connecting tube parts. Two opposite ends of each connecting tube part are respectively in fluid communication with first and second tube parts. Connecting tube parts are connected in parallel.

Abstract: An temperature control method including the following steps: driving an temperature control device to generate air circulation for a first server and a second server; monitoring operation state of the temperature control device, the first server and the second server continuously to establish a first learning model; receiving an temperature control state data of the temperature control device, a first state data of the first server, and a second state data of the second server, wherein the first state data includes a first temperature, and the second state data includes a second temperature; inputting the temperature control state data, the first state data, and the second state data into the first learning model to obtain a first temperature prediction value output by the first learning model; and adjusting the temperature control device according to the first temperature prediction value.

Abstract: A sealing method for a server includes: surrounding a part of a component by a frame; coating a first colloid on the part of the component and an inner surface of the frame; filling a second colloid between the part of the component and the inner surface of the frame and covering the first colloid, in which the first colloid and the second colloid have different coefficients of viscosity; fixing the frame on a housing; and sealing a gap between the frame and the housing.

Abstract: A cooling system includes a tank, a heat exchanger, a separation tank, a first tube, a second tube, a third tube, a gas storage device, a fourth tube, a first valve, a second valve and a third valve. A heating element is immersed in a dielectric liquid in the tank. The heat exchanger condenses dielectric vapor of the dielectric liquid. The separation tank is used for a separation operation. The first tube is connected to the tank and the heat exchanger. The second tube is connected to the heat exchanger and the separation tank. The third tube is connected to the separation tank and the tank. The gas storage device stores the dielectric vapor. The fourth tube is connected to the gas storage device and the separation tank.

Abstract: A rack temperature controlling method includes performing the following operations through a controller: obtaining a rack temperature data, calculating a temperature variant according to the rack temperature data, calculating a temperature deviation according to the temperature variant and a reference temperature, calculating a target speed according to the temperature deviation, and adjusting a speed of a fan to the target speed. A rack temperature controlling system including a thermometer and a controller is further provided. The thermometer measures and outputs a rack temperature data. The controller receives the rack temperature data, and calculates a temperature variant according to the rack temperature data. The controller further calculates a temperature deviation according to the temperature variant and a reference temperature, calculates a target speed according to the temperature deviation, and adjusts a speed of a fan to the target speed.

Abstract: A heat dissipation assembly and an electronic assembly, wherein the heat dissipation assembly includes condensers and fan, the condensers each include first chamber body, second chamber body, and pipes. Two opposite ends of each pipe are respectively in fluid communication with the first and second chamber bodies, every two of the pipes located adjacent to each other define a heat dissipation gap therebetween. The first and second chamber bodies and the pipes together define a heat dissipation channel which is in air communication with the heat dissipation gaps. The fan is disposed on the condensers and in air communication with the heat dissipation channel and configured to guide an airflow flowing through the heat dissipation channel and the heat dissipation gaps so as to cool the working fluid flowing through the pipes.

Abstract: A heat dissipation system and an electronic device. The heat dissipation system configured to circulate working fluid and to cool heat source. Heat dissipation system includes casing, first tube, second tube, condenser and flow rate controller. Partition is fixed in the base and is located in the accommodation space to divide the accommodation space into a first and a second accommodation space. The first accommodation space is located above the second accommodation space along a gravitational direction. The inlet is in fluid communication with the first accommodation space. The outlet is in fluid communication with the second accommodation space. The partition includes a plurality of drip holes. The first and the second accommodation spaces are in fluid communication with each other via the drip holes. The working fluid is configured to drip onto the heat source via the plurality of drip holes.

Abstract: A condenser includes a casing and pipes. The casing includes an inlet chamber, an outlet chamber, a first inlet, a first outlet, an accommodation space, a second inlet, and a second outlet. The first inlet and the first outlet are respectively in fluid communication with the inlet chamber and the outlet chamber. The accommodation space accommodates a coolant, and the second inlet and the second outlet are in fluid communication with the accommodation space not in fluid communication with the inlet chamber and the outlet chamber. The pipes are in the accommodation space and connect the inlet chamber with the outlet chamber, and a working fluid flows from the inlet chamber to the outlet chamber via the pipes. The first inlet is located closer to the second outlet than the first outlet, and the first outlet is located closer to the second inlet than the first inlet.

Abstract: An electronic device configured to be connected to external heat dissipation device and including chassis, heat source and heat dissipation assembly. The heat source is disposed in the chassis. The heat dissipation assembly includes evaporator, condenser and fin assembly. The evaporator is in thermal contact with the heat source. The condenser has outer surface, condensation space and liquid-cooling space. The outer surface faces away from the condensation space and the liquid-cooling space. The condensation space and the liquid-cooling space are not in fluid communication with each other. The condensation space is in fluid communication with the evaporator. The liquid-cooling space is configured to be in fluid communication with the external heat dissipation device. The fin assembly is in thermal contact with the condenser and protrudes from the outer surface of the condenser along direction away from the condensation space or the liquid-cooling space.

Abstract: An electronic device configured to be connected to external heat dissipation device and including chassis, heat source and heat dissipation assembly. The heat source is disposed in the chassis. The heat dissipation assembly includes evaporator, condenser and fin assembly. The evaporator is in thermal contact with the heat source. The condenser has outer surface, condensation space and liquid-cooling space. The outer surface faces away from the condensation space and the liquid-cooling space. The condensation space and the liquid-cooling space are not in fluid communication with each other. The condensation space is in fluid communication with the evaporator. The liquid-cooling space is configured to be in fluid communication with the external heat dissipation device. The fin assembly is in thermal contact with the condenser and protrudes from the outer surface of the condenser along direction away from the condensation space or the liquid-cooling space.

Abstract: An electronic device connected to external heat dissipation device and including chassis, heat source, and heat dissipation assembly. Heat dissipation assembly includes evaporator, tubing, and liquid-cooling plate. Evaporator is in thermal contact with heat source. Tubing includes evaporation portion and condensation portion. Evaporation portion is in fluid communication with condensation portion and in thermal contact with evaporator. Liquid-cooling plate is disposed on chassis and spaced apart from heat source. Liquid-cooling plate includes liquid-cooling accommodation space and is configured to be in fluid communication with external heat dissipation device. Condensation portion is located in liquid-cooling accommodation space. Condensation portion includes first tube part, second tube part and connecting tube parts. Two opposite ends of each connecting tube part are respectively in fluid communication with first and second tube parts. Connecting tube parts are connected in parallel.

Abstract: A heat dissipating device includes a thermosyphon, a first liquid cooling tube and a first heat dissipating fin set. The thermosyphon has an evaporation portion and a condensation portion. The first liquid cooling tube is sleeved on the condensation portion. The first heat dissipating fin set is sleeved on the first liquid cooling tube.