Abstract: The disclosure is related to a method for verifying an immersion cooling system. The immersion cooling system includes a first sensor, a second sensor and at least one third sensor. The method includes: obtaining a first difference value; determining whether the first difference value is smaller than a first threshold value; determining that the first sensor and the second sensor are in normal operation when the first difference value is smaller than the first threshold value; when the first difference value is not smaller than the first threshold value, determining an operating condition of the first sensor or the second sensor according to a relationship between a sensor value of the at least one third sensor and the sensor value of the first sensor, or a relationship between the sensor value of the at least one third sensor and the sensor value of the second sensor.

Abstract: A radiator includes a plurality of first pipe bodies. The first pipe bodies are mutually connected to form a first annular structure. The first pipe bodies are configured to allow a cooling fluid to flow through. Each of the first pipe bodies has a width and a height perpendicular to each other. The height is longer than the width.

Abstract: A temperature-controlling method adapted to a server comprises: getting a detected temperature; selecting a schedule from a plurality of schedules according to the detected temperature by a gain-scheduling unit, wherein the plurality of schedules comprises an initial parameter set and at least one cooling parameter set; calculating and outputting a control signal of fan speed according to the initial parameter set or said at least one cooling parameter set by a PID controller; and adjusting a rotating speed according to the control signal of fan speed by a fan.

Abstract: A heat dissipation control method is applied to an immersion cooling apparatus for cooling a heat generating member. The immersion cooling apparatus includes a cooling chamber, a fan device, and a pump communicated with the cooling chamber and the fan device for transmitting steam generated by a cooling solution to the fan device and transmitting the cooling solution to the cooling chamber. The heat generating member is immersed in the cooling solution stored in the cooling chamber. The fan device cools the steam into liquid. The heat dissipation control method includes utilizing a sensing processor to detect a steam temperature, the sensing processor preferentially increasing power of the pump when determining the steam temperature is larger than a maximum of a temperature control range, and the sensing processor preferentially decreasing power of the fan device when determining the steam temperature is less than a minimum of the temperature control range.

Abstract: A temperature control device comprises a fan, a temperature sensor, a modeling circuit and a PID controller, with the PID controller connected with the fan, the temperature sensor and the modeling circuit. The fan drives airflows for controlling the temperature of a controlled region. The temperature sensor is disposed in the controlled region and obtains a detected temperature indicating the temperature of the controlled region. The modeling circuit obtains at least one cooling parameter group based on a transfer function. The PID controller controls the fan based on an initial parameter group when the detected temperature is lower than a first temperature, and controls the fan based on said at least one cooling parameter group when the detected temperature is equal to or higher than the first temperature. The initial parameter group comprises initial parameters, with the value of each of the initial parameters equal to a preset value.

Abstract: A radiator includes a first conducting pipe, a second conducting pipe, a plurality of radiating pipes, and a plurality of fins. The second conducting pipe is opposite to the first conducting pipe. The radiating pipes are parallel to each other and are in fluid communication with the first conducting pipe and the second conducting pipe. One of the radiating pipes has a vertical projection on an adjacent one of the radiating pipes. The vertical projection partially overlaps on the adjacent one of the radiating pipes. The fins are connected between adjacent two of the radiating pipes.

Abstract: After a temperature point of the cooling fan is set according to a plurality of temperatures corresponding to a plurality of first consecutive time intervals, control a duty cycle of the cooling fan according to the temperature point, acquire temperature variation data of the cooling fan during a plurality of second consecutive time intervals, generate a gain factor and a frequency factor of the cooling fan according to the temperature variation data, and generate a proportional gain factor, an integral time factor and a derivative time factor of a proportional-integral-derivative controller of the cooling fan according to the gain factor and the frequency factor of the cooling fan. The plurality of first consecutive time intervals are followed by the plurality of second consecutive time intervals.

Abstract: A power supply array system includes N first receiving devices and a power supply array device capable of generating N voltages. The power supply array device includes M adjustable power control boards, an adjustable input/output circuit board, and a controller. The M adjustable power control boards are used for outputting the N voltages. Each adjustable power control board has a plurality of output terminals. Each output terminal is used for outputting a voltage. The adjustable input/output circuit board is coupled to the plurality of output terminals of each adjustable power control board for detecting a voltage and a current of each output terminal. The controller is used for receiving data of the voltage and the current of the each output terminal of the each power control board accordingly. N and M are two integers greater than two and N>M.

Abstract: A server cooling system includes a container, a heat dissipation device, and a housing. The container is used for containing non-conductive fluid. An electronic device is completely soaked in the non-conductive fluid to cool down. The heat dissipation device is disposed above the container for cooling vapor generated from the non-conductive fluid. The housing covers the container and the heat dissipation device for forming an enclosed space. When the temperature of the electronic device is higher than a vaporization temperature of the non-conductive fluid, the non-conductive fluid is vaporized gradually. After the vapor reaches the heat dissipation device, the vapor is condensed to become condensed fluid. The condensed fluid is then dropped to the container so as to cool the non-conductive fluid to be below the vaporization temperature.

Abstract: A server system and a server thereof are provided. The server system includes a rack, a server, and a fan module, wherein the server and the fan module are located in the rack. The server includes a chassis, a circuit board, a first heat source, a second heat source, a liquid cooling device, and a shielding cover. The circuit board is disposed on the chassis, and the first heat source and the second heat source are disposed on the circuit board. The liquid cooling device is thermally connected to the second heat source covered by the shielding cover. When the fan module is in operation, outside air is taken into the server by the fan module. The flow rate of an air flow passing by the first heat source is greater than that of another air flow passing by the second heat source capped by the shielding cover.

Abstract: A server system has an air inlet side and an air outlet side. The server system includes two server rack modules arranged side by side and a controller electrically connected to the server rack modules. Each server rack module includes a cabinet having a first side close to the air inlet side, multiple server hosts detachably disposed in the cabinet and a fan component. The fan component, disposed at the first side, includes multiple fans electrically connected to the controller. The first side of one of the cabinets abuts against the second side of the other cabinet. When the fan components operate, an air flow is formed in the cabinets. The server hosts are located in the flow path of the air flow. When one of the fans is failed, the controller is adapted for increasing a rotational speed of the fan component close to the air outlet side.

Abstract: A server rack heat dissipation system for a server including an electronic component comprises a first and a second heat dissipation assembly. The first heat dissipation assembly includes a first heat exchanger and a first pipeline. The first heat exchanger is inside the server rack and in thermal contact with the electronic component. The first pipeline is in thermal contact with the first heat exchanger and has a first coolant. The second heat dissipation assembly includes a second heat exchanger. The second heat exchanger is inside the server rack and in thermal contact with the first pipeline. The second heat exchanger can remove the heat of the electronic component in the first coolant in advance. Accordingly, the time of the first coolant being maintained in a vapor phase can be shortened, so that a power the fluid driving device used for driving the first coolant is reduced.

Abstract: A server system has an air inlet side and an air outlet side. The server system includes two server rack modules arranged side by side and a controller electrically connected to the server rack modules. Each server rack module includes a cabinet having a first side close to the air inlet side, multiple server hosts detachably disposed in the cabinet and a fan component. The fan component, disposed at the first side, includes multiple fans electrically connected to the controller. The first side of one of the cabinets abuts against the second side of the other cabinet. When the fan components operate, an air flow is formed in the cabinets. The server hosts are located in the flow path of the air flow. When one of the fans is failed, the controller is adapted for increasing a rotational speed of the fan component close to the air outlet side.

Abstract: A server system and a server thereof are provided. The server system includes a rack, a server, and a fan module, wherein the server and the fan module are located in the rack. The server includes a chassis, a circuit board, a first heat source, a second heat source, a liquid cooling device, and a shielding cover. The circuit board is disposed on the chassis, and the first heat source and the second heat source are disposed on the circuit board. The liquid cooling device is thermally connected to the second heat source covered by the shielding cover. When the fan module is in operation, outside air is taken into the server by the fan module. The flow rate of an air flow passing by the first heat source is greater than that of another air flow passing by the second heat source capped by the shielding cover.

Abstract: A temperature control system used for a server system includes a liquid cooling module used for performing heat exchange for the server system through a first fluid and a second fluid, an air-cooled module used for providing a heat-dissipating airflow to the server system; and a control unit coupling the liquid cooling module and the air-cooled module. The control unit is used for adjusting a plurality of temperature adjustment parameters based on the environmental condition of the server system and thereby controlling the liquid cooling module and the air-cooled module at the same time, so as to make the liquid cooling module and the air-cooled module perform a heat-dissipating process according to the corresponding temperature adjustment parameters, and to reduce a environment temperature of the server system. The control unit is further used for adjusting the order of the temperature adjustment parameters based on a scheduling condition.

Abstract: A cooling circulation system of a server includes a cabinet assembly, a plurality of first fan modules, a plurality of second fan modules, and two air guide hoods. The first fan modules and the second fan modules are disposed on the cabinet assembly. The first fan modules blow a first airflow towards a first direction, and the second fan modules blow a second airflow towards a second direction. The air guide hoods are respectively installed on two ends of the cabinet assembly. The first airflow and the second airflow join each other through the air guide hoods, so as to form a cooling circulation loop inside the cabinet assembly.

Abstract: A server cabinet includes a rack, at least one assembling frame, a radiator and at least one fan. The rack has a first frame and a second frame opposite to each other. The assembling frame and the radiator are mounted on the first frame in sequence. The radiator transfers a coolant to flow inside a plurality of heatsink fins thereof in a circulating manner. The fan is mounted in the assembling frame, and the fan guides an airflow to flow into the first frame from the radiator, and blows the airflow in the rack to the second frame, thus lowering the temperature inside the rack.

Abstract: A server rack heat dissipation system for a server including an electronic component comprises a first and a second heat dissipation assembly. The first heat dissipation assembly includes a first heat exchanger and a first pipeline. The first heat exchanger is inside the server rack and in thermal contact with the electronic component. The first pipeline is in thermal contact with the first heat exchanger and has a first coolant. The second heat dissipation assembly includes a second heat exchanger. The second heat exchanger is inside the server rack and in thermal contact with the first pipeline. The second heat exchanger can remove the heat of the electronic component in the first coolant in advance. Accordingly, the time of the first coolant being maintained in a vapor phase can be shortened, so that a power the fluid driving device used for driving the first coolant is reduced.

Abstract: A server cabinet is provided, which not only utilizes a first cooling fluid to flow through a heat exchanger of the cabinet to lower the temperature of entrances of fan modules without wasting additional energy, but also utilizes a cooling fluid pipe set to send a second cooling fluid to heat exchange apparatuses in a server to lower the temperature of heating elements inside the cabinet. The server cabinet could lower the heat dissipating loading of the heat exchanger of the cabinet and achieve the efficiency of saving energy.

Abstract: A server cabinet is provided, which not only utilizes a first cooling fluid to flow through a heat exchanger of the cabinet to lower the temperature of entrances of fan modules without wasting additional energy, but also utilizes a cooling fluid pipe set to send a second cooling fluid to heat exchange apparatuses in a server to lower the temperature of heating elements inside the cabinet. The server cabinet could lower the heat dissipating loading of the heat exchanger of the cabinet and achieve the efficiency of saving energy.