Patents by Inventor Kai Yi

Kai Yi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250093385
    Abstract: A probe card for a circuit probe test system and methods of fabrication thereof. The probe card includes a substrate portion, a guide plate having a plurality of openings, and a plurality of probe pins extending through the openings, including at least one first probe pin configured to carry power between the substrate portion and a device-under-test (DUT), at least one second probe pin configured to electrically couple the DUT to ground, and at least two third probe pins configured to carry loopback test signals between contact regions on the DUT. A low dielectric constant (low-k) material may be located between the third probe pins and the guide plate. The low-k material may prevent direct contact between the third probe pins and the relatively higher dielectric-constant material of the guide plate, which may improve the signal integrity (SI) of the loopback test signals.
    Type: Application
    Filed: November 14, 2023
    Publication date: March 20, 2025
    Inventors: Kuan Chun CHEN, Shu An SHANG, Kai-Yi TANG, Guang-Sing HUANG
  • Publication number: 20250085336
    Abstract: The present disclosure provides a correction system and method for correcting a semiconductor circuit. The correction system includes a plurality of redundant circuit units, a plurality of switching circuit units and a control circuit. The redundant circuit units are coupled to the semiconductor circuit. The switching circuit units are coupled to the redundant circuit units and a plurality of basic circuit units of the semiconductor circuit. The control circuit is coupled to the semiconductor circuit and the switching circuit units, is configured to obtain a noise signal of the semiconductor circuit, is configured to determine whether the semiconductor circuit passes a noise test by recognizing a characteristic of the noise signal, and is configured to replace one of the basic circuit units with one of the redundant circuit units by controlling the switching circuit units when the semiconductor circuit does not pass the noise test.
    Type: Application
    Filed: May 22, 2024
    Publication date: March 13, 2025
    Inventors: Li-Lung KAO, Chia-Chi TSAI, Pei-Chun LIAO, Kai-Yi HUANG, Sin Hua WU
  • Publication number: 20250079327
    Abstract: Semiconductor package and method of manufacturing are presented herein. In an embodiment, a device is provided that includes a first semiconductor component embedded in a first core substrate, a first redistribution layer on a first side of the first core substrate, a second redistribution layer on a second side of the first core substrate opposite the first side, a first resin film over the second redistribution layer, a second semiconductor component embedded in a second core substrate, a third redistribution layer on a third side of the second core substrate, wherein the third redistribution layer is bonded to the second redistribution layer by the first resin film, a fourth redistribution layer on a fourth side of the second core substrate opposite the third side, and a through hole via extending through the first redistribution layer, the first core substrate, the second redistribution layer, the third redistribution layer, the second core substrate, and the fourth redistribution layer.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 6, 2025
    Inventors: Yu-Huan Chen, Kai-Yi Tang, Kuo-Ching Hsu
  • Publication number: 20250066736
    Abstract: The present disclosure provides a high-throughput 3D cell spheroid culture chip, the preparation process and uses thereof. Through various efficacy experiments in the present disclosure, first evidence of using hydrogels derived from decellularized liver tissue as a self-healing biomaterial to reduce damage to damaged hepatocytes and enhance liver function in vitro is provided. Integrating endothelial cell-covered hepatocyte spheroids into DLM-CP hydrogels is a promising approach to develop microbial liver tissue, providing a potential solution for liver fibrosis recovery and promoting cell-level therapy. DLM-CP hydrogels show great potential for cell encapsulation for therapeutic purposes in future clinical settings and may be applied to ultra-high-throughput three-dimensional cell spheroid culture chips. It is used to create artificial tissues and organs, becoming a high-value tool widely used in biomedical research and pharmaceutical fields.
    Type: Application
    Filed: August 22, 2024
    Publication date: February 27, 2025
    Inventors: Yung-Te Hou, Tzong-jih Cheng, Kai-Yi Cheng, Richie L.C. Chen, Po-Chuan Hsieh, Hsien-Yi Hsiao
  • Publication number: 20250037925
    Abstract: An inductor device includes a first coil and a second coil. The first coil includes a first connection member and a plurality of first circles. At least two first circles of the first circles are located at a first area, and half of the first circle of the first circles is located at a second area. The second coil includes a second connection member and a plurality of second circles. At least two second circles of the second circles are located at the second area, and half of the second circle of the second circles is located at the first area. The first connection member is coupled to the at least two first circles and the half of the first circle. The second connection member is coupled to the at least two second circles and the half of the second circle.
    Type: Application
    Filed: October 10, 2024
    Publication date: January 30, 2025
    Inventors: Cheng-Wei LUO, Chieh-Pin CHANG, Kai-Yi HUANG, Ta-Hsun YEH
  • Patent number: 12211212
    Abstract: An image segmentation method includes the following steps: obtaining a target image; inputting the target image into a machine learning model to obtain an image segmentation parameter value corresponding to the target image; executing an image segmentation algorithm on the target image according to the image segmentation parameter value to obtain an image segmentation result, wherein the image segmentation result is segmenting the target image into object regions; and displaying the image segmentation result. In addition, an electronic device and storage medium using the method are also provided.
    Type: Grant
    Filed: December 23, 2021
    Date of Patent: January 28, 2025
    Assignee: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Yi-Shan Tsai, Cheng-Shih Lai, Chao-Yun Chen, Meng-Jhen Wu, Yun-Chiao Wu, Hsin-Yi Feng, Po-Tsun Kuo, Kai-Yi Wang, Wei-Cheng Su
  • Patent number: 12191832
    Abstract: A load-modulated balanced amplifier (LMBA) based on a variable cross-coupled pair (XCP) is provided. The LMBA includes an adaptive bias (ADB) circuit, a first balance terminal amplifier module, a second balance terminal amplifier module, a control terminal amplifier module, a first driver amplifier module, a second driver amplifier module, a third driver amplifier module, a variable XCP, a resistor R5, a resistor R6, a 90-degree differential coupler Q1, a 90-degree differential coupler Q2, and a 90-degree differential coupler Q3.
    Type: Grant
    Filed: May 26, 2023
    Date of Patent: January 7, 2025
    Assignee: CHENGDU FLUXWORKS TECHNOLOGY CO., LTD
    Inventors: Kai Yi, Kai Kang, Chenxi Zhao, Huihua Liu
  • Patent number: 12190506
    Abstract: An interactive image marking method is introduced. The interactive image marking method includes the following steps, displaying a target image and at least one marked region in the target image; receiving an interactive signal, where the interactive signal corresponds to a first pixel of the target image; calculating a correlation between the first pixel and pixels of the target image, and determining a correlation range in the target image according to the correlation; editing the marked region according to the correlate range; and displaying the edited marked region. In addition, an electronic device and a recording medium using the method are also introduced.
    Type: Grant
    Filed: December 23, 2021
    Date of Patent: January 7, 2025
    Assignee: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Yi-Shan Tsai, Cheng-Shih Lai, Chao-Yun Chen, Meng-Jhen Wu, Yun-Chiao Wu, Hsin-Yi Feng, Po-Tsun Kuo, Kai-Yi Wang, Wei-Cheng Su
  • Publication number: 20240377446
    Abstract: A testing device for testing an antenna is provided. The testing device includes a housing, an antenna module for holding the antenna and disposed under the housing, and a receiving module disposed on the housing. The receiving module includes a substrate, a coupling radiation element disposed on the substrate, and a support disposed on the substrate. The coupling radiation element includes a coupling portion and a first branch connecting to the coupling portion.
    Type: Application
    Filed: July 24, 2024
    Publication date: November 14, 2024
    Inventors: Chi-Chang LAI, Kai-Yi TANG, Mill-Jer WANG
  • Patent number: 12142412
    Abstract: An inductor device includes a first coil and a second coil. The first coil includes a first connection member and a plurality of first circles. At least two first circles of the first circles are located at a first area, and half of the first circle of the first circles is located at a second area. The second coil includes a second connection member and a plurality of second circles. At least two second circles of the second circles are located at the second area, and half of the second circle of the second circles is located at the first area. The first connection member is coupled to the at least two first circles and the half of the first circle. The second connection member is coupled to the at least two second circles and the half of the second circle.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: November 12, 2024
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Cheng-Wei Luo, Chieh-Pin Chang, Kai-Yi Huang, Ta-Hsun Yeh
  • Publication number: 20240355740
    Abstract: A method includes forming a dielectric layer over a conductive feature, and etching the dielectric layer to form an opening. The conductive feature is exposed through the opening. The method further includes forming a tungsten liner in the opening, wherein the tungsten liner contacts sidewalls of the dielectric layer, depositing a tungsten layer to fill the opening, and planarizing the tungsten layer. Portions of the tungsten layer and the tungsten liner in the opening form a contact plug.
    Type: Application
    Filed: June 30, 2023
    Publication date: October 24, 2024
    Inventors: Feng-Yu Chang, Sheng-Hsuan Lin, Shu-Lan Chang, Kai-Yi Chu, Meng-Hsien Lin, Pei-Hsuan Lee, Pei Shan Chang, Chih-Chien Chi, Chun-I Tsai, Wei-Jung Lin, Chih-Wei Chang, Ming-Hsing Tsai, Syun-Ming Jang, Wei-Jen Lo
  • Patent number: 12110528
    Abstract: A cell hydrolysate composition is described, wherein the composition comprises substantially all protein polypeptides and/or polypeptide fragments derived substantially from all the proteins in a cell from an in vitro cell culture.
    Type: Grant
    Filed: February 11, 2022
    Date of Patent: October 8, 2024
    Assignee: Avant Meats Company Limited
    Inventors: Po San Mario Chin, Kai Yi Carrie Chan, Chun Hei Poon
  • Patent number: 12112217
    Abstract: An electronic card receiving device, including a housing, a card stand, a rotating shaft, and a contact element, is provided. The housing includes a front plate having an opening. The card stand is disposed in an inner space of the housing and includes a plate section, a connecting section, and a hook section. The connecting section is connected between the plate section and the hook section. A terminal of the hook section protrudes toward the opening. The rotating shaft is attached to the plate section and is lower than the opening. An axis of the rotating shaft is substantially parallel to the front plate. The rotating shaft rotates to drive the card stand to oscillate between an initial configuration and a card-reading configuration. The contact element is disposed on the plate section of the card stand. A method of using an electronic card receiving device is also provided.
    Type: Grant
    Filed: December 7, 2022
    Date of Patent: October 8, 2024
    Assignee: E Ink Holdings Inc.
    Inventors: Huei-Chuan Lee, Bo-Tsang Huang, Chu-Kuang Tseng, Chin-Chi Yu, Chih-Chun Chen, Kai-Yi Cho
  • Patent number: 12105131
    Abstract: A testing device for testing an antenna is provided. The testing device includes a housing, an antenna module for holding the antenna and disposed under the housing, and a receiving module disposed on the housing. The antenna module includes a base and a flexible film disposed on the base. The receiving module includes a substrate, a coupling radiation element disposed on the substrate and a support disposed on the substrate and having an opening. The antenna is partially exposed from the opening.
    Type: Grant
    Filed: June 22, 2023
    Date of Patent: October 1, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chi-Chang Lai, Kai-Yi Tang, Mill-Jer Wang
  • Patent number: 12084641
    Abstract: A cell/tissue culture system comprising at least one bioreactor configured to hold at least one type of cell to cultivate tissue, a dialysis unit comprising a dialysis membrane, a fresh medium unit, and a waste removal unit configured to remove metabolic waste from dialysate, wherein the metabolic waste comprises ammonia and lactate, and wherein the waste removal unit comprises biocatalysts or enzymes configured to breakdown lactate and generate carbon sources that promote cell growth.
    Type: Grant
    Filed: August 5, 2021
    Date of Patent: September 10, 2024
    Assignee: AVANT MEATS COMPANY LIMITED
    Inventors: Po San Mario Chin, Kai Yi Carrie Chan, Chuen Wai Li, Tim Spitters
  • Publication number: 20240267015
    Abstract: A load-modulated balanced amplifier (LMBA) based on a variable cross-coupled pair (XCP) is provided. The LMBA includes an adaptive bias (ADB) circuit, a first balance terminal amplifier module, a second balance terminal amplifier module, a control terminal amplifier module, a first driver amplifier module, a second driver amplifier module, a third driver amplifier module, a variable XCP, a resistor R5, a resistor R6, a 90-degree differential coupler Q1, a 90-degree differential coupler Q2, and a 90-degree differential coupler Q3.
    Type: Application
    Filed: May 26, 2023
    Publication date: August 8, 2024
    Applicant: CHENGDU FLUXWORKS TECHNOLOGY CO., LTD
    Inventors: Kai YI, Kai KANG, Chenxi ZHAO, Huihua LIU
  • Patent number: 12037625
    Abstract: A cell hydrolysate composition is described, wherein the composition comprises substantially all protein polypeptides and/or polypeptide fragments derived substantially from all the proteins in a cell from an in vitro cell culture.
    Type: Grant
    Filed: February 11, 2022
    Date of Patent: July 16, 2024
    Assignee: Avant Meats Company Limited
    Inventors: Po San Mario Chin, Kai Yi Carrie Chan, Chun Hei Poon
  • Patent number: 12009140
    Abstract: An integrated stack transformer is provided, wherein the integrated stack transformer includes a first winding, a second winding and a third winding implemented by a first metal layer, and a fourth winding and a fifth winding implemented by a second metal layer. The second winding is positioned between the first winding and the third winding, the fourth winding substantially overlaps the first winding, the fifth winding substantially overlaps the third winding, and a distance between the fifth winding and the fourth winding is less than a distance between the third winding and the first winding. The first winding, the third winding, the fourth winding and the fifth winding form a part of one of a primary inductor and a secondary inductor of the integrated stack transformer, and the second winding is a part of the other of the primary inductor and the secondary inductor.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: June 11, 2024
    Assignee: Realtek Semiconductor Corp.
    Inventors: Kai-Yi Huang, Cheng-Wei Luo, Chieh-Pin Chang, Ta-Hsun Yeh
  • Patent number: D1061606
    Type: Grant
    Filed: April 25, 2023
    Date of Patent: February 11, 2025
    Assignee: KDAN MOBILE SOFTWARE LTD.
    Inventors: Po-Chou Su, Hsuan Tu, Nan-Kuang Lee, Jia-Rou Lee, Weichih Sun, Kai-Yi Wu, Ying-Hsiu Chen
  • Patent number: D1074040
    Type: Grant
    Filed: September 30, 2024
    Date of Patent: May 6, 2025
    Inventor: Kai Yi