Patents by Inventor Kai Yi

Kai Yi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230143466
    Abstract: A magnetic component includes a magnetic body and a coil. The magnetic body includes an inner leg, at least one outer leg, a first bottom portion and a second bottom portion. The inner leg and the at least one outer leg protrude from the first bottom portion and the second bottom portion. A cross-sectional area of the inner leg is larger than a total cross-sectional area of the at least one outer leg. The coil is wound around the inner leg.
    Type: Application
    Filed: November 9, 2021
    Publication date: May 11, 2023
    Applicant: CYNTEC CO., LTD.
    Inventors: Wen-Yu Lin, Mo-Yang Lu, Kai-Yi Fong
  • Publication number: 20230138504
    Abstract: An online signing system and method, a computing apparatus, and a computer-readable recording medium are provided. An assigned task is generated by a task assignment apparatus to the computing apparatus. The computing apparatus generates a signing request based on the assigned task to be transmitted to a client apparatus. The client apparatus downloads an assignment file from a storage database based on the signing request to display the assignment file on a display. The client apparatus receives an input via an input unit to generate a signature object on the assignment file, and transmits the signature object to the computing apparatus. After receiving the signature object, the computing apparatus combines the signature object and the assignment file to obtain a signed file, and transmits the signed file to the storage database.
    Type: Application
    Filed: October 27, 2022
    Publication date: May 4, 2023
    Applicant: KDAN MOBILE SOFTWARE LTD.
    Inventors: Po-Chou Su, Hsuan Tu, Nan-Kuang Lee, Jia-Rou Lee, Weichih Sun, Kai-Yi Wu, Ying-Hsiu Chen
  • Publication number: 20230013609
    Abstract: An interactive image marking method is introduced. The interactive image marking method includes the following steps, displaying a target image and at least one marked region in the target image; receiving an interactive signal, where the interactive signal corresponds to a first pixel of the target image; calculating a correlation between the first pixel and pixels of the target image, and determining a correlation range in the target image according to the correlation; editing the marked region according to the correlate range; and displaying the edited marked region. In addition, an electronic device and a recording medium using the method are also introduced.
    Type: Application
    Filed: December 23, 2021
    Publication date: January 19, 2023
    Inventors: YI-SHAN TSAI, CHENG-SHIH LAI, CHAO-YUN CHEN, MENG-JHEN WU, YUN-CHIAO WU, HSIN-YI FENG, PO-TSUN KUO, KAI-YI WANG, WEI-CHENG SU
  • Publication number: 20230021110
    Abstract: An image segmentation method includes the following steps: obtaining a target image; inputting the target image into a machine learning model to obtain an image segmentation parameter value corresponding to the target image; executing an image segmentation algorithm on the target image according to the image segmentation parameter value to obtain an image segmentation result, wherein the image segmentation result is segmenting the target image into object regions; and displaying the image segmentation result. In addition, an electronic device and storage medium using the method are also provided.
    Type: Application
    Filed: December 23, 2021
    Publication date: January 19, 2023
    Inventors: YI-SHAN TSAI, CHENG-SHIH LAI, CHAO-YUN CHEN, MENG-JHEN WU, YUN-CHIAO WU, HSIN-YI FENG, PO-TSUN KUO, KAI-YI WANG, WEI-CHENG SU
  • Patent number: 11521903
    Abstract: The present disclosure provides a method of measuring a plurality of voids in an underfill material of an underfill package. The method includes operations of obtaining a welding angle profile of the underfill package; obtaining a simulated void profile of the underfill package according to the welding angle profile; determining a plurality of high-risk void regions according to the simulated void profile; simulating, according to a selected pressure and a selected temperature of the underfill material, a first high-risk void region of the plurality of high-risk void regions to generate an updated void profile; and determining whether the updated void profile meets a void requirement of the underfill package.
    Type: Grant
    Filed: December 29, 2021
    Date of Patent: December 6, 2022
    Assignee: CORETECH SYSTEM CO., LTD.
    Inventors: Chien-Ting Wu, Ching-Kai Chou, Kai-Yi Bai, Wei-Yu Lin, Li-Hsuan Shen, Chia-Peng Sun, Chih-Chung Hsu, Rong-Yeu Chang, Chia-Hsiang Hsu
  • Publication number: 20220344753
    Abstract: A computing device is disclosed. The computing device has a frame including a recessed battery compartment, the recessed battery compartment having a rigid back surface. The computing device further has a closure member having a rigid portion and a flexible portion, wherein a periphery of the closure member is coupled to a peripheral edge of the recessed battery compartment, the flexible portion to permit the rigid portion to move relative to the frame. The computing device further has a battery coupled to one or more of the battery compartment and the closure member, the battery oriented between and substantially adjacent to the rigid back surface of the battery compartment and the closure member.
    Type: Application
    Filed: April 22, 2021
    Publication date: October 27, 2022
    Inventors: Gregory Scott YODER, Minsoo KIM, Kai-Yi LIN
  • Publication number: 20220333148
    Abstract: A cell hydrolysate composition, the composition comprising substantially all protein polypeptides and/or polypeptide fragments derived substantially from all the proteins in a cell from an in vitro cell culture.
    Type: Application
    Filed: February 11, 2022
    Publication date: October 20, 2022
    Applicant: Avant Meats Company Limited
    Inventors: Po San Mario Chin, Kai Yi Carrie Chan, Chun Hei Poon
  • Patent number: 11469031
    Abstract: An apparatus is provided that includes an inductor, a pair of modulating coils, a first switch and a second switch. The inductor includes two sub-loops electrically coupled with each other. The modulating coils include a first modulating coil and a second modulating coil respectively disposed corresponding to each of the two sub-loops. The first switch and the second switch are respectively disposed at the first modulating coil and the second modulating coil. Each of the first modulating coil and the second modulating coil forms an open loop when the first switch and the second switch are under an open status, and each of the first modulating coil and the second modulating coil forms a closed loop when the first switch and the second switch are under a closed status that enables a modulation of an inductance of the inductor.
    Type: Grant
    Filed: June 19, 2019
    Date of Patent: October 11, 2022
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventor: Kai-Yi Huang
  • Patent number: 11462189
    Abstract: A driving circuit for a display panel includes a common voltage generating circuit. The common voltage generating circuit is coupled to multiple common electrodes of the display panel and configured to provide multiple common voltages respectively to the common electrodes. During a frame period, the common voltage generating circuit respectively changes a voltage level of the common voltages at different time.
    Type: Grant
    Filed: September 11, 2020
    Date of Patent: October 4, 2022
    Assignee: Sitronix Technology Corp.
    Inventors: Kai-Yi Wu, Yun-Chu Chen, Li-Yu Huang
  • Patent number: 11450599
    Abstract: An integrated circuit is provided. The integrated circuit includes a first trace, a second trace and a third trace. The first trace, the second trace and the third trace are each a continuous trace. The first trace, the second trace and the third trace together use only two conductor layers of a semiconductor structure. In a crossing area of the first trace, the second trace and the third trace, the first trace crosses the second trace once, the first trace crosses the third trace once, and the second trace crosses the third trace once.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: September 20, 2022
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Cheng-Wei Luo, Chieh-Pin Chang, Kai-Yi Huang, Ta-Hsun Yeh
  • Publication number: 20220270812
    Abstract: An inductor and an integrated circuit are provided. The inductor includes a first coil, a second coil, and a third coil. The first coil has a first input terminal and a first output terminal, and the first coil is winded in a first direction from the first input terminal to the first output terminal. The second has a second input terminal and a second output terminal, and the second coil is winded in a second direction which is opposite to the first direction from the second input terminal to the second output terminal. The third has a third input terminal and a third output terminal, and the third input terminal is connected to the first input terminal and the second input terminal.
    Type: Application
    Filed: April 13, 2021
    Publication date: August 25, 2022
    Inventors: Chieh-Pin CHANG, Cheng-Wei LUO, Kai-Yi HUANG, Ta-Hsun YEH
  • Publication number: 20220216374
    Abstract: The disclosure relates to a light-emitting diode chip and a manufacturing method thereof, and a display device. The light emitting diode chip includes a transparent substrate, an epitaxial layer, a first electrode and a second electrode. The epitaxial layer includes a first semiconductor layer, a second semiconductor layer, and a light-emitting layer. A containing groove is formed in the first semiconductor layer, and a metal layer is arranged in the containing groove. The metal layer is in ohmic contact with the first semiconductor layer. The second semiconductor layer is provided with an inclined groove, and the transparent substrate is combined with the first semiconductor layer. The first electrode is arranged in the inclined groove, and the second electrode is arranged on the second semiconductor layer.
    Type: Application
    Filed: March 25, 2022
    Publication date: July 7, 2022
    Applicant: CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
    Inventors: Tao Wang, CHIA-HUI SHEN, KAI-YI WU
  • Publication number: 20220208437
    Abstract: The present invention discloses an inductor apparatus. Each of a first section of a second and a fourth quadrant loops are bridged to a first section of a former quadrant loop and are bridged to a third section to a second section of a diagonal quadrant loop. Each of a second section of the second and the fourth quadrant loops are coupled to a third section of the diagonal quadrant loop, and to the second section of a former quadrant loop. A first section of a third quadrant loop is coupled to a first section of the fourth quadrant loop, and to a third section of the first quadrant loop. The second section of the third quadrant loop is coupled to a second section of the fourth quadrant loop and to a third section of the third quadrant loop, and to a third section of the first quadrant loop.
    Type: Application
    Filed: December 15, 2021
    Publication date: June 30, 2022
    Inventors: CHENG-WEI LUO, CHIEH-PIN CHANG, KAI-YI HUANG, TA-HSUN YEH
  • Patent number: 11349110
    Abstract: The present disclosure discloses a method for forming a lead-carbon compound interface layer on a lead-based substrate, wherein the lead-based substrate has a surface, and the method includes steps of: causing an acidic solution to contact with a carbon material and a lead-containing material to form a carbon-containing plumbate precursor having an ionic lead; and reducing the ionic lead in the carbon-containing plumbate precursor to form the lead-carbon compound interface layer on the surface.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: May 31, 2022
    Assignee: NATIONAL FORMOSA UNIVERSITY
    Inventors: Shu-Huei Hsieh, Kai-Yi Song, Yi-Ren Tzeng, Ya-Wun Jan, Jing-Xiu Lin, Bo-Shun Wang, Jyun-Neng Chen
  • Publication number: 20220162662
    Abstract: A cell hydrolysate composition, the composition comprising substantially all protein polypeptides and/or polypeptide fragments derived substantially from all the proteins in a cell from an in vitro cell culture.
    Type: Application
    Filed: February 11, 2022
    Publication date: May 26, 2022
    Applicant: Avant Meats Company Limited
    Inventors: Po San Mario Chin, Kai Yi Carrie Chan, Chun Hei Poon
  • Publication number: 20220130755
    Abstract: The present disclosure provides an interconnect structure and a method for forming an interconnect structure. The method for forming an interconnect structure includes forming a bottom metal line in a first interlayer dielectric layer, forming a second interlayer dielectric layer over the bottom metal line, exposing a top surface of the bottom metal line, increasing a total surface area of the exposed top surface of the bottom metal line, forming a conductive via over the bottom metal line, and forming a top metal line over the conductive via.
    Type: Application
    Filed: January 3, 2022
    Publication date: April 28, 2022
    Inventors: SHUEN-SHIN LIANG, KEN-YU CHANG, HUNG-YI HUANG, CHIEN CHANG, CHI-HUNG CHUANG, KAI-YI CHU, CHUN-I TSAI, CHUN-HSIEN HUANG, CHIH-WEI CHANG, HSU-KAI CHANG, CHIA-HUNG CHU, KENG-CHU LIN, SUNG-LI WANG
  • Patent number: 11306342
    Abstract: A cell hydrolysate composition, the composition comprising substantially all protein polypeptides and/or polypeptide fragments derived substantially from all the proteins in a cell from an in vitro cell culture.
    Type: Grant
    Filed: April 28, 2021
    Date of Patent: April 19, 2022
    Assignee: Avant Meats Company Limited
    Inventors: Po San Mario Chin, Kai Yi Carrie Chan, Chun Hei Poon
  • Publication number: 20220077083
    Abstract: A semiconductor structure includes a first inductor, a second inductor, and a first input/output (I/O) pad. The first I/O pad is coupled to the first inductor and the second inductor. The first I/O pad, a first central axis of a first magnetic field of the first inductor, and a second central axis of a second magnetic field of the second inductor are disposed sequentially along a first direction.
    Type: Application
    Filed: March 31, 2021
    Publication date: March 10, 2022
    Inventors: CHENG-WEI LUO, CHIEH-PIN CHANG, KAI-YI HUANG, TA-HSUN YEH
  • Publication number: 20220025310
    Abstract: A cell/tissue culture system comprising at least one bioreactor configured to hold at least one type of cell to cultivate tissue, a dialysis unit comprising a dialysis membrane, a fresh medium unit, and a waste removal unit configured to remove metabolic waste from dialysate, wherein the metabolic waste comprises ammonia and lactate, and wherein the waste removal unit comprises biocatalysts or enzymes configured to breakdown lactate and generate carbon sources that promote cell growth.
    Type: Application
    Filed: August 5, 2021
    Publication date: January 27, 2022
    Applicant: Avant Meats Company Limited
    Inventors: Po San Mario Chin, Kai Yi Carrie Chan, Chuen Wai Li, Tim Spitters
  • Patent number: 11225477
    Abstract: The invention provides a novel class of compounds as inhibitors of influenza virus replication, preparation methods thereof, pharmaceutical compositions containing these compounds, and uses of these compounds and pharmaceutical compositions thereof in the treatment of influenza.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: January 18, 2022
    Assignee: Sunshine Lake Pharma Co., Ltd.
    Inventors: Yingjun Zhang, Qingyun Ren, Changhua Tang, Xiaohong Lin, Junjun Yin, Kai Yi