Abstract: There is disclosed a process for creating a flip chip bonded combination for a first integrated circuit and a second integrated circuit. Creating a first connection means on each bonding pad of a first integrated circuit within a first wall structure and a second connection means on each bonding pad of a second integrated circuit within a second wall structure. Removing the second wall structure and partially placing each second connection means within the first wall structure over a respective connection means of the first integrated circuit.

Abstract: A method for making a fresnel lens on a substrate by forming a plurality of annular rings. Each ring has a plurality of steps, with each step having an inner wall and an outer wall, and an upper surface.

Abstract: A method for making a fresnel lens on a substrate by forming a plurality of annular rings. Each ring has a plurality of steps, with each step having an inner wall and an outer wall, and an upper surface. The first step is formed on the substrate, and successive steps are formed at least partially on the upper surface of the previous step such that the outer wall of each successive annular step is offset from the outer wall of the previous annular step in an outward radial direction.

Abstract: A thin layer of Class 1B, IIB, IIIA, IVB, VB, VIB, VIIB or VIIIB metal is deposited on silicon or a silicon-based compound by immersion in a buffered metallic salt bath containing a hydrofluoric acid etchant followed by an electroless plating bath to build up the metal thickness. This process can also be used to pattern deposited metal on silicon or a silicon-based compound. An additional use of this process is to form metal silicides out of the deposited metal.