Patents by Inventor Kam Lee

Kam Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of packaging an optical sensor
    Publication number: 20050156301
    Abstract: An image sensor device includes a first, QFN type leadframe to which a sensor IC is electrically connected. A second leadframe is provided for holding a lens. A third leadframe is positioned between the first and second leadframes to appropriately space the IC from the lens. Multiple sensor devices are assembled at the same time by the use of leadframe panels.
    Type: Application
    Filed: March 16, 2005
    Publication date: July 21, 2005
    Inventors: Hei Shiu, Wai Chow, Kam Lee
  • METHOD OF PACKAGING AN OPTICAL SENSOR
    Publication number: 20050146001
    Abstract: An image sensor device includes a first, QFN type leadframe to which a sensor IC is electrically connected. A second leadframe is provided for holding a lens. A third leadframe is positioned between the first and second leadframes to appropriately space the IC from the lens. Multiple sensor devices are assembled at the same time by the use of leadframe panels.
    Type: Application
    Filed: January 6, 2004
    Publication date: July 7, 2005
    Inventors: Hei Shiu, Wai Chow, Kam Lee
  • CMOS active pixel sensor using a pinned photo diode
    Patent number: 6320617
    Abstract: Circuit architecture of an x-y addressable image sensor, in particular to that of a Complementary Metal Oxide Semiconductor (CMOS) active pixel sensor (APS).
    Type: Grant
    Filed: October 31, 1996
    Date of Patent: November 20, 2001
    Assignee: Eastman Kodak Company
    Inventors: Russell Clayton Gee, Paul Poo-Kam Lee, Teh-Hsuang Lee, Eric R. Fossum