Patents by Inventor Kamal K. Sikka
Kamal K. Sikka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140284040Abstract: Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.Type: ApplicationFiled: March 22, 2013Publication date: September 25, 2014Applicant: International Business Machines CorporationInventors: Evan G. Colgan, Taryn J. Davis, Chenzhou Lian, Yi Pan, Kamal K. Sikka, Jeffrey A. Zitz
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Patent number: 8717043Abstract: An apparatus for determining a thickness change of thermal interface material (TIM) disposed between first and second elements is provided. The apparatus includes a first part movable with the first element in a movement direction along which the TIM thickness is to be determined, a second part movable with the second element in the movement direction and a sensor to measure a distance between the first and second parts in the movement direction, the measured distance being related to the TIM thickness change.Type: GrantFiled: July 27, 2011Date of Patent: May 6, 2014Assignee: International Business Machines CorporationInventors: Paul F. Bodenweber, Virendra R. Jadhav, Kamal K. Sikka, Jiantao Zheng, Jeffrey A. Zitz
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Publication number: 20140051211Abstract: A multi-chip electronic package and methods of manufacture are provided. The multi-chip package includes a plurality of chips mounted on a chip carrier. The multi-chip package further includes a lid mounted on the chip carrier using a bonding material or compression seal, and at least one single piston extending from the lid. Each piston covers an entirety of multiple chips of the plurality of chips.Type: ApplicationFiled: October 28, 2013Publication date: February 20, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Suresh D. KADAKIA, Kamal K. SIKKA, Hilton T. TOY, Jeffrey A. ZITZ
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Publication number: 20140027898Abstract: A multi-chip electronic package and methods of manufacture are provided. The method includes adjusting a piston position of one or more pistons with respect to one or more chips on a chip carrier. The adjusting includes placing a chip shim on the chips and placing a seal shim between a lid and the chip carrier. The seal shim is thicker than the chip shim. The adjusting further includes lowering the lid until the pistons contact the chip shim. The method further includes separating the lid and the chip carrier and removing the chip shim and the seal shim. The method further includes dispensing thermal interface material on the chips and lowering the lid until a gap filled with the thermal interface material is about a particle size of the thermal interface material. The method further includes sealing the lid to the chip carrier with sealant.Type: ApplicationFiled: September 30, 2013Publication date: January 30, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Kamal K. SIKKA, Hilton T. TOY, Krishna R. TUNGA, Jeffrey A. ZITZ
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Publication number: 20140024465Abstract: An electronic device console includes a console body that houses a chip package, and a duct extending from the console body. An interior volume of the duct is in fluid communication with an interior volume of the console body. A first vent is at a distal end of the duct. A second vent is in a wall of the console body. The console may be oriented in a first orientation and a second orientation. The duct functions as a chimney for natural convection cooling of the chip package when the console is oriented in the first orientation. The console body functions as a chimney for natural convection cooling of the chip package when the console is oriented in the second orientation.Type: ApplicationFiled: July 18, 2012Publication date: January 23, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Paul F. BODENWEBER, Jon A. CASEY, Chenzhou LIAN, Kathryn C. RIVERA, Kamal K. SIKKA
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Patent number: 8592970Abstract: A multi-chip electronic package and methods of manufacture are provided. The method comprises adjusting a piston position of one or more pistons with respect to one or more chips on a chip carrier. The adjusting comprises placing a chip shim on the chips and placing a seal shim between a lid and the chip carrier. The seal shim is thicker than the chip shim. The adjusting further comprise lowering the lid until the pistons contact the chip shim. The method further comprises separating the lid and the chip carrier and removing the chip shim and the seal shim. The method further comprises dispensing thermal interface material on the chips and lowering the lid until a gap filled with the thermal interface material is about a particle size of the thermal interface material. The method further comprises sealing the lid to the chip carrier with sealant.Type: GrantFiled: June 27, 2011Date of Patent: November 26, 2013Assignee: International Business Machines CorporationInventors: Kamal K. Sikka, Hilton T. Toy, Krishna R. Tunga, Jeffrey A. Zitz
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Patent number: 8587114Abstract: A multi-chip electronic package and methods of manufacture are provided. The multi-chip package includes a plurality of chips mounted on a chip carrier. The multi-chip package further includes a lid mounted on the chip carrier using a bonding material or compression seal, and at least one single piston extending from the lid. Each piston covers an entirety of multiple chips of the plurality of chips.Type: GrantFiled: October 5, 2010Date of Patent: November 19, 2013Assignee: International Business Machines CorporationInventors: Suresh D. Kadakia, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz
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Patent number: 8445331Abstract: A multi-chip electronic package and methods of manufacture are provided. The multi-chip package includes a plurality of chips mounted on a chip carrier. The multi-chip package further includes a lid mounted on the chip carrier using a bonding material or compression seal, and at least one single piston extending from the lid. Each piston covers an entirety of multiple chips of the plurality of chips.Type: GrantFiled: March 29, 2012Date of Patent: May 21, 2013Assignee: International Business Machines CorporationInventors: Suresh D. Kadakia, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz
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Publication number: 20130027063Abstract: An apparatus for determining a thickness change of thermal interface material (TIM) disposed between first and second elements is provided. The apparatus includes a first part movable with the first element in a movement direction along which the TIM thickness is to be determined, a second part movable with the second element in the movement direction and a sensor to measure a distance between the first and second parts in the movement direction, the measured distance being related to the TIM thickness change.Type: ApplicationFiled: July 27, 2011Publication date: January 31, 2013Applicant: International Business Machines CorporationInventors: PAUL F. BODENWEBER, Virendra R. Jadhav, Kamal K. Sikka, Jiantao Zheng, Jeffrey A. Zitz
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Publication number: 20120326294Abstract: A multi-chip electronic package and methods of manufacture are provided. The method comprises adjusting a piston position of one or more pistons with respect to one or more chips on a chip carrier. The adjusting comprises placing a chip shim on the chips and placing a seal shim between a lid and the chip carrier. The seal shim is thicker than the chip shim. The adjusting further comprise lowering the lid until the pistons contact the chip shim. The method further comprises separating the lid and the chip carrier and removing the chip shim and the seal shim. The method further comprises dispensing thermal interface material on the chips and lowering the lid until a gap filled with the thermal interface material is about a particle size of the thermal interface material. The method further comprises sealing the lid to the chip carrier with sealant.Type: ApplicationFiled: June 27, 2011Publication date: December 27, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: KAMAL K. SIKKA, Hilton T. Toy, Krishna R. Tunga, Jeffrey A. Zitz
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Patent number: 8299608Abstract: A die stack package is provided and includes a substrate, a stack of computing components, at least one thermal plate, which is thermally communicative with the stack and a lid supported on the substrate to surround the stack and the at least one thermal plate to thereby define a first heat transfer path extending from one of the computing components to the lid via the at least one thermal plate and a fin coupled to a surface of the lid and the at least one thermal plate, and a second heat transfer path extending from the one of the computing components to the lid surface without passing through the at least one thermal plate.Type: GrantFiled: July 8, 2010Date of Patent: October 30, 2012Assignee: International Business Machines CorporationInventors: Gerald K. Bartley, David R. Motschman, Kamal K. Sikka, Jamil A. Wakil, Xiaojin Wei, Jiantao Zheng
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Publication number: 20120241944Abstract: A multi-chip electronic package and methods of manufacture are provided. The structure includes a lid encapsulating at least one chip mounted on a chip carrier; at least one seal shim fixed between the lid and the chip carrier, the at least one seal shim forming a gap between pistons of the lid and respective ones of the chips; and thermal interface material within the gap and contacting the pistons of the lid and respective ones of the chips.Type: ApplicationFiled: June 7, 2012Publication date: September 27, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Martin M. BEAUMIER, Steven P. OSTRANDER, Kamal K. SIKKA, Hilton T. TOY, Jeffrey A. ZITZ
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Publication number: 20120196408Abstract: A multi-chip electronic package and methods of manufacture are provided. The multi-chip package includes a plurality of chips mounted on a chip carrier. The multi-chip package further includes a lid mounted on the chip carrier using a bonding material or compression seal, and at least one single piston extending from the lid. Each piston covers an entirety of multiple chips of the plurality of chips.Type: ApplicationFiled: March 29, 2012Publication date: August 2, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Suresh D. KADAKIA, Kamal K. SIKKA, Hilton T. TOY, Jeffrey A. ZITZ
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Patent number: 8232636Abstract: A frontside of a chip is bonded to a top surface of a chip carrier. Seal material is dispensed at a periphery of the top surface of the chip carrier. A solder TIM having a first side and a second side is provided. The first side of the TIM contacts a backside of the chip. A reflow is performed to melt the TIM. The second side of the TIM is bonded to a lid. The seal material is cured. The lid is attached to the top surface of the chip carrier. Backfill material is injected into a space between the top surface of the chip carrier and the lid. The backfill material abuts sides of the TIM. The backfill material is cured. TIM solder cracking and associated thermal degradation are mitigated.Type: GrantFiled: January 26, 2010Date of Patent: July 31, 2012Assignee: International Business Machines CorporationInventors: James N Humenik, Sushumna Iruvanti, Richard Langlois, Hsichang Liu, Govindarajan Natarajan, Kamal K Sikka, Hilton T Toy, Jiantao Zheng, Gregg B Monjeau, Mark Kapfhammer
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Publication number: 20120080784Abstract: A multi-chip electronic package and methods of manufacture are provided. The multi-chip package includes a plurality of chips mounted on a chip carrier. The multi-chip package further includes a lid mounted on the chip carrier using a bonding material or compression seal, and at least one single piston extending from the lid. Each piston covers an entirety of multiple chips of the plurality of chips.Type: ApplicationFiled: October 5, 2010Publication date: April 5, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: SURESH D. KADAKIA, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz
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Publication number: 20120039046Abstract: A multi-chip electronic package and methods of manufacture are provided. The method includes contacting pistons of a lid with respective ones of chips on a chip carrier. The method further includes separating the lid and the chip carrier and placing at least one seal shim on one of the lid and chip carrier. The at least one seal shim has a thickness that results in a gap between the pistons with the respective ones of the chips on the chip carrier. The method further includes dispensing thermal interface material within the gap and in contact with the chips. The method further includes sealing the lid to the chip carrier with the at least one seal shim between the lid and the chip carrier.Type: ApplicationFiled: August 16, 2010Publication date: February 16, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Martin M. BEAUMIER, Steven P. OSTRANDER, Kamal K. SIKKA, Hilton T. TOY, Jeffrey A. ZITZ
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Publication number: 20120007229Abstract: A die stack package is provided and includes a substrate, a stack of computing components, at least one thermal plate, which is thermally communicative with the stack and a lid supported on the substrate to surround the stack and the at least one thermal plate to thereby define a first heat transfer path extending from one of the computing components to the lid via the at least one thermal plate and a fin coupled to a surface of the lid and the at least one thermal plate, and a second heat transfer path extending from the one of the computing components to the lid surface without passing through the at least one thermal plate.Type: ApplicationFiled: July 8, 2010Publication date: January 12, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Gerald K. Bartley, David R. Motschman, Kamal K. Sikka, Jamil A. Wakil, Xiaojin Wei, Jiantao Zheng
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Patent number: 8037594Abstract: Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature within a predetermined temperature range that causes the heat generating structure to warp. Additionally, this disclosure presents the associated methods of forming the plates and of bonding the plates to a heat generating structure. In one embodiment the plate is curved and modeled to match the curved surface of a heat generating structure within the predetermined temperature range. In another embodiment the plate is a multi-layer conductive structure that is configured to undergo the same warpage under a thermal load as the heat generating structure. Thus, when the plate is bonded with the heat generating structure it is able to achieve and maintain a uniform adhesive-filled gap at any temperature.Type: GrantFiled: May 7, 2008Date of Patent: October 18, 2011Assignee: International Business Machines CorporationInventors: Jeffrey T. Coffin, Michael A. Gaynes, David L. Questad, Kamal K. Sikka, Hilton T. Toy, Jamil A. Wakil
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Patent number: 7992627Abstract: Low-pressure drop thermal assemblies, systems and methods of making low-pressure drop thermal assemblies for use in high power flux situations. A manifold body is attached to a distributor to form a subassembly. This subassembly is in communication with a substrate surface, which has a semiconductor device in need of thermal management thereon. An enclosed cavity is formed between the target substrate surface and the subassembly, and a seal of the cavity protects critical components residing on the active surface of the semiconductor device. The distributor includes a distributed liquid impingement microjet inlet array isolated from and parallel with a distributed microjet drain array for impinging cooling fluid and removing spent heated fluid in a direction orthogonal to a target surface for maximizing the heat transfer rate, and thereby providing high cooling flux capabilities while enabling low-pressure drops.Type: GrantFiled: December 18, 2008Date of Patent: August 9, 2011Assignee: International Business Machines CorporationInventors: Raschid J. Bezama, Govindarajan Natarajan, Kamal K. Sikka, Hilton T. Toy
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Publication number: 20110180923Abstract: A frontside of a chip is bonded to a top surface of a chip carrier. Seal material is dispensed at a periphery of the top surface of the chip carrier. A solder TIM having a first side and a second side is provided. The first side of the TIM contacts a backside of the chip. A reflow is performed to melt the TIM. The second side of the TIM is bonded to a lid. The seal material is cured. The lid is attached to the top surface of the chip carrier. Backfill material is injected into a space between the top surface of the chip carrier and the lid. The backfill material abuts sides of the TIM. The backfill material is cured. TIM solder cracking and associated thermal degradation are mitigated.Type: ApplicationFiled: January 26, 2010Publication date: July 28, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: JAMES N. HUMENIK, SUSHUMNA IRUVANTI, RICHARD LANGLOIS, HSICHANG LIU, GOVINDARAJAN NATARAJAN, KAMAL K. SIKKA, HILTON T. TOY, JIANTAO ZHENG, GREGG B. MONJEAU, MARK KAPFHAMMER