Abstract: Devices for the control of flow rate and thermal conditions using two-layered thin films separated by flexible complex seals. The plates of an upper thin film are separated by a sealing assembly. The sealing assembly is composed of an elastic soft seal separating closed voids of stagnant fluid and in contact with the upper plate of the device as it is the heated plate. The lower and the upper plates of the lower thin film can be separated by an elastic soft seal. The lower and upper thin films are named as main and secondary layers, respectively. Both the upper plate of the secondary layer and the lower plate of the main layer are fixed while the intermediate plate and is free to move in the vertical direction. When the pressure or the working temperature in the secondary layer increases, the secondary layer expands causing the main layer thickness to shrink. This reduces the main layer flow rate and temperature gradients within the main layer.

Abstract: Devices and methods for increasing and decreasing cooling capacity as thermal load increases by utilizing bimaterial. For increasing the cooling capacity, the upper plate of a thin film microchannel can be configured from a bimaterial, such that the upper layer possesses a higher linear thermal expansion coefficient than that of the lower layer material. Excessive heating causes the coolant temperature to increase which in turn heats the upper plate. As such, the upper plate bends outward allowing for more coolant to flow within the thin film. For decreasing the cooling capacity, the upper plate can be configured from a bimaterial such that its lower layer has a higher linear thermal expansion coefficient than that of the upper layer material. Excessive heating can cause the coolant temperature to increase, which in turn heats the upper plate. As such, the upper plate can bend inward resulting in less coolant flow within the thin film.

Abstract: A cooling enhancement apparatus includes a first substrate and a second substrate, the first substrate having a face in contact with at least one hot medium and having another face in contact with a secondary gas. The second substrate includes a face in contact with the secondary gas and has the other face in contact with a main gas. The faces of the first and second substrates in contact with the secondary gas generally oppose each other. One or more flexible seals can be attached to the first substrate and to the second substrate to form one or more closed enclosures including the secondary gas so that the second substrate moves relative to the first substrate when the secondary gas undergoes volumetric thermal expansion.

Abstract: A method and system for analyzing transient thermal response of a packed bed under Local Thermal Non-Equilibrium is disclosed. Heat transfer performances in terms of the fluid, solid, and total Nusselt number are obtained. Qualitative analyses of the effects of thermal conduction at the wall on the total heat exchange between the solid and fluid phases within the heat flux bifurcation region are also performed. Both the transient and diffusion aspects are considered in the solid and fluid phases along with the convection and the fluid-solid interaction. The analytical solution for transient response of a packed bed subject to a constant temperature boundary condition is derived. The heat flux bifurcation phenomenon in a porous media is investigated for temporal conditions, and the analytical two-dimensional thermal behavior and the LTE model is examined under transient conditions. Further, the response time towards steady state conditions is investigated.

Abstract: A method, system and apparatus for analyzing heat flux bifurcation within a porous medium by analyzing a convective heat transfer process within a channel partially filled with a porous medium under local thermal non-equilibrium conditions. Either the thermal dispersion effect or the inertial effect can be considered in a physical model. Exact solutions can be derived for both fluid and solid temperature distributions for three interface thermal models at a porous-fluid interface. The required conditions for validity of each interface thermal model can be obtained, and equivalence correlations between different interface thermal models can be developed. The range of validity of local thermal equilibrium condition can be established, and heat flux bifurcation within a porous medium can be established and demonstrated. Furthermore, a Nusselt number can be obtained and investigated for pertinent parameters.

Abstract: System and method for cooling of an integrated circuit utilizing Micro-Electro Mechanical Systems (MEMS) components. A flexible thin film has an upper flexible substrate, a lower inflexible substrate and flexible seals. One face of the lower substrate is in contact with at least one hot medium and the other face is in contact with a coolant fluid. One face of the upper substrate is in contact with the coolant fluid and the other face is in contact with the surrounding ambient. Two continuous flexible seals are attached to the faces of the upper lower substrates to form at least one closed enclosure comprising a thermally conducting gas. The thermally conducting gas is in direct contact with the lower substrate. The upper substrate deflects continuously and maximally in the direction along the coolant fluid flow direction when the flexible seals deflect when the thermally conducting gas undergoes volumetric thermal expansion.

Abstract: A DL-microchannel cooling device with rotatable separating plate is disclosed. The separating plate is supported via anti-leaking flexible seals. The only allowable motion for that plate is the rotational motion about a pivot rod. The rod is taken to be aligned along the microchannel center line normal to its sides boundaries. The device can be configured as a flexible microheat exchanger and a heated DL-flexible microchannel device. The theory of linear elasticity applied to flexible seals supporting the separating plate is used to relate the moment of the pressure forces on that plate to its rotational angle. The energy equations for both fluids flows are solved numerically and analytically under special conditions. As such, the effectiveness of the flexible microheat exchanger and other performance indicators for flexible microheat exchanger and heated DL-flexible microchannel devices are calculated.

Abstract: An assembly of microcantilever-based sensors with enhanced deflections. A deflection profile of an ?-assembly can be compared with that of a rectangular microcantilever and a modified triangular microcantilever. Various force-loading conditions can also be considered. A theorem of linear elasticity for thin beams is utilized to obtain the deflections. The obtained defections can be validated against an accurate numerical solution utilizing a finite element method with a maximum deviation of less than 10 percent. The ?-assembly produces larger deflections than the rectangular microcantilever under the same base surface stress and same extension length. Also, the ?-microcantilever assembly produces a larger deflection than a modified triangular microcantilever. The deflection enhancement increases as the ?-assembly's free length decreases for various types of force loading conditions.

Abstract: Disclosed herein are devices comprising at least one flexible seal, at least one flexible complex seal having at least one closed cavity containing a fluid, or a combination thereof. The devices may comprise at least one immobile and inflexible substrate and at least one mobile and inflexible substrate capable of movement due to the flexible seal, the flexible complex seal, or both. The flexible complex seals comprise at least one closed cavity comprising a fluid, such as a gas or a liquid. As disclosed, the presence or absence of heat will cause the mobile and inflexible substrate to move. The movement will increase or decrease the fluid amount or fluid flow rate in the primary fluid layer. Also disclosed are methods for enhancing the insulating properties of insulating assemblies.

Abstract: A cooling enhancement apparatus includes a first substrate and a second substrate, the first substrate having a face in contact with at least one hot medium and having another face in contact with a secondary gas. The second substrate includes a face in contact with the secondary gas and has the other face in contact with a main gas. The faces of the first and second substrates in contact with the secondary gas generally oppose each other. One or more flexible seals can be attached to the first substrate and to the second substrate to form one or more dosed enclosures including the secondary gas so that the second substrate moves relative to the first substrate when the secondary gas undergoes volumetric thermal expansion.

Abstract: Devices comprising multi-compartment fluidic cell with multiple inlets. Compartments can be separated from one another using soft seals. The main cell can be located between two adjacent secondary cells. The main cell carries the main flow while the secondary cells can carry either the main flow or any auxiliary flows. The flow in the multi-compartment cells minimizes fluid leakage and causes reduced pressure difference between the main cell and the two secondary cells especially under similar flow conditions.

Abstract: An assembly of microcantilever-based sensors with enhanced deflections. A deflection profile of an ?-assembly can be compared with that of a rectangular microcantilever and a modified triangular microcantilever. Various force-loading conditions can also be considered. A theorem of linear elasticity for thin beams is utilized to obtain the deflections. The obtained defections can be validated against an accurate numerical solution utilizing a finite element method with a maximum deviation of less than 10 percent. The ?-assembly produces larger deflections than the rectangular microcantilever under the same base surface stress and same extension length. Also, the ?-microcantilever assembly produces a larger deflection than a modified triangular microcantilever. The deflection enhancement increases as the ?-assembly's free length decreases for various types of force loading conditions.

Abstract: Devices utilized to enhance insulating properties at high temperatures. Such devices can include two gas compartments. A main gas compartment can function as a main layer and generally contains a layer of a gas (e.g., Xenon) having a relatively small thermal conductivity. The plates of the main gas layer can be separated by a soft seal, so that the main gas does not leak and the main layer expands easily. A second gas compartment can be configured as a vented compartment filled with air. At high temperatures, the main gas expands while the secondary gas volume shrinks. Since the main gas possesses a lower thermal conductivity, the effective resistance of the device increases, causing an enhancement in the insulating properties at large operating temperatures. A series of gas compartments can be utilized for additional enhancement in insulating properties.

Abstract: Devices for the control of flow rate and thermal conditions using two-layered thin films separated by flexible complex seals. The plates of an upper thin film are separated by a sealing assembly. The sealing assembly is composed of an elastic soft seal separating closed voids of stagnant fluid and in contact with the upper plate of the device as it is the heated plate. The lower and the upper plates of the lower thin film can be separated by an elastic soft seal. The lower and upper thin films are named as main and secondary layers, respectively. Both the upper plate of the secondary layer and the lower plate of the main layer are fixed while the intermediate plate and is free to move in the vertical direction. When the pressure or the working temperature in the secondary layer increases, the secondary layer expands causing the main layer thickness to shrink. This reduces the main layer flow rate and temperature gradients within the main layer.

Abstract: Devices and methods for increasing and decreasing cooling capacity as thermal load increases by utilizing bimaterial. For increasing the cooling capacity, the upper plate of a thin film microchannel can be configured from a bimaterial, such that the upper layer possesses a higher linear thermal expansion coefficient than that of the lower layer material. Excessive heating causes the coolant temperature to increase which in turn heats the upper plate. As such, the upper plate bends outward allowing for more coolant to flow within the thin film. For decreasing the cooling capacity, the upper plate can be configured from a bimaterial such that its lower layer has a higher linear thermal expansion coefficient than that of the upper layer material. Excessive heating can cause the coolant temperature to increase, which in turn heats the upper plate. As such, the upper plate can bend inward resulting in less coolant flow within the thin film.

Abstract: Disclosed herein are devices comprising at least one flexible seal, at least one flexible complex seal having at least one closed cavity containing a fluid, or a combination thereof. The devices may comprise at least one immobile and inflexible substrate and at least one mobile and inflexible substrate capable of movement due to the flexible seal, the flexible complex seal, or both. The flexible complex seals comprise at least one closed cavity comprising a fluid, such as a gas or a liquid. As disclosed, the presence or absence of heat will cause the mobile and inflexible substrate to move. The movement will increase or decrease the fluid amount or fluid flow rate in the primary fluid layer. Also disclosed are methods for enhancing the insulating properties of insulating assemblies.

Abstract: Disclosed herein are devices comprising at least one flexible seal, at least one flexible complex seal having at least one closed cavity containing a fluid, or a combination thereof. The devices may comprise at least one immobile and inflexible substrate and at least one mobile and inflexible substrate capable of movement due to the flexible seal, the flexible complex seal, or both. The flexible complex seals comprise at least one closed cavity comprising a fluid, such as a gas or a liquid. As disclosed, the presence or absence of heat will cause the mobile and inflexible substrate to move. The movement will increase or decrease the fluid amount or fluid flow rate in the primary fluid layer. Also disclosed are methods for enhancing the insulating properties of insulating assemblies.

Abstract: Disclosed herein are microcantilevers having structural shapes that are less sensitive to turbulence and drift effects yet provide greater deflections due to analyte concentration. The structural shapes include a C-shaped microcantilever, an E-shaped microcantilever, an L-shaped microcantilever, a double microcantilever, a slit microcantilever, a tapered microcantilever, and a triangular microcantilever. The microcantilevers may be piezoresistive microcantilevers. Also disclosed are microsensors, microfluidic devices, and biochips that comprise the microcantilevers as well as methods of using the microcantilevers to detect analytes in a fluid sample.

Abstract: Disclosed herein are devices comprising at least one flexible seal, at least one flexible complex seal having at least one closed cavity containing a fluid, or a combination thereof. The devices may comprise at least one immobile and inflexible substrate and at least one mobile and inflexible substrate capable of movement due to the flexible seal, the flexible complex seal, or both. The flexible complex seals comprise at least one closed cavity comprising a fluid, such as a gas or a liquid. As disclosed, the presence or absence of heat will cause the mobile and inflexible substrate to move. The movement will increase or decrease the fluid amount or fluid flow rate in the primary fluid layer. Also disclosed are methods for enhancing the insulating properties of insulating assemblies.

Abstract: A portable apparatus for thermal cycling a material to be thermal cycled includes a portable microfluidic-compatible platform, a microfluidic heat exchanger carried by the portable microfluidic-compatible platform; a porous medium in the microfluidic heat exchanger; a microfluidic thermal cycling chamber containing the material to be thermal cycled, the microfluidic thermal cycling chamber operatively connected to the microfluidic heat exchanger; a working fluid at first temperature, a first system for transmitting the working fluid at first temperature to the microfluidic heat exchanger; a working fluid at a second temperature, a second system for transmitting the working fluid at second temperature to the microfluidic heat exchanger; a pump for flowing the working fluid at the first temperature from the first system to the microfluidic heat exchanger and through the porous medium; and flowing the working fluid at the second temperature from the second system to the heat exchanger and through the porous medi