Abstract: A method includes forming a first polymer layer to cover a metal pad of a wafer, and patterning the first polymer layer to form a first opening. A first sidewall of the first polymer layer exposed to the first opening has a first tilt angle where the first sidewall is in contact with the metal pad. The method further includes forming a metal pillar in the first opening, sawing the wafer to generate a device die, encapsulating the device die in an encapsulating material, performing a planarization to reveal the metal pillar, forming a second polymer layer over the encapsulating material and the device die, and patterning the second polymer layer to form a second opening. The metal pillar is exposed through the second opening. A second sidewall of the second polymer layer exposed to the second opening has a second tilt angle greater than the first tilt angle.

Abstract: The invention pertains to means and methods for fluorescent in situ hybridization (FISH) using a CRISPR CAS9 variant with nickase activity in order to denature the DNA double strand and then using an exonuclease in order to remove the DNA strand that is not targeted with the FISH probes. The invention enhances FISH signal to noise ratio and allows a highly specific targeting of genomic locations via the used sgRNA and FISH probe sequences. In addition, the invention provides uses and kits for the enhanced FISH methods.

Abstract: A method includes forming a first polymer layer to cover a metal pad of a wafer, and patterning the first polymer layer to form a first opening. A first sidewall of the first polymer layer exposed to the first opening has a first tilt angle where the first sidewall is in contact with the metal pad. The method further includes forming a metal pillar in the first opening, sawing the wafer to generate a device die, encapsulating the device die in an encapsulating material, performing a planarization to reveal the metal pillar, forming a second polymer layer over the encapsulating material and the device die, and patterning the second polymer layer to form a second opening. The metal pillar is exposed through the second opening. A second sidewall of the second polymer layer exposed to the second opening has a second tilt angle greater than the first tilt angle.

Abstract: A liquid cooling device includes a base plate, a cooling body, and a cover plate. The cooling body includes a frame. A cooling layer is provided in the frame and a reflux layer is provided above the cooling layer. The cooling layer is provided with a plurality of cooling channels extending from a center portion of the cooling body to the frame. The reflux layer is provided with a plurality of reflux channels in communication with the plurality of cooling channels. A periphery of the reflux layer is provided with a drainage flow channel in communication with the plurality of the reflux channels. A center portion of the cover plate being provided with a liquid inlet in communication with the plurality of cooling channels, and the cover plate is further provided with a liquid outlet in communication with the drainage flow channel.

Abstract: An apparatus for supplying oxygen includes: a compressor assembly configured to compress air and supply compressed air; an adsorption bed assembly comprising a plurality of adsorption beds configured to adsorb nitrogen from the compressed air supplied by the compressor assembly through a pressure swing adsorption process to produce concentrated oxygen; a cover formed to surround the compressor assembly and the adsorption bed assembly; and a cover configured to accommodate the cover and having an air inlet through which air supplied to the compressor assembly flows. The cover is configured to allow the air supplied through the air inlet to pass through a space where the compressor assembly is disposed and then be discharged to an outside.

Abstract: A package module includes an interposer, a plurality of semiconductor dies on the interposer, a module stiffener on the interposer adjacent to the plurality of semiconductor dies, and a molding material layer on the interposer around the plurality of semiconductor dies and the module stiffener.

Abstract: An embodiment is a structure including a first package including a first die, and a molding compound at least laterally encapsulating the first die, a second package bonded to the first package with a first set of conductive connectors, the second package comprising a second die, and an underfill between the first package and the second package and surrounding the first set of conductive connectors, the underfill having a first portion extending up along a sidewall of the second package, the first portion having a first sidewall, the first sidewall having a curved portion and a planar portion.

Abstract: An embodiment is a structure including a first package including a first die, and a molding compound at least laterally encapsulating the first die, a second package bonded to the first package with a first set of conductive connectors, the second package comprising a second die, and an underfill between the first package and the second package and surrounding the first set of conductive connectors, the underfill having a first portion extending up along a sidewall of the second package, the first portion having a first sidewall, the first sidewall having a curved portion and a planar portion.

Abstract: A method includes forming a first polymer layer to cover a metal pad of a wafer, and patterning the first polymer layer to form a first opening. A first sidewall of the first polymer layer exposed to the first opening has a first tilt angle where the first sidewall is in contact with the metal pad. The method further includes forming a metal pillar in the first opening, sawing the wafer to generate a device die, encapsulating the device die in an encapsulating material, performing a planarization to reveal the metal pillar, forming a second polymer layer over the encapsulating material and the device die, and patterning the second polymer layer to form a second opening. The metal pillar is exposed through the second opening. A second sidewall of the second polymer layer exposed to the second opening has a second tilt angle greater than the first tilt angle.

Abstract: A semiconductor structure includes a die, a molding surrounding the die, a first dielectric layer disposed over the die and the molding, and a second dielectric layer disposed between the first dielectric layer and the die, and between the first dielectric layer and the molding. A material content ratio in the first dielectric layer is substantially greater than that in the second dielectric layer. In some embodiments, the material content ratio substantially inversely affects a mechanical strength of the first dielectric layer and the second dielectric layer.

Abstract: A liquid cooling device includes a base plate, a cooling body, and a cover plate. The cooling body includes a frame. A cooling layer is provided in the frame and a reflux layer is provided above the cooling layer. The cooling layer is provided with a plurality of cooling channels extending from a center portion of the cooling body to the frame. The reflux layer is provided with a plurality of reflux channels in communication with the plurality of cooling channels. A periphery of the reflux layer is provided with a drainage flow channel in communication with the plurality of the reflux channels. A center portion of the cover plate being provided with a liquid inlet in communication with the plurality of cooling channels, and the cover plate is further provided with a liquid outlet in communication with the drainage flow channel.

Abstract: A method includes forming a first polymer layer to cover a metal pad of a wafer, and patterning the first polymer layer to form a first opening. A first sidewall of the first polymer layer exposed to the first opening has a first tilt angle where the first sidewall is in contact with the metal pad. The method further includes forming a metal pillar in the first opening, sawing the wafer to generate a device die, encapsulating the device die in an encapsulating material, performing a planarization to reveal the metal pillar, forming a second polymer layer over the encapsulating material and the device die, and patterning the second polymer layer to form a second opening. The metal pillar is exposed through the second opening. A second sidewall of the second polymer layer exposed to the second opening has a second tilt angle greater than the first tilt angle.

Abstract: Disclosed herein is a decontaminant aqueous solution for decontaminating diisocyanate drum, including 20-97 wt % of at least one alcohol or derivative thereof, based on the total weight of decontaminant aqueous solution, and an alkaline source in an amount effective to provide the solution a pH of at least 8. Further disclosed herein is a method for decontaminating diisocyanate residues in an emptied drum with the decontaminant aqueous solution.

Abstract: The present application provides a display panel, a manufacturing method, a detection method, and a display device. The display panel includes a display area and a non-display area surrounding the display area. The non-display area includes: a crack detection line surrounding the display area; a screen control line; a plurality of switch signal lines; and a plurality of detection switches electrically connected at different positions to the crack detection line. Each detection switch is also connected to the screen control line and a respective switch signal line, and allows conduction between the crack detection line and the screen control line based on the switch signal input by the switch signal line, such that the screen control line drives the display panel to display according to the test signal input by the crack detection line.

Abstract: In some examples, an apparatus can include an arm, a cam connected to the arm, a first spring located around a first strut, where the first spring is oriented at a first angle relative to a base of the apparatus and the first strut is connected to the cam, a second spring located around a second strut, where the second spring is oriented at a second angle relative to the base of the apparatus and the second strut is connected to the cam, where the first spring and the second spring linearly compress in response to rotation of the arm from a vertical orientation to a horizontal orientation relative to the base of the apparatus.

Abstract: In some examples, an apparatus can include an arm and a cover connected to the arm, where the cover conceals an inner portion of the apparatus when the arm is in a vertical orientation relative to a base of the apparatus, and the cover is concealed in the inner portion of the apparatus when the arm is in a horizontal orientation relative to the base of the apparatus.

Abstract: A viewpoint image processing method and a related device are provided, and relate to the artificial intelligence/computer vision field. The method includes: obtaining a preset quantity of first viewpoint images; obtaining a geometric feature matrix between the preset quantity of first viewpoint images; generating an adaptive convolution kernel corresponding to each pixel of the preset quantity of first viewpoint images based on the geometric feature matrix and location information of a to-be-synthesized second viewpoint image, where the location information represents a viewpoint location of the second viewpoint image; generating the preset quantity of to-be-processed virtual composite pixel matrices based on the adaptive convolution kernels and the pixels of the preset quantity of existing viewpoint images; and synthesizing the second viewpoint image by using the preset quantity of to-be-processed virtual composite pixel matrices.

Abstract: The present application provides a display panel, a. manufacturing method, a detection method, and a display device. The display panel includes a display area and a non-display area surrounding the display area. The non-display area includes: a crack detection line surrounding the display area; a screen control line; a plurality of switch signal lines; and a plurality of detection switches electrically connected at different positions to the crack detection line. Each detection switch is also connected to the screen control line and a respective switch signal line, and allows conduction between the crack detection line and the screen control line based on the switch signal input by the switch signal line, such that the screen control line drives the display panel to display according to the test signal input by the crack detection line.

Abstract: In some examples, an apparatus can include an arm and a cover connected to the arm, where the cover conceals an inner portion of the apparatus when the arm is in a vertical orientation relative to a base of the apparatus, and the cover is concealed in the inner portion of the apparatus when the arm is in a horizontal orientation relative to the base of the apparatus.

Abstract: In some examples, an apparatus can include an arm, a cam connected to the arm, a first spring located around a first strut, where the first spring is oriented at a first angle relative to a base of the apparatus and the first strut is connected to the cam, a second spring located around a second strut, where the second spring is oriented at a second angle relative to the base of the apparatus and the second strut is connected to the cam, where the first spring and the second spring linearly compress in response to rotation of the arm from a vertical orientation to a horizontal orientation relative to the base of the apparatus.