Abstract: A method of manufacturing a semiconductor structure is provided. The method includes providing a substrate, disposing a die over the substrate, forming a molding over the substrate and around the die, disposing a first dielectric layer over the die and the molding, curing the first dielectric layer under a first curing condition, disposing a second dielectric layer over the first dielectric layer, and curing the first dielectric layer and the second dielectric layer under the first curing condition.

Abstract: An embodiment is a structure including a first package including a first die, and a molding compound at least laterally encapsulating the first die, a second package bonded to the first package with a first set of conductive connectors, the second package comprising a second die, and an underfill between the first package and the second package and surrounding the first set of conductive connectors, the underfill having a first portion extending up along a sidewall of the second package, the first portion having a first sidewall, the first sidewall having a curved portion and a planar portion.

Abstract: A semiconductor structure includes a substrate; a die disposed over the substrate, and including a die pad, a conductive via disposed over the die pad and a dielectric material surrounding the conductive via; a molding disposed over the substrate and surrounding the die; a lower dielectric layer disposed nearer the substrate and over the dielectric material and the molding; and an upper dielectric layer disposed further the substrate and over the lower dielectric layer, wherein a material content ratio in the upper dielectric layer is substantially greater than that in the lower dielectric layer, and the material content ratio substantially inversely affects a mechanical strength of the upper dielectric layer and the lower dielectric layer.

Abstract: A method includes forming a first polymer layer to cover a metal pad of a wafer, and patterning the first polymer layer to form a first opening. A first sidewall of the first polymer layer exposed to the first opening has a first tilt angle where the first sidewall is in contact with the metal pad. The method further includes forming a metal pillar in the first opening, sawing the wafer to generate a device die, encapsulating the device die in an encapsulating material, performing a planarization to reveal the metal pillar, forming a second polymer layer over the encapsulating material and the device die, and patterning the second polymer layer to form a second opening. The metal pillar is exposed through the second opening. A second sidewall of the second polymer layer exposed to the second opening has a second tilt angle greater than the first tilt angle.

Abstract: A semiconductor device includes: a first dielectric layer having a first surface; a molding compound disposed on the first surface of the first dielectric layer; a second dielectric layer having a first surface disposed on the molding compound; a via disposed in the molding compound; and a first conductive bump disposed on the via and surrounded by the second dielectric layer; wherein the first dielectric layer and the second dielectric layer are composed of the same material. The filling material has a thickness between the second dielectric layer and the semiconductor die, and the diameter of the hole is inversely proportional to the thickness of the filling material.

Abstract: A method and an apparatus for sharing display frame are provided. The apparatus includes a display unit, a communication unit, and a processing unit. In the method, a plurality of electronic apparatuses are searched by the processing unit through the communication unit, where each of the electronic apparatuses is configured to display a corresponding display frame. The processing unit selects one or a plurality of the electronic apparatuses, and synchronously displays at least first frame displayed by the display unit on one or a plurality of the selected electronic apparatus.

Abstract: An embodiment is a structure including a first package including a first die, and a molding compound at least laterally encapsulating the first die, a second package bonded to the first package with a first set of conductive connectors, the second package comprising a second die, and an underfill between the first package and the second package and surrounding the first set of conductive connectors, the underfill having a first portion extending up along a sidewall of the second package, the first portion having a first sidewall, the first sidewall having a curved portion and a planar portion.

Abstract: A method includes forming a first polymer layer to cover a metal pad of a wafer, and patterning the first polymer layer to form a first opening. A first sidewall of the first polymer layer exposed to the first opening has a first tilt angle where the first sidewall is in contact with the metal pad. The method further includes forming a metal pillar in the first opening, sawing the wafer to generate a device die, encapsulating the device die in an encapsulating material, performing a planarization to reveal the metal pillar, forming a second polymer layer over the encapsulating material and the device die, and patterning the second polymer layer to form a second opening. The metal pillar is exposed through the second opening. A second sidewall of the second polymer layer exposed to the second opening has a second tilt angle greater than the first tilt angle.

Abstract: A method includes forming a first polymer layer to cover a metal pad of a wafer, and patterning the first polymer layer to form a first opening. A first sidewall of the first polymer layer exposed to the first opening has a first tilt angle where the first sidewall is in contact with the metal pad. The method further includes forming a metal pillar in the first opening, sawing the wafer to generate a device die, encapsulating the device die in an encapsulating material, performing a planarization to reveal the metal pillar, forming a second polymer layer over the encapsulating material and the device die, and patterning the second polymer layer to form a second opening. The metal pillar is exposed through the second opening. A second sidewall of the second polymer layer exposed to the second opening has a second tilt angle greater than the first tilt angle.

Abstract: A semiconductor structure includes a substrate; a die disposed over the substrate, and including a die pad, a conductive via disposed over the die pad and a dielectric material surrounding the conductive via; a molding disposed over the substrate and surrounding the die; a lower dielectric layer disposed nearer the substrate and over the dielectric material and the molding; and an upper dielectric layer disposed further the substrate and over the lower dielectric layer, wherein a material content ratio in the upper dielectric layer is substantially greater than that in the lower dielectric layer, and the material content ratio substantially inversely affects a mechanical strength of the upper dielectric layer and the lower dielectric layer.

Abstract: A content sharing method for a first electronic device is provided. The method includes: scanning several wireless signals and determining several slave electronic devices sending the wireless signals; according to the wireless signals, calculating a wireless signal strength corresponding to each slave electronic device; and according to the wireless signal strengths of the slave electronic devices, choosing a first slave electronic device among the slave electronic devices, wherein the wireless signal strength of the first slave electronic device is stronger than the wireless signal strengths of the other wireless signal strengths among the wireless signal strengths. The method further includes: building up a connection to the first slave electronic device; and, through the connection, automatically sending a content played in the first electronic device to the first slave electronic device and synchronously displaying the content on the first slave electronic device.

Abstract: An oxygen concentrating apparatus includes: at least one adsorption bed which is filled with absorbent capable of selectively adsorbing nitrogen relative to oxygen; an air supplier which supplies pressurized air to the adsorption bed; a flow channel regulating valve unit which regulates flow channels by allowing the pressurized air to be supplied to the adsorption bed from the air supplier and by allowing the air to be discharged from the adsorption bed to be depressurized such that a nitrogen adsorption process and a nitrogen desorption process are alternately performed; and a water removing unit which separates water from the pressurized air supplied from the air supplier and removes the separated water. The flow channel regulating unit and the water removing unit are at least partially housed within a single housing.

Abstract: An oxygen concentrating apparatus includes: at least one adsorption bed which is filled with absorbent capable of selectively adsorbing nitrogen relative to oxygen; an air supplier which supplies pressurized air to the adsorption bed; a flow channel regulating valve unit which regulates flow channels by allowing the pressurized air to be supplied to the adsorption bed from the air supplier and by allowing the air to be discharged from the adsorption bed to be depressurized such that a nitrogen adsorption process and a nitrogen desorption process are alternately performed; and a water removing unit which separates water from the pressurized air supplied from the air supplier and removes the separated water. The flow channel regulating unit and the water removing unit are at least partially housed within a single housing.

Abstract: A video generating system includes: a plurality of image sensors, arranged to generate a plurality of images and a plurality of synchronization signals corresponding to the images; a combining circuit, coupled to the image sensors, arranged to generate a plurality of output images according to the images, and generate a plurality of output synchronization signals corresponding to the output images according to the synchronization signals; and a bus, coupled between the image sensors and the combining circuit, arranged to perform signal transmission. The image sensors comprise a first image sensor and a second image sensor; and when the combining circuit receives image data of at least a first image generated by the first image sensor, the combining circuit does not receive image data of at least a second image generated by the second image sensor at the same time.

Abstract: A method for peer-to-peer multimedia data sharing suitable for an electronic device is provided. The method includes the following step: scanning at least one sink device having Peer-to-Peer connectivity; determining a candidate device from the at least one sink device according a distance between the electronic device and the at least one sink device; deriving a beacon from the candidate device; establishing a Peer-to-Peer connection with the candidate device according to the beacon; and transmitting multimedia data to the candidate device.

Abstract: A content sharing method for a first electronic device is provided. The method includes: scanning several wireless signals and determining several slave electronic devices sending the wireless signals; according to the wireless signals, calculating a wireless signal strength corresponding to each slave electronic device; and according to the wireless signal strengths of the slave electronic devices, choosing a first slave electronic device among the slave electronic devices, wherein the wireless signal strength of the first slave electronic device is stronger than the wireless signal strengths of the other wireless signal strengths among the wireless signal strengths. The method further includes: building up a connection to the first slave electronic device; and, through the connection, automatically sending a content played in the first electronic device to the first slave electronic device and synchronously displaying the content on the first slave electronic device.

Abstract: A method and an apparatus for sharing display frame are provided. The apparatus includes a display unit, a communication unit, and a processing unit. In the method, a plurality of electronic apparatuses are searched by the processing unit through the communication unit, where each of the electronic apparatuses is configured to display a corresponding display frame. The processing unit selects one or a plurality of the electronic apparatuses, and synchronously displays at least first frame displayed by the display unit on one or a plurality of the selected electronic apparatus.

Abstract: A video generating system and a video generating method, which combine images generated by a plurality of different image sensors to generate output images, are provided. In the inventive video generating system and method, the image sensors share a signal transmission interface to transmit image data and synchronization signals in a time-shared manner to reduce the complexity of the signal transmission interface.

Abstract: Processes for making and using compounds of formula (I): wherein R1, R2, R3, R4a, R4b, R5 and R6 are defined herein, as well as other indene derivatives are disclosed herein. These compounds are disclosed as being useful in treating inflammatory conditions or diseases.

Abstract: A video generating system includes: a plurality of image sensors, arranged to generate a plurality of images and a plurality of synchronization signals corresponding to the images; a combining circuit, coupled to the image sensors, arranged to generate a plurality of output images according to the images, and generate a plurality of output synchronization signals corresponding to the output images according to the synchronization signals; and a bus, coupled between the image sensors and the combining circuit, arranged to perform signal transmission. The image sensors comprise a first image sensor and a second image sensor; and when the combining circuit receives image data of at least a first image generated by the first image sensor, the combining circuit does not receive image data of at least a second image generated by the second image sensor at the same time.