Abstract: A digital television chip having a reduced layout size is disclosed, comprising a multiplexer, and first and second converting units. The multiplexer, according to a control signal, outputs one of S-video signals SY and SC to the first converting unit, outputs the other of the S-video signals SY and SC to the second converting unit, outputs one of Tuner CVBS signals VIF and SIF to the first converting unit, outputs the other of the Tuner CVBS signals VIF and SIF to the second converting unit, or outputs a CVBS Line-in Video signal to one of the first and second converting units, for reducing the size of the chip. The first converting unit converts one of the S-video signals SY and SC, one of the Tuner CVBS signals VIF and SIF, or the CVBS Line-in Video signal into a first digital signal for signal processing. The second converting unit converts one of the S-video signals SY and SC, one of the Tuner CVBS signals VIF and SIF, or the CVBS Line-in Video signal into a second digital signal for signal processing.

Abstract: A semiconductor device assembly includes a first semiconductor die, a second semiconductor die, at least one semiconductor package component or another semiconductor die, a first conductive element and a second conductive element. The first semiconductor die includes at least one bonding pad. The second semiconductor die includes a bonding pad module. The first conductive element is coupled between the bonding pad module of the second semiconductor die and the bonding pad of the first semiconductor die, and the second conductive element is coupled between the bonding pad module of the second semiconductor die and the semiconductor package component or the another semiconductor die, wherein the first semiconductor die is coupled to the semiconductor package component or the another semiconductor die via the bonding pad and the bonding pad module and the first and second conductive elements.

Abstract: A delta-sigma analog-to-digital conversion apparatus for receiving an analog input signal to generate a digital output signal includes a subtracting unit, a quantizer, and a feedback unit. The subtracting unit is utilized for performing a subtraction function to generate a subtracted signal according to the analog input signal and a feedback signal. The quantizer is coupled to the subtracting unit and utilized for performing quantization to generate a quantized signal according to the subtracted signal. The feedback unit is coupled between the subtracting unit and the quantizer, and utilized for providing the feedback signal to the subtracting unit according to the quantized signal. The subtracting unit is arranged to reduce signal input swing of the quantizer.

Abstract: A semiconductor device assembly includes a first semiconductor die, a second semiconductor die, at least one semiconductor package component or another semiconductor die, a first conductive element and a second conductive element. The first semiconductor die includes at least one bonding pad. The second semiconductor die includes a bonding pad module. The first conductive element is coupled between the bonding pad module of the second semiconductor die and the bonding pad of the first semiconductor die, and the second conductive element is coupled between the bonding pad module of the second semiconductor die and the semiconductor package component or the another semiconductor die, wherein the first semiconductor die is coupled to the semiconductor package component or the another semiconductor die via the bonding pad and the bonding pad module and the first and second conductive elements.

Abstract: A semiconductor device assembly includes a first semiconductor die, a second semiconductor die, at least one semiconductor package component or another semiconductor die, a first conductive element and a second conductive element. The first semiconductor die includes at least one bonding pad. The second semiconductor die includes a bonding pad module. The first conductive element is coupled between the bonding pad module of the second semiconductor die and the bonding pad of the first semiconductor die, and the second conductive element is coupled between the bonding pad module of the second semiconductor die and the semiconductor package component or the another semiconductor die, wherein the first semiconductor die is coupled to the semiconductor package component or the another semiconductor die via the bonding pad and the bonding pad module and the first and second conductive elements.

Abstract: A delta-sigma analog-to-digital conversion apparatus for receiving an analog input signal to generate a digital output signal includes a subtracting unit, a quantizer, and a feedback unit. The subtracting unit is utilized for performing a subtraction function to generate a subtracted signal according to the analog input signal and a feedback signal. The quantizer is coupled to the subtracting unit and utilized for performing quantization to generate a quantized signal according to the subtracted signal. The feedback unit is coupled between the subtracting unit and the quantizer, and utilized for providing the feedback signal to the subtracting unit according to the quantized signal. The subtracting unit is arranged to reduce signal input swing of the quantizer.

Abstract: An element-selecting method is utilized for selecting the converting elements of the DAC to perform the digital-to-analog conversion. The element-selecting method first determines whether the selected times of the converting elements are all equal or not. When the selected times of the converting elements are all equal, the element-selecting method determines a shifting-step according to the input signal and the number of the converting elements; otherwise, the element-selecting method determines the shifting-step to be a predetermined value. The element-selecting method then selects a converting element from the DAC by means of separating the converting element from a last selected converting element by the shifting-step. In this way, the error accumulated because of the mismatch of the converting elements is eliminated, and the toggle rate of the DAC is reduced. Hence, the glitch and the dynamic errors of the DAC are reduced, improving the performance of the DAC.

Abstract: A track and hold amplifier is provided. The track and hold amplifier includes an input node receiving an analog signal, a buffer coupled between a first node and an output node, a first switch coupled between the input node and the first node, a plurality of switching circuits and a voltage generating unit. Each of the switching circuits includes a capacitor coupled between the first node and a second node. The voltage generating unit selectively provides a common signal or a reference signal to the capacitors of the switching circuits, wherein the reference signal is independent from the analog signal.

Abstract: A delta-sigma analog-to-digital conversion apparatus for receiving an analog input signal to generate a digital output signal includes a subtracting unit, a quantizer, and a feedback unit. The subtracting unit is utilized for performing a subtraction function to generate a subtracted signal according to the analog input signal and a feedback signal. The quantizer is coupled to the subtracting unit and utilized for performing quantization to generate a quantized signal according to the subtracted signal. The feedback unit is coupled between the subtracting unit and the quantizer, and utilized for providing the feedback signal to the subtracting unit according to the quantized signal. The subtracting unit is arranged to reduce signal input swing of the quantizer.

Abstract: A delta-sigma analog-to-digital conversion apparatus for receiving an analog input signal to generate a digital output signal includes a subtracting unit, a quantizer, and a feedback unit. The subtracting unit is utilized for performing a subtraction function to generate a subtracted signal according to the analog input signal and a feedback signal. The quantizer is coupled to the subtracting unit and utilized for performing quantization to generate a quantized signal according to the subtracted signal. The feedback unit is coupled between the subtracting unit and the quantizer, and utilized for providing the feedback signal to the subtracting unit according to the quantized signal. The subtracting unit is arranged to reduce signal input swing of the quantizer.

Abstract: An operating circuit includes an amplifier having a first input terminal coupled to a reference voltage; a first transconducting element for selectively generating a first current; a second transconducting element for selectively generating a second current; a resistive element having a first terminal coupled to the first transconducting element; a capacitive element having a first terminal selectively coupled to the second transconducting element; and a switching device. The switching device has a first configuration to connect the first terminal of the capacitive element to the second transconducting element and connect the first terminal of the resistive element to a second input terminal of the amplifier, and has a second configuration to disconnect the first terminal of the capacitive element from the second transconducting element and connect the second input terminal of the amplifier to the first terminal of the capacitive element instead of the first terminal of the resistive element.

Abstract: A track and hold amplifier is provided. The track and hold amplifier includes an input node receiving an analog signal, a buffer coupled between a first node and an output node, a first switch coupled between the input node and the first node, a plurality of switching circuits and a voltage generating unit. Each of the switching circuits includes a capacitor coupled between the first node and a second node. The voltage generating unit selectively provides a common signal or a reference signal to the capacitors of the switching circuits, wherein the reference signal is independent from the analog signal.

Abstract: A track and hold amplifier is provided. The track and hold amplifier includes an input node receiving an analog signal, a buffer coupled between a first node and an output node, a first switch coupled between the input node and the first node, a plurality of switching circuits and a voltage generating unit. Each of the switching circuits includes a capacitor coupled between the first node and a second node. The voltage generating unit selectively provides a common signal and a reference signal to the capacitors of the switching circuits, wherein the reference signal is independent from the analog signal and the common signal.

Abstract: A track and hold amplifier is provided. The track and hold amplifier includes an input node receiving an analog signal, a buffer coupled between a first node and an output node, a first switch coupled between the input node and the first node, a plurality of switching circuits and a voltage generating unit. Each of the switching circuits includes a capacitor coupled between the first node and a second node. The voltage generating unit selectively provides a common signal and a reference signal to the capacitors of the switching circuits, wherein the reference signal is independent from the analog signal and the common signal.

Abstract: A semiconductor device assembly includes a first semiconductor die, a second semiconductor die, at least one semiconductor package component or another semiconductor die, a first conductive element and a second conductive element. The first semiconductor die includes at least one bonding pad. The second semiconductor die includes a bonding pad module. The first conductive element is coupled between the bonding pad module of the second semiconductor die and the bonding pad of the first semiconductor die, and the second conductive element is coupled between the bonding pad module of the second semiconductor die and the semiconductor package component or the another semiconductor die, wherein the first semiconductor die is coupled to the semiconductor package component or the another semiconductor die via the bonding pad and the bonding pad module and the first and second conductive elements.

Abstract: A container assembly has a raw-material container and a product-collection container, which are heat resistant and pressure resistant and have graduations formed on a sidewall thereof and a joint protruding therefrom. The product-collection container is detachably mounted on the raw-material container and communicates with the raw-material container through the joint. Since the raw-material container has graduations, an amount of raw materials can be consistently added in each batch, therefore, conditions of sublimation such as pressure, temperature or the like do not require adjustment and may just be monitored to ensure maximum yield is attained. Therefore, a sublimation procedure is simple, saves time and decreases product costs. Since, the product-collection container has graduations, an amount of product can be observed easily by the graduations and the product is easily removed without removing impure byproducts. Therefore, purity of the product can be increased.

Abstract: The invention provides an analog-to-digital converter (ADC). The ADC comprises a plurality of stages connected in series, a gain error correction module, and a look-ahead module. Each of the stages derives a stage output value from a stage input signal and generates a stage output signal as the stage input signal of a subsequent stage, wherein one of the stages is selected as a target stage for estimating a gain value thereof. The gain error correction module delivers a correction number to the target stage to affect the stage output signal of the target stage and the stage output values of subsequent stages of the target stage, receives at least one auxiliary output value from a look-ahead module dedicated to the target stage, and derives an error estimate of the gain value of the target stage from the stage output values and the auxiliary output value.

Abstract: The invention provides a method for gain error estimation in an analog-to-digital converter. In one embodiment, the analog-to-digital converter comprises a plurality of stages. A series of correction numbers applied to a target stage selected from the stages are correlated with a series of calculation values calculated according to digital output values of the stages to generate a series of gain error estimates. The series of gain error estimates are multiplied by a series of updating parameters to obtain a series of first values. A series of previous gain error values are multiplied by one minus the corresponding updating parameters to obtain a series of second values, wherein the series of previous gain values are obtained by delaying the present gain error values. The series of first values and the series of second values are correspondingly added to obtain a series of present gain error values for gain error correction.

Abstract: The present invention provides a signal amplifying apparatus, for converting a first input signal into a first output signal. The signal amplifying apparatus includes an input stage circuit for receiving the first input signal; a cascoded circuit coupled to the input stage circuit, including a plurality of first cascoded transistors, wherein equivalent oxide thicknesses of the first cascoded transistors are not the same; an output stage circuit has a first input port coupled to the cascoded circuit, and a first output port for outputting the first output signal; and a first capacitor has a first terminal connected to the first output port of the output stage circuit and a second terminal coupled to the cascoded circuit, wherein the second terminal is not connected to the first input port of the output stage circuit.

Abstract: The invention provides a method for gain error estimation for an analog-to-digital converter. In one embodiment, the analog-to-digital converter comprises a plurality of stages. First, a series of correction numbers applied to a target stage selected from the stages are correlated with a series of first values calculated according to digital output values of the stages to generate a series of gain error estimates. Every first number of the series of gain error estimates is then averaged to obtain a series of second values. A second number of the series of second values is then averaged to obtain a gain error of the target stage.