Abstract: Described apparatuses and methods relate to a bank-level self-refresh for a memory system. A memory device can include a controller with logic that implements self-refresh operations in the memory device. The logic may perform self-refresh operations on a set of banks of the memory device that is less than all banks within the memory device. The set of banks of the memory device may be determined such that the peak current in a power distribution network of the memory device is bounded when the self-refresh operation is performed. Accordingly, bank-level self-refresh can reduce a cost of the memory device of a memory system by enabling use of a less complicated power distribution network. The bank-level self-refresh may also be implemented with different types of refresh operations. Amongst other scenarios, bank-level self-refresh can be deployed in memory-expansion environments.

Abstract: Described apparatuses and methods relate to self-refresh arbitration. In a memory system with multiple memory components, an arbiter is configured to manage the occurrence of self-refresh operations. In aspects, the arbiter can receive one or more self-refresh request signals from at least one memory controller for authorization to command one or more memory components to enter a self-refresh mode. Upon receiving the one or more self-refresh request signals, the arbiter, based on a predetermined configuration, can transmit one or more self-refresh enable signals to the at least one memory controller with authorization to command the one or more memory components to enter the self-refresh mode. The configuration can ensure that fewer than all memory components simultaneously enter the self-refresh mode. In so doing, memory components can perform self-refresh operations without exceeding an instantaneous power threshold. The arbiter can be included in, for instance, a Compute Express Link™ (CXL™) memory module.

Abstract: Described apparatuses and methods relate to self-refresh arbitration. In a memory system with multiple memory components, an arbiter is configured to manage the occurrence of self-refresh operations. In aspects, the arbiter can receive one or more self-refresh request signals from at least one memory controller for authorization to command one or more memory components to enter a self-refresh mode. Upon receiving the one or more self-refresh request signals, the arbiter, based on a predetermined configuration, can transmit one or more self-refresh enable signals to the at least one memory controller with authorization to command the one or more memory components to enter the self-refresh mode. The configuration can ensure that fewer than all memory components simultaneously enter the self-refresh mode. In so doing, memory components can perform self-refresh operations without exceeding an instantaneous power threshold. The arbiter can be included in, for instance, a Compute Express Link™ (CXL™) memory module.

Abstract: Described apparatuses and methods relate to a bank-level self-refresh for a memory system. A memory device can include logic that implements self-refresh operations in the memory device. The logic may perform self-refresh operations on a set of banks of the memory device that is less than all banks within the memory device. The set of banks of the memory device may be determined such that the peak current in a power distribution network of the memory device is bounded when the self-refresh operation is performed. Accordingly, bank-level self-refresh can reduce a cost of the memory device of a memory system by enabling use of a less complicated power distribution network. The bank-level self-refresh may also be implemented with different types of refresh operations. Amongst other scenarios, bank-level self-refresh can be deployed in memory-expansion environments.

Abstract: Systems, apparatuses, and methods related to a memory device, such as a low-power dynamic random-access memory (DRAM) and an associated host device are described. The memory device and the host device can include control logic that enables the host device to transmit a burst value to the memory device, which may enable the memory device, the host, or both, to manage refresh operations during a normal operation mode or a self-refresh mode. The burst value can be transmitted to the memory device in association with a command (e.g., a command directing the memory device to enter the self-refresh mode). The burst value can specify a number of self-refresh operations to be initiated at the memory device in response to receiving the command. When the specified number of self-refresh operations are completed, regular self-refresh operations may begin, with an internal self-refresh timer counting an interval to the next self-refresh operation.

Abstract: Systems, apparatuses, and methods related to a memory device, such as a low-power dynamic random-access memory (DRAM), and an associated host device are described. The memory device includes control circuitry that can determine an operational status of the memory device (e.g., whether the memory device is currently performing a self-refresh operation). The control circuitry can also transmit a signal indicative of the operational status to the host device in response to receiving a command directing the memory device to exit a self-refresh mode. The host device can operate based on the signal. The signal may therefore allow the memory device, the host device, or both to manage operations, including whether to send, receive, or process commands and data read/write requests during times that may be associated with self-refresh operations.

Abstract: Described apparatuses and methods relate to adaptive wordline refresh for a memory system that may support a nondeterministic protocol. To help manage power delivery networks in a memory system, a memory device can include logic that can stagger activation of multiple wordlines that are to be activated or refreshed approximately simultaneously. The logic circuitry can be coupled between wordlines that are to be activated and delay propagation of the activation signal. Thus, a first group of wordlines (e.g., “before” the logic circuitry) are activated by the signal, but activation of a second group of wordlines (e.g., “after” the logic circuitry), is delayed, reducing the peak current draw. Additional logic circuitries can be coupled between the wordlines to divide the wordlines into multiple groups, thereby staggering the activation of wordlines that are activated by a refresh command, which can reduce the peak current draw and power consumption.

Abstract: Methods, systems, and devices for memory wear management are described. A device may include an interface controller and a non-volatile memory. The interface controller may manage wear-leveling procedures for memory banks in the non-volatile memory. For example, the interface controller may select a row in a memory bank for the wear-leveling procedure. The interface controller may store data from the row in a buffer in the interface controller. The interface controller may then transfer the data to the non-volatile memory so that the non-volatile memory can write the data to a second row of the memory bank.

Abstract: Methods, systems, and devices for transaction management using metadata are described. In some examples, a memory device may include a volatile memory, and a non-volatile memory, which may have different access latencies. The memory device may receive from a host device a read command for data located at an address of the non-volatile memory. In response to the read command, the memory device and may determine whether the data is stored in the volatile memory. The memory device may then transmit, to the host device data and according to an expected latency, a set of data and an indication of whether the set of data was previously requested by the host device or unrequested by the host device. In some examples, the memory device may also transmit an identifier associated with the read command and a hash of the address.

Abstract: Disclosed herein is an apparatus that includes a plurality of memory banks and a refresh controller configured to perform a refresh operation on one or more of the plurality of memory banks having a first state without performing the refresh operation on one or more of the plurality of memory banks having a second state responsive to a first refresh command, and perform the refresh operation on a selected one of the plurality of memory banks responsive to a second refresh command. The refresh controller is configured to bring the selected one of the plurality of memory banks into the second state when the refresh operation is performed responsive to the second refresh command.

Abstract: Systems and methods for multi-wordline direct refresh operations in response to a row hammer error in a memory bank. The approach includes detecting, by a row hammer mitigation component, a row hammer error in a memory bank; and then triggering, by the row hammer mitigation component, a response to the row hammer error. Further, a memory controller receives, from a mode register, data, based on an aliasing row counter policy, selecting a type of multi-wordline direct refresh operation to be performed on a plurality of victim memory rows within the memory bank, wherein the plurality of victim memory rows are dispersed across a plurality of memory sub-banks. The approach includes concurrently executing the selected multi-wordline direct refresh operation to the plurality of victim memory rows.

Abstract: A dynamic random access memory employs either or both of a normal row copy operation or a fast row copy operation to copy selected data from a first row of memory to a second row of memory, without transferring the data to an intermediary processor such as a central processing unit or a memory controller. Both operations depend on a concurrent electrical activation of two separate wordlines within a bank of a DRAM. For the fast row copy operation, the two separate wordlines are part of a shared section of a DRAM bank, having shared bitlines. Bit values are copied directly in parallel via common bitlines. For the normal row copy operation, the two separate wordlines are part of a common bank but not a shared section. Bit values are copied in serial via a general input/output bus within the bank.

Abstract: Apparatuses and methods including memory commands for semiconductor memories are described. A controller provides a memory system with memory commands to access memory. The commands are decoded to provide internal signals and commands for performing operations, such as operations to access the memory array. The memory commands provided for accessing memory may include timing command and access commands. Examples of access commands include a read command and a write command. Timing commands may be used to control the timing of various operations, for example, for a corresponding access command. The timing commands may include opcodes that set various modes of operation during an associated access operation for an access command.

Abstract: Apparatuses and methods for setting a duty cycler adjuster for improving clock duty cycle are disclosed. The duty cycle adjuster may be adjusted by different amounts, at least one smaller than another. Determining when to use the smaller adjustment may be based on duty cycle results. A duty cycle monitor may have an offset. A duty cycle code for the duty cycle adjuster may be set to an intermediate value of a duty cycle monitor offset. The duty cycle monitor offset may be determined by identifying duty cycle codes for an upper and for a lower boundary of the duty cycle monitor offset.

Abstract: Apparatuses and methods for setting a duty cycler adjuster for improving clock duty cycle are disclosed. The duty cycle adjuster may be adjusted by different amounts, at least one smaller than another. Determining when to use the smaller adjustment may be based on duty cycle results. A duty cycle monitor may have an offset. A duty cycle code for the duty cycle adjuster may be set to an intermediate value of a duty cycle monitor offset. The duty cycle monitor offset may be determined by identifying duty cycle codes for an upper and for a lower boundary of the duty cycle monitor offset.

Abstract: Described apparatuses and methods provide error correction code (ECC) circuitry that is shared between two or more memory banks of a memory, such as a low-power dynamic random-access memory (DRAM). A memory device may include one or more dies, and a die can have multiple memory banks. The ECC circuitry can service at least two memory banks by producing ECC values based on respective data stored in the two memory banks. By sharing the ECC circuitry, instead of including a per-bank ECC engine, a total die area allocated to ECC functionality can be reduced. Thus, the ECC circuitry can be elevated from a one-bit ECC algorithm to a multibit ECC algorithm, which may increase data reliability. In some cases, memory architecture may operate in environments in which a masked-write command or an internal read-modify-write operation is precluded, including with shared ECC circuitry.

Abstract: Disclosed herein is an apparatus that includes a plurality of memory banks and a refresh controller configured to perform a refresh operation on one or more of the plurality of memory banks having a first state without performing the refresh operation on one or more of the plurality of memory banks having a second state responsive to a first refresh command, and perform the refresh operation on a selected one of the plurality of memory banks responsive to a second refresh command. The refresh controller is configured to bring the selected one of the plurality of memory banks into the second state when the refresh operation is performed responsive to the second refresh command.

Abstract: Methods, systems, and devices for a low-speed memory operation are described. A controller associated with a memory device may, for example, identify a clock mode for a system clock and determine that a speed of the system clock is below a threshold. The controller may generate (or cause to be generated) an internal data clock signal having a shorter period than an external data clock signal (which may have a speed based on the system clock speed). Also, the controller may use, instead of the external data clock signal, the internal data clock signal to generate data from the memory device, which may provide reduced latency. Further, the controller may deactivate (or cause to be deactivated) an external data clock that generates the external data clock signal.

Abstract: Some memory dies in a stack can be connected externally to the stack and other memory dies in the stack can be connected internally to the stack. The memory dies that are connected externally can act as interface dies for other memory dies that are connected internally thereto. The external connections can be used for transmitting signals indicative of data to and/or from the memory dies while the memory dies in the stack can be connected by a cascading connection for transmission of other signals such as command, address, power, ground, etc.

Abstract: In some examples, memory die may include a selection pad, which may be coupled to a power potential. The selection pad may provide a signal to a selection control circuit, which may control a selection circuit to couple a power pad to one of multiple power rails. In some examples, a power management integrated circuit may include a selection circuit to provide one power potential to a package including a memory die when a selection signal has a logic level and another power potential when the selection signal has another logic level.