Abstract: A packaged semiconductor device structure includes a semiconductor chip with an organic material covering thereon. The semiconductor chip is placed in a package and hermetically sealed with a low melting point glass. The organic covering serve to suppress undesirable influence on the semiconductor chip by .alpha.-rays which may be radiated from the package, and a getter material is placed in the package for decreasing undesirable gases in the package which may be emitted by the organic covering during the sealing process.

Abstract: A method for bonding an aluminum wire to a minute pad of an electronic circuit by an ultrasonic bonding technique. An anodized aluminum wire having its surface subjected to insulating coating is used. The bonding is effected such that this anodized aluminum wire is pressed against the pad by means of a wedge and, while a load is being thereby applied to the wire, ultrasonic vibrations are caused in the wedge. The alumite is exfoliated from the base material by application of the load and ultrasonic energy to the wire, and this base material and pad are bonded together at this exfoliated portion.

Abstract: The present invention relates to a semiconductor device having a semiconductor element which is sealed by a ceramic package, wherein a shielding member is provided near it from upper surface of the semiconductor element to shield the alpha-particles radiated from the package.

Abstract: A wire bonding apparatus which can variously change the shape of a loop of a bonding wire and can restrict the loop shape in accordance with specifications of an article being wire bonded. In the wire bonding apparatus, a wire guide unit moving both vertically and transversely, independently of a bonding tool, is disposed in proximity of the bonding tool which moves relative to the article to be wire bonded and which connects the wire between a first bonding region and the second bonding region. A mechanism is provided which changes the shape of the loop of the bonding wire when the wire guide unit moves vertically and transversely.

Abstract: In a process for producing an alcohol by hydroformylation comprises reacting a straight chained, branched or alicyclic mono-olefin having from 3 to 20 carbon atoms with carbon monoxide and hydrogen to form an alcohol having carbon atoms greater in number by one than the carbon atoms of the mono-olefin, the improvement comprises(a) a fist step in which the mono-olefin is hydroformylated with use of a cobalt catalyst in the presence of a gas mixture of carbon monoxide and hydrogen at a high temperature under high pressure to selectively form an aldehyde at a conversion of the mono-olefin being from 50 to 95 mol % while suppressing the formation of an alcohol, and the cobalt catalyst is then removed from the unreacted olefin and the formed aldehyde by decomposition or extraction, and(b) a second step in which the mixture of the unreacted mono-olefin and the formed aldehyde freed from the cobalt catalyst in the first step is reacted with a gas mixture of carbon monoxide and hydrogen with use of a cobalt organopho