Abstract: A molding die for molding a substrate to be included in a microchip includes a first die and a second die contactable with and separable from the first die. One of the first die and the second die includes a ridge for molding the groove and a columnar first protrusion for molding at least a smallest diameter portion of a hole in the substrate, the portion having the smallest inner diameter. The other of the first die and the second die includes a second protrusion which is formed to be columnar having a diameter larger than the diameter of the first protrusion and contacts with a distal end of the first protrusion to mold the hole so as to extend through the substrate in cooperation with the first protrusion. A microchip also is provided.

Abstract: A die having a plurality of cavities and a temperature sensor for acquiring a temperature value in which the number of the cavities is larger than that of electrothermal conversion elements. When viewed from a direction perpendicular to the surface of a parting line, all cavities and a temperature sensor are arranged in a region occupied by the electrothermal conversion elements. Interval between the outlines of the cavities is smaller than the minimum interval between the outline of the cavity and the electrothermal conversion element, and the shortest distance between the electrothermal conversion element and the temperature measuring portion of a temperature measuring element is shorter than the minimum interval between the outline of the cavity and the electrothermal conversion element.

Abstract: An injection mold composed of a movable mold and a fixed mold. The movable mold has bases, a heat insulating layer and a surface processed layer, and the fixed mold has a base. A heat insulator is provided on the inner circumferential surface of the base of the movable mold at a part forming a wall of a cavity. The heat insulating layer is in the rear of the surface processed layer, and therefore, the transfer accuracy of a fine configuration of the surface processed layer is improved. Additionally, since the heat insulator is provided adjacent to the fine configuration, heat radiation from resin is inhibited, and the transfer accuracy of the fine configuration is further improved.

Abstract: A molding die for molding a substrate to be included in a microchip includes a first die and a second die contactable with and separable from the first die. A molding space for molding the substrate and a gate for introducing resin into the molding space are formed between the first die and the second die. A molding surface of the first die includes a first-die substrate molding region which molds the one surface of the substrate, a gate-defining region which defines the gate, and a rising region which is located between the gate-defining region and the first-die substrate molding region and extends from an edge of the first-die substrate molding region toward the second die. The gate-defining region is closer to the second die than the first-die substrate molding region. A microchip and a manufacturing apparatus also are provided.

Abstract: A microchip which comprises: a resinous base having a plurality of fine channels formed on one side thereof, one or more cylindrical parts disposed so as to protrude from the other side, and a through-hole which pierces each cylindrical part along the axis thereof and communicates with the fine channel so that the diameter of the inner wall of the through-hole gradually decreases from the tip end of the cylindrical part toward the fine channel at a first inclination angle; and a resinous covering member bonded to that side of the resinous base on which the fine channels have been formed. The microchip has been configured so that a liquid sample can be introduced from the tip end of each cylindrical part through the through-hole. The wall thickness of the cylindrical part on the end side where a liquid sample is to be introduced has been made smaller than the wall thickness thereof on the base side where the cylindrical part has been formed, by forming a step therebetween.

Abstract: A die (100) is provided with: a cavity which can contain a molten resin; a micro-structure (102) provided on a molding transfer surface (101) forming the cavity such that the fine structure protrudes to the cavity side from the molding transfer surface (101); and a anti-shrinkage convex section (103) protruding higher than the micro-structure (102) to the cavity side from one surface. A molten resin is applied to the die (100) and the surface of the die is relatively removed in the order of the micro-structure (102) and the anti-shrinkage convex section (103) from a resin substrate (001) formed by solidifying the resin.

Abstract: An injection molding comprises: a fixed mold; a movable mold which is capable of contacting to and separating from the fixed mold; and an injection unit which supplies molten resin to a space formed between the fixed mold and the movable mold when being pressed to a non-molding face of the fixed mold. The injection unit comprises: a nozzle portion which injects molten resin to the space formed between the molds; an injecting portion which applies molten resin pressure toward the space formed between the fixed mold and the movable mold though the nozzle portion; a heater and a temperature sensor provided on the nozzle portion; and a heater and a temperature sensor provided on the injecting portion, and detection accuracy of the sensor of the nozzle portion is higher than that of the injecting potion. There is thus provided an injection molding machine capable of manufacturing optics with high accuracy without considerable cost-up by realizing stable and highly accurate injection.

Abstract: A method for bonding resin members by laser welding in which melting of a resin member can be prevented on the contact surface with a base or a tool used for bonding. In the bonding method, a resin member (1) is mounted on a base (3) and a surface of the base (3) in contact with the resin member (1) is an optical mirror surface. A surface of the resin member (1) is coated with a light absorbing agent (4), a resin member (2) is placed thereon and then a laser light (10) is irradiated from the resin member (2) side in order to melt the resin on the bonding surface of the resin member (1) and the resin member (2), thereby bonding the resin members together. The laser light (11) penetrated through the bonding surface reaches the contact surface where the resin member (1) and the base (3) are in contact with each other, and since the laser light (11) penetrates the bonding surface without being scattered or absorbed, melting of the resin member can be prevented.

Abstract: A molding machine includes a fixed mold and a movable mold. The molding machine is a so called micro molding machine which provides less than 150 KN of the mold clamping force for clamping the fixed mold and the movable mold. A positional shift length between both molds is preset at ±20 gm or less. Further, cavities are inserted in base molds of both molds respectively. Furthermore, cores are inserted in the cavities. The position of each cavity is adjustable with respect to each associated base mold. The position of each core is also adjustable with respect to each associated cavity. Moreover, the molding machine can simultaneously mold a plurality of optical components.

Abstract: An injection molding method for a plate-shaped resin substrate, wherein a through-hole whose diameter gradually becomes smaller from one surface to the other surface is provided thereon and fine flow path that connects to the through-hole is provided on the other surface. A cavity is formed by joining one molding die forming one surface with the other molding die forming the other surface. A part of the one molding die that forms the through-hole includes a taper pin that protrudes from the one molding die toward the other molding die. The substrate is formed by filling the cavity with resin material, and the substrate is released from the other molding die by separating the one molding die from the other molding die. By pushing the inner wall of the through-hole with the taper pin projected further toward the other molding die, the substrate is released from the one molding die.

Abstract: An optical element manufacturing apparatus is provided with a fixed side metal mold 5 attached to a fixed platen 1, and a movable side metal mold 6 attached to a movable platen 2. The fixed side metal mold 5 and the movable side metal mold 6 are clamped by bringing both platens 1 and 2 close to each other. In the clamped status, a molding material is injected into a molding cavity between the both metal molds and an optical element is produced. A taper recessed section 11a and a taper protruding section 21a, provided on the fixed side metal mold 5 and the movable side metal mold 6 respectively, fit each other. The movable side metal mold 6 provides a friction mechanism section 23 which permits the metal mold to shift within a plane perpendicular to the clamping direction with respect to the movable platen 2.

Abstract: A die (100) is provided with: a cavity which can contain a molten resin; a micro-structure (102) provided on a molding transfer surface (101) forming the cavity such that the fine structure protrudes to the cavity side from the molding transfer surface (101); and a anti-shrinkage convex section (103) protruding higher than the micro-structure (102) to the cavity side from one surface. A molten resin is applied to the die (100) and the surface of the die is relatively removed in the order of the micro-structure (102) and the anti-shrinkage convex section (103) from a resin substrate (001) formed by solidifying the resin.

Abstract: Provided is a microchip having a protrusion to which a device for introducing or discharging a liquid sample, a device for causing the liquid sample to flow, or another device is connected, the protrusion retaining strength. The microchip includes a resin substrate (2) which has a fine flow channel (3), a penetrated hole (6) communicating with the fine flow channel (3), and a protrusion (5) formed so as to surround the penetrated hole (6) and project in the thickness direction. The protrusion (5) has a wall thickness (W) and a height (T) satisfying the relationship (T/10)?W?(T/2).

Abstract: A microchip which comprises: a resinous base having a plurality of fine channels formed on one side thereof, one or more cylindrical parts disposed so as to protrude from the other side, and a through-hole which pierces each cylindrical part along the axis thereof and communicates with the fine channel so that the diameter of the inner wall of the through-hole gradually decreases from the tip end of the cylindrical part toward the fine channel at a first inclination angle; and a resinous covering member bonded to that side of the resinous base on which the fine channels have been formed. The microchip has been configured so that a liquid sample can be introduced from the tip end of each cylindrical part through the through-hole. The wall thickness of the cylindrical part on the end side where a liquid sample is to be introduced has been made smaller than the wall thickness thereof on the base side where the cylindrical part has been formed, by forming a step therebetween.

Abstract: A purpose is to provide an optical component molding apparatus for producing a small-size and high-precision optical component and achieving good transferability and stability of a molded product. A multi-cavity molding machine 100 has a gate 51, a runner 52, and a sprue 53 each having the shape determined to meet conditions (1) to (5): (1) “Miminum gate thickness”/“Maximum runner thickness” is in a range of more than 0.2 to less than 1.0; (2) “Gate length”/“Maximum runner thickness” is in a range of more than 0.4 to less than 4.0; (3) “Outlet diameter of sprue” is in a range of more than 1.0 mm to less than 5.5 mm; (4) “Sprue length” is in a range of more than 10 mm to less than 40 mm; and (5) “Outlet diameter of sprue”/“Inlet diameter of sprue” is in a range of more than 1 to less than 8.

Abstract: Provided is a microchip manufacturing method by which a functional film is formed in a flow path channel and resin microchip substrates are bonded. The manufacturing method has a first step of forming SiO2 films (12, 22) representing the functional films on a surface having a flow path channel (11) of a microchip substrate (10) and on a surface having a flow path channel (21) of a microchip substrate (20) respectively; a second step of exfoliating the SiO2 films formed on the microchip substrates (10, 20) except the SiO2 films formed on the flow path channels (11, 21) by a cohesive member; and a third step of placing the microchip substrates (10, 20) one over another in such a way that the surfaces on which the flow path channels (11, 21) are formed face inside, and bonding the substrates by laser welding, ultrasonic wave welding or thermocompression bonding.

Abstract: An injection molding method for a plate-shaped resin substrate, wherein a through-hole whose diameter gradually becomes smaller from one surface to the other surface is provided thereon and fine flow path that connects to the through-hole is provided on the other surface. A cavity is formed by joining one molding die forming one surface with the other molding die forming the other surface. A part of the one molding die that forms the through-hole includes a taper pin that protrudes from the one molding die toward the other molding die. The substrate is formed by filling the cavity with resin material, and the substrate is released from the other molding die by separating the one molding die from the other molding die. By pushing the inner wall of the through-hole with the taper pin projected further toward the other molding die, the substrate is released from the one molding die.

Abstract: A mold assembly that is adapted to clamp fixed mold and movable mold together while making temperature adjustment and inject a molding material into a molding cavity provided therebetween, thereby producing an optical part. The mold assembly is one including fixed platen supporting fixed mold, provided on a part of its mold-side surface with locating hole and including ring of configuration with external and internal surfaces, fitted at its external surface in the locating hole, wherein the fixed mold is provided with a locating projection protruding toward the fixed platen, fitted in the internal surface of the locating hole, and wherein the ring consists of a material whose linear expansion coefficient is smaller than those of the material of the fixed platen and the material of the locating projection.

Abstract: A die having a plurality of cavities and a temperature sensor for acquiring a temperature value in which the number of the cavities is larger than that of electrothermal conversion elements. When viewed from a direction perpendicular to the surface of a parting line, all cavities and a temperature sensor are arranged in a region occupied by the electrothermal conversion elements. Interval between the outlines of the cavities is smaller than the minimum interval between the outline of the cavity and the electrothermal conversion element, and the shortest distance between the electrothermal conversion element and the temperature measuring portion of a temperature measuring element is shorter than the minimum interval between the outline of the cavity and the electrothermal conversion element.

Abstract: A device to manufacture an optical component, wherein a fixed metal mold 5 and a movable metal mold 6 are clamped to each other while controlling a temperature, and a molding material is injected into the cavity therebetween. In the device, there are disposed electrothermal conversion elements 15 and 25 to control the temperature by electrothermal conversion in response to an electric input, and a medium temperature control section 8 to control the temperature through heat exchange by circulating a heating medium in medium flow paths 16 and 26 in the device from an outside of the device.