Abstract: An injection mold and an injection molding apparatus having a movable mold and a fixed mold. Each of the movable/fixed molds has bases, and a runner, a gate and a cavity are formed. The gate is composed of recesses made in mutually opposite end surfaces of sleeve-like heat insulators provided for the bases. Thereby, the gate is heat-insulated, and resin in the gate is prevented from cooling down during a pressure retention step. Thus, the resin keeps fluidity longer.

Abstract: A method for bonding resin members by laser welding in which melting of a resin member can be prevented on the contact surface with a base or a tool used for bonding. In the bonding method, a resin member (1) is mounted on a base (3) and a surface of the base (3) in contact with the resin member (1) is an optical mirror surface. A surface of the resin member (1) is coated with a light absorbing agent (4), a resin member (2) is placed thereon and then a laser light (10) is irradiated from the resin member (2) side in order to melt the resin on the bonding surface of the resin member (1) and the resin member (2), thereby bonding the resin members together. The laser light (11) penetrated through the bonding surface reaches the contact surface where the resin member (1) and the base (3) are in contact with each other, and since the laser light (11) penetrates the bonding surface without being scattered or absorbed, melting of the resin member can be prevented.

Abstract: Mold releasability of a molding die from a master is improved. The master is a mother body of the molding die. The master has a groove corresponding to a flow channel of a resin molded product, and the cross-section of the bottom surface portion of the groove is in the form of a curved surface.

Abstract: A microchip, including two resin substrates, wherein a groove serving as a channel is formed on a surface of at least one of the two resin substrates, and the surfaces of the two resin substrates are adhered to each other, and the surface carrying the formed groove faces an inner side of the two adhered resin substrates, the microchip is characterized in that a portion of at least one of the two resin substrates structures a portion of a condenser lens to focus light rays, coming from an external section, onto a predetermined position in the groove.

Abstract: Provided is a microchip manufacturing method by which a functional film is formed in a flow path channel and resin microchip substrates are bonded. The manufacturing method has a first step of forming SiO2 films (12, 22) representing the functional films on a surface having a flow path channel (11) of a microchip substrate (10) and on a surface having a flow path channel (21) of a microchip substrate (20) respectively; a second step of exfoliating the SiO2 films formed on the microchip substrates (10, 20) except the SiO2 films formed on the flow path channels (11, 21) by a cohesive member; and a third step of placing the microchip substrates (10, 20) one over another in such a way that the surfaces on which the flow path channels (11, 21) are formed face inside, and bonding the substrates by laser welding, ultrasonic wave welding or thermocompression bonding.

Abstract: An optical element manufacturing apparatus is provided with a fixed side metal mold 5 attached to a fixed platen 1, and a movable side metal platen 6 attached to a movable platen 2. The fixed side metal mold 5 and the movable side metal mold 6 are clamped by bringing both platens 1 and 2 close to each other. In the clamped status, a molding material is injected into a molding cavity between the both metal molds and an optical element is produced. A taper recessed section 11a and a taper protruding section 21a, provided on the fixed side metal mold 5 and the movable side metal mold 6 respectively, fit each other. The movable side metal molds 6 provides a friction mechanism section 23 which permits the metal mold to shift within a plane perpendicular to the clamping direction with respect to the movable platen 2.

Abstract: A mold assembly that is adapted to clamp fixed mold and movable mold together while making temperature adjustment and inject a molding material into a molding cavity provided therebetween, thereby producing an optical part. The mold assembly is one including fixed platen supporting fixed mold, provided on a part of its mold-side surface with locating hole and including ring of configuration with external and internal surfaces, fitted at its external surface in the locating hole, wherein the fixed mold is provided with a locating projection protruding toward the fixed platen, fitted in the internal surface of the locating hole, and wherein the ring consists of a material whose linear expansion coefficient is smaller than those of the material of the fixed platen and the material of the locating projection.

Abstract: An apparatus for molding optical components of a small size and high precision is provided with good transferability and a reduced production cycle. This apparatus includes a plurality of runners arranged in a pattern allowing multi-cavity molding for molding plastic lenses each having an outer diameter of 2 mm to 12 mm and surface roughness Ra of 20 nm or less. The total projected area of the runners is determined within a range of 1 cm2 to 12 cm2. The runners are arranged to extend around a sprue in directions perpendicular to an outer surface of the base molds. The pattern of the runners extending from the junction with the sprue to each shape transfer section is configured in two intersecting directions. A cavity is of a rectangular outer shape when seen from a pressure contact surface side.

Abstract: An injection molding comprises: a fixed mold; a movable mold which is capable of contacting to and separating from the fixed mold; and an injection unit which supplies molten resin to a space formed between the fixed mold and the movable mold when being pressed to a non-molding face of the fixed mold. The injection unit comprises: a nozzle portion which injects molten resin to the space formed between the molds; an injecting portion which applies molten resin pressure toward the space formed between the fixed mold and the movable mold though the nozzle portion; a heater and a temperature sensor provided on the nozzle portion; and a heater and a temperature sensor provided on the injecting portion, and detection accuracy of the sensor of the nozzle portion is higher than that of the injecting potion. There is thus provided an injection molding machine capable of manufacturing optics with high accuracy without considerable cost-up by realizing stable and highly accurate injection.

Abstract: A resin molding apparatus wherein a movable platen for supporting a movable mold is connected to a fixed platen for supporting a fixed mold by tie bars. The movable platen has bush bearings, and the movable platen is movable along the tie bars via the bush bearings. A low friction surface treatment is applied to at least either the outer circumferences of the tie bars or the inner circumferences of the bush bearings.

Abstract: An apparatus for molding optical components of a small size and high precision is provided with good transferability and a reduced production cycle. This apparatus includes a plurality of runners arranged in a pattern allowing multi-cavity molding for molding plastic lenses each having an outer diameter of 2 mm to 12 mm and surface roughness Ra of 20 nm or less. The projected area of the entire runner is determined within a range of 1 cm2 to 12 cm2. The runners are arranged to extend around a sprue in directions perpendicular to an outer surface of the base molds. The pattern of the runners extending from the junction with the sprue to each shape transfer section is configured in two intersecting directions. A cavity is of a rectangular outer shape when seen from a pressure contact surface side.

Abstract: A purpose is to provide an optical component molding apparatus for producing a small-size and high-precision optical component and achieving good transferability and stability of a molded product. A multi-cavity molding machine 100 has a gate 51, a runner 52, and a sprue 53 each having the shape determined to meet conditions (1) to (5): (1) “Miminum gate thickness”/“Maximum runner thickness” is in a range of more than 0.2 to less than 1.0; (2) “Gate length”/“Maximum runner thickness” is in a range of more than 0.4 to less than 4.0; (3) “Outlet diameter of sprue” is in a range of more than 1.0 mm to less than 5.5 mm; (4) “Sprue length” is in a range of more than 10 mm to less than 40 mm; and (5) “Outlet diameter of sprue”/“Inlet diameter of sprue” is in a range of more than 1 to less than 8.

Abstract: A molding machine includes a fixed mold and a movable mold. The molding machine is a so-called micro-molding machine which provides less than 1.5 KN of the mold clamping force for clamping the fixed mold and the movable mold. A positional shift length between both molds is preset at ±20 ?m or less. Further, cavities are inserted in base molds of both molds respectively. Furthermore, cores are inserted in the cavities. The position of each cavity is adjustable with respect to each associated base mold. The position of each core is also adjustable with respect to each associated cavity. Moreover, the molding machine can simultaneously mold a plurality of optical components.

Abstract: An injection mold and an injection molding apparatus having a movable mold and a fixed mold. Each of the movable/fixed molds has bases, and a runner, a gate and a cavity are formed. The gate is composed of recesses made in mutually opposite end surfaces of sleeve-like heat insulators provided for the bases. Thereby, the gate is heat-insulated, and resin in the gate is prevented from cooling down during a pressure retention step. Thus, the resin keeps fluidity longer.

Abstract: An injection mold composed of a movable mold and a fixed mold. The movable mold has bases, a heat insulating layer and a surface processed layer, and the fixed mold has a base. A heat insulator is provided on the inner circumferential surface of the base of the movable mold at a part forming a wall of a cavity. The heat insulating layer is in the rear of the surface processed layer, and therefore, the transfer accuracy of a fine configuration of the surface processed layer is improved. Additionally, since the heat insulator is provided adjacent to the fine configuration, heat radiation from resin is inhibited, and the transfer accuracy of the fine configuration is further improved.