Abstract: An embodiment of the invention is a method of generating a final exposure setting, including, (a) selecting one of a number of predetermined exposure settings as a current exposure setting for a solid state camera having a camera imager, (b) generating a captured scene by the camera imager using the current exposure setting, (c) selecting according to an automated search methodology another one of the exposure settings to be the current setting in response to the captured scene being underexposed or overexposed, and, (d) repeating (b) and (c) until the captured scene is neither underexposed or overexposed.

Abstract: An embodiment of the invention is a method of generating a final exposure setting, including, (a) selecting one of a number of predetermined exposure settings as a current exposure setting for a solid state camera having a camera imager, (b) generating a captured scene by the camera imager using the current exposure setting, (c) selecting according to an automated search methodology another one of the exposure settings to be the current setting in response to the captured scene being underexposed or overexposed, and, (d) repeating (b) and (c) until the captured scene is neither underexposed or overexposed.

Abstract: An integrated circuit includes a holographic recording material substantially filling a cavity in a semiconductor layer. During operation of the integrated circuit, a holographic pattern in the holographic recording is reconstructed and used to diffract an optical signal propagating in a plane of an optical waveguide, which is defined in the semiconductor layer out of the plane through the cavity. In this way, the holographic recording material may be used to couple the optical signal to an optical fiber or another integrated circuit.

Abstract: In an MCM, an optical signal is conveyed by an optical waveguide disposed on a surface of a first substrate to a first optical coupler. This first optical coupler redirects the optical signal out of the plane of the optical waveguide. Then, an optical interposer guides the optical signal between the first optical coupler and a second optical coupler on a surface of a second substrate, thereby reducing spatial expansion of the optical signal between the optical couplers. Moreover, the second optical coupler redirects the optical signal into a plane of an optical waveguide disposed on a surface of the second substrate, which then conveys the optical signal.

Abstract: In an MCM, an optical signal is conveyed by an optical waveguide disposed on a surface of a first substrate to an optical coupler having a vertical facet. This optical coupler has an optical mode that is different than the optical mode of the optical waveguide. For example, the spatial extent of the optical mode associated with the optical coupler may be larger, thereby reducing optical losses and sensitivity to alignment errors. Then, the optical signal is directly coupled from the vertical facet to a facing vertical facet of an identical optical coupler on another substrate, and the optical signal is conveyed in another optical waveguide disposed on the other substrate.

Abstract: A chip assembly configuration includes an substrate with an integrated circuit on one side and a conversion mechanism on the other side. The integrated circuit and the conversion mechanism are electrically coupled by a short electrical transmission line through the substrate. Moreover, the conversion mechanism converts signals between an electrical and an optical domain, thereby allowing high-speed communication between the integrated circuit and other components and devices using optical communication (for example, in an optical fiber or an optical waveguide).

Abstract: In an MCM, an optical signal is conveyed by an optical waveguide disposed on a surface of a first substrate to a first optical coupler. This first optical coupler redirects the optical signal out of the plane of the optical waveguide. Then, an optical interposer guides the optical signal between the first optical coupler and a second optical coupler on a surface of a second substrate, thereby reducing spatial expansion of the optical signal between the optical couplers. Moreover, the second optical coupler redirects the optical signal into a plane of an optical waveguide disposed on a surface of the second substrate, which then conveys the optical signal.

Abstract: In an MCM, an optical signal is conveyed by an optical waveguide disposed on a surface of a first substrate to an optical coupler having a vertical facet. This optical coupler has an optical mode that is different than the optical mode of the optical waveguide. For example, the spatial extent of the optical mode associated with the optical coupler may be larger, thereby reducing optical losses and sensitivity to alignment errors. Then, the optical signal is directly coupled from the vertical facet to a facing vertical facet of an identical optical coupler on another substrate, and the optical signal is conveyed in another optical waveguide disposed on the other substrate.

Abstract: An optical de-multiplexer (de-MUX) that includes an optical device that images and diffracts an optical signal using a reflective geometry is described, where a free spectral range (FSR) of the optical device associated with a given diffraction order abuts FSRs associated with adjacent diffraction orders. Moreover, the channel spacings within diffraction orders and between adjacent diffraction orders are equal to the predefined channel spacing associated with the optical signal. As a consequence, the optical device has a comb-filter output spectrum, which reduces a tuning energy of the optical device by eliminating spectral gaps between diffraction orders of the optical device.

Abstract: A chip package includes a processor, an interposer chip and a voltage regulator module (VRM). The interposer chip is electrically coupled to the processor by first electrical connectors proximate to a surface of the interposer chip. Moreover, the interposer chip includes second electrical connectors proximate to another surface of the interposer chip, which are electrically coupled to the first electrical connectors by through-substrate vias (TSVs) in the interposer chip. Note that the second electrical connectors can electrically couple the interposer chip to a circuit board. Furthermore, the VRM is electrically coupled to the processor by the interposer chip, and is proximate to the processor in the chip package, thereby reducing voltage droop. For example, the VRM may be electrically coupled to the surface of the interposer chip, and may be adjacent to the processor. Alternatively, the VRM may be electrically coupled to the other surface of the interposer chip.

Abstract: A multi-chip module (MCM) is described. This MCM includes multiple sites, where a given site in the multiple sites includes multiple chips with proximity connectors that communicate information through proximity communication within the MCM via multiple components associated with the given site. Note that the MCM includes global redundancy and local redundancy at the given site. In particular, the global redundancy involves providing one or more redundant sites in the multiple sites. Furthermore, the local redundancy involves providing one or more redundant chips in the multiple chips and one or more redundant components in the multiple components.

Abstract: An embodiment of the invention is a method of generating a final exposure setting, including, (a) selecting one of a number of predetermined exposure settings as a current exposure setting for a solid state camera having a camera imager, (b) generating a captured scene by the camera imager using the current exposure setting, (c) selecting according to an automated search methodology another one of the exposure settings to be the current setting in response to the captured scene being underexposed or overexposed, and, (d) repeating (b) and (c) until the captured scene is neither underexposed or overexposed.

Abstract: An embodiment of the invention is a method of generating a final exposure setting, including, (a) selecting one of a number of predetermined exposure settings as a current exposure setting for a solid state camera having a camera imager, (b) generating a captured scene by the camera imager using the current exposure setting, (c) selecting according to an automated search methodology another one of the exposure settings to be the current setting in response to the captured scene being underexposed or overexposed, and, (d) repeating (b) and (c) until the captured scene is neither underexposed or overexposed.

Abstract: A multi-chip module (MCM) is described. This MCM includes multiple sites, where a given site in the multiple sites includes multiple chips with proximity connectors that communicate information through proximity communication within the MCM via multiple components associated with the given site. Note that the MCM includes global redundancy and local redundancy at the given site. In particular, the global redundancy involves providing one or more redundant sites in the multiple sites. Furthermore, the local redundancy involves providing one or more redundant chips in the multiple chips and one or more redundant components in the multiple components.

Abstract: An embodiment of the invention is a method of generating a final exposure setting, including, (a) selecting one of a number of predetermined exposure settings as a current exposure setting for a solid state camera having a camera imager, (b) generating a captured scene by the camera imager using the current exposure setting, (c) selecting according to an automated search methodology another one of the exposure settings to be the current setting in response to the captured scene being underexposed or overexposed, and, (d) repeating (b) and (c) until the captured scene is neither underexposed or overexposed.

Abstract: An embodiment of the invention is a method of generating a final exposure setting, including, (a) selecting one of a number of predetermined exposure settings as a current exposure setting for a solid state camera having a camera imager, (b) generating a captured scene by the camera imager using the current exposure setting, (c) selecting according to an automated search methodology another one of the exposure settings to be the current setting in response to the captured scene being underexposed or overexposed, and, (d) repeating (b) and (c) until the captured scene is neither underexposed or overexposed.

Abstract: A device for forming an optical connection between an optoelectronic device and an optical fiber and for forming an electrical connection between the optoelectronic device and a substrate, a system including the device and materials, and methods of forming the device and system are disclosed. The device for forming an optical connection includes a—light transmission medium and electrical connectors, which are at least partially encapsulated. In addition, the device includes guide grooves configured to receive guide pins from a fiber ribbon connector, such that when the fiber ribbon connector is attached to the device, fibers of the ribbon align with the optoelectronic device via the light transmission medium.

Abstract: An embodiment of the invention is a method of generating a final exposure setting, including, (a) selecting one of a number of predetermined exposure settings as a current exposure setting for a solid state camera having a camera imager, (b) generating a captured scene by the camera imager using the current exposure setting, (c) selecting according to an automated search methodology another one of the exposure settings to be the current setting in response to the captured scene being underexposed or overexposed, and, (d) repeating (b) and (c) until the captured scene is neither underexposed or overexposed.

Abstract: An embodiment of the invention is a method of generating a final exposure setting, including, (a) selecting one of a number of predetermined exposure settings as a current exposure setting for a solid state camera having a camera imager, (b) generating a captured scene by the camera imager using the current exposure setting, (c) selecting according to an automated search methodology another one of the exposure settings to be the current setting in response to the captured scene being underexposed or overexposed, and, (d) repeating (b) and (c) until the captured scene is neither underexposed or overexposed.

Abstract: A method to reduce the effect of noise on a pixel sensor element includes accumulating charge during an image capture operation (the accumulated charge representing a combination of noise and image), and discharging the accumulated charge for a predetermined time to generate a pixel sensor signal. The act of discharging may be passive or active.