Patents by Inventor Kannan Raj

Kannan Raj has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8548288
    Abstract: In an MCM, an optical signal is conveyed by an optical waveguide disposed on a surface of a first substrate to a first optical coupler. This first optical coupler redirects the optical signal out of the plane of the optical waveguide. Then, an optical interposer guides the optical signal between the first optical coupler and a second optical coupler on a surface of a second substrate, thereby reducing spatial expansion of the optical signal between the optical couplers. Moreover, the second optical coupler redirects the optical signal into a plane of an optical waveguide disposed on a surface of the second substrate, which then conveys the optical signal.
    Type: Grant
    Filed: December 20, 2011
    Date of Patent: October 1, 2013
    Assignee: Oracle International Corporation
    Inventors: Kannan Raj, John E. Cunningham, Hiren D. Thacker
  • Publication number: 20130230272
    Abstract: A chip assembly configuration includes an substrate with an integrated circuit on one side and a conversion mechanism on the other side. The integrated circuit and the conversion mechanism are electrically coupled by a short electrical transmission line through the substrate. Moreover, the conversion mechanism converts signals between an electrical and an optical domain, thereby allowing high-speed communication between the integrated circuit and other components and devices using optical communication (for example, in an optical fiber or an optical waveguide).
    Type: Application
    Filed: March 1, 2012
    Publication date: September 5, 2013
    Applicant: ORACLE INTERNATIONAL CORPORATION
    Inventors: Kannan Raj, Dawei Huang, Nicholas E. Aneshansley, Theresa Sze, David K. McElfresh
  • Publication number: 20130156366
    Abstract: In an MCM, an optical signal is conveyed by an optical waveguide disposed on a surface of a first substrate to a first optical coupler. This first optical coupler redirects the optical signal out of the plane of the optical waveguide. Then, an optical interposer guides the optical signal between the first optical coupler and a second optical coupler on a surface of a second substrate, thereby reducing spatial expansion of the optical signal between the optical couplers. Moreover, the second optical coupler redirects the optical signal into a plane of an optical waveguide disposed on a surface of the second substrate, which then conveys the optical signal.
    Type: Application
    Filed: December 20, 2011
    Publication date: June 20, 2013
    Applicant: ORACLE INTERNATIONAL CORPORATION
    Inventors: Kannan Raj, John E. Cunningham, Hiren D. Thacker
  • Publication number: 20130121635
    Abstract: In an MCM, an optical signal is conveyed by an optical waveguide disposed on a surface of a first substrate to an optical coupler having a vertical facet. This optical coupler has an optical mode that is different than the optical mode of the optical waveguide. For example, the spatial extent of the optical mode associated with the optical coupler may be larger, thereby reducing optical losses and sensitivity to alignment errors. Then, the optical signal is directly coupled from the vertical facet to a facing vertical facet of an identical optical coupler on another substrate, and the optical signal is conveyed in another optical waveguide disposed on the other substrate.
    Type: Application
    Filed: November 10, 2011
    Publication date: May 16, 2013
    Applicant: ORACLE INTERNATIONAL CORPORATION
    Inventors: Hiren D. Thacker, Xuezhe Zheng, Ivan Shubin, Kannan Raj, John E. Cunningham, Ashok V. Krishnamoorthy
  • Publication number: 20130039661
    Abstract: An optical de-multiplexer (de-MUX) that includes an optical device that images and diffracts an optical signal using a reflective geometry is described, where a free spectral range (FSR) of the optical device associated with a given diffraction order abuts FSRs associated with adjacent diffraction orders. Moreover, the channel spacings within diffraction orders and between adjacent diffraction orders are equal to the predefined channel spacing associated with the optical signal. As a consequence, the optical device has a comb-filter output spectrum, which reduces a tuning energy of the optical device by eliminating spectral gaps between diffraction orders of the optical device.
    Type: Application
    Filed: August 9, 2011
    Publication date: February 14, 2013
    Applicant: ORACLE INTERNATIONAL CORPORATION
    Inventors: Ying Luo, Xuezhe Zheng, Guoliang Li, Kannan Raj, Ashok V. Krishnamoorthy
  • Publication number: 20130003310
    Abstract: A chip package includes a processor, an interposer chip and a voltage regulator module (VRM). The interposer chip is electrically coupled to the processor by first electrical connectors proximate to a surface of the interposer chip. Moreover, the interposer chip includes second electrical connectors proximate to another surface of the interposer chip, which are electrically coupled to the first electrical connectors by through-substrate vias (TSVs) in the interposer chip. Note that the second electrical connectors can electrically couple the interposer chip to a circuit board. Furthermore, the VRM is electrically coupled to the processor by the interposer chip, and is proximate to the processor in the chip package, thereby reducing voltage droop. For example, the VRM may be electrically coupled to the surface of the interposer chip, and may be adjacent to the processor. Alternatively, the VRM may be electrically coupled to the other surface of the interposer chip.
    Type: Application
    Filed: June 28, 2011
    Publication date: January 3, 2013
    Applicant: ORACLE INTERNATIONAL CORPORATION
    Inventors: Kannan Raj, Ivan Shubin, John E. Cunningham
  • Patent number: 8207752
    Abstract: A multi-chip module (MCM) is described. This MCM includes multiple sites, where a given site in the multiple sites includes multiple chips with proximity connectors that communicate information through proximity communication within the MCM via multiple components associated with the given site. Note that the MCM includes global redundancy and local redundancy at the given site. In particular, the global redundancy involves providing one or more redundant sites in the multiple sites. Furthermore, the local redundancy involves providing one or more redundant chips in the multiple chips and one or more redundant components in the multiple components.
    Type: Grant
    Filed: January 11, 2010
    Date of Patent: June 26, 2012
    Inventors: Kannan Raj, Xuezhe Zheng, Ashok V. Krishnamoorthy, Ronald Ho, Michael O. McCracken, David K. McElfresh, John E. Cunningham
  • Publication number: 20120013762
    Abstract: An embodiment of the invention is a method of generating a final exposure setting, including, (a) selecting one of a number of predetermined exposure settings as a current exposure setting for a solid state camera having a camera imager, (b) generating a captured scene by the camera imager using the current exposure setting, (c) selecting according to an automated search methodology another one of the exposure settings to be the current setting in response to the captured scene being underexposed or overexposed, and, (d) repeating (b) and (c) until the captured scene is neither underexposed or overexposed.
    Type: Application
    Filed: September 27, 2011
    Publication date: January 19, 2012
    Applicant: Intel Corporation
    Inventors: Cynthia S. Bell, Edward P. Tomaszewski, Amy E. Hansen, Kannan Raj
  • Patent number: 8031262
    Abstract: An embodiment of the invention is a method of generating a final exposure setting, including, (a) selecting one of a number of predetermined exposure settings as a current exposure setting for a solid state camera having a camera imager, (b) generating a captured scene by the camera imager using the current exposure setting, (c) selecting according to an automated search methodology another one of the exposure settings to be the current setting in response to the captured scene being underexposed or overexposed, and, (d) repeating (b) and (c) until the captured scene is neither underexposed or overexposed.
    Type: Grant
    Filed: August 5, 2010
    Date of Patent: October 4, 2011
    Assignee: Intel Corporation
    Inventors: Cynthia S. Bell, Edward P. Tomaszewski, Amy E. Hansen, Kannan Raj
  • Publication number: 20110169522
    Abstract: A multi-chip module (MCM) is described. This MCM includes multiple sites, where a given site in the multiple sites includes multiple chips with proximity connectors that communicate information through proximity communication within the MCM via multiple components associated with the given site. Note that the MCM includes global redundancy and local redundancy at the given site. In particular, the global redundancy involves providing one or more redundant sites in the multiple sites. Furthermore, the local redundancy involves providing one or more redundant chips in the multiple chips and one or more redundant components in the multiple components.
    Type: Application
    Filed: January 11, 2010
    Publication date: July 14, 2011
    Applicant: SUN MICROSYSTEMS, INC.
    Inventors: Kannan Raj, Xuezhe Zheng, Ashok V. Krishnamoorthy, Ronald Ho, Michael O. McCracken, David K. McElfresh, John E. Cunningham
  • Publication number: 20100315531
    Abstract: An embodiment of the invention is a method of generating a final exposure setting, including, (a) selecting one of a number of predetermined exposure settings as a current exposure setting for a solid state camera having a camera imager, (b) generating a captured scene by the camera imager using the current exposure setting, (c) selecting according to an automated search methodology another one of the exposure settings to be the current setting in response to the captured scene being underexposed or overexposed, and, (d) repeating (b) and (c) until the captured scene is neither underexposed or overexposed.
    Type: Application
    Filed: August 5, 2010
    Publication date: December 16, 2010
    Applicant: Intel Corporation
    Inventors: Cynthia S. Bell, Edward P. Tomaszewski, Amy E. Hansen, Kannan Raj
  • Patent number: 7817206
    Abstract: An embodiment of the invention is a method of generating a final exposure setting, including, (a) selecting one of a number of predetermined exposure settings as a current exposure setting for a solid state camera having a camera imager, (b) generating a captured scene by the camera imager using the current exposure setting, (c) selecting according to an automated search methodology another one of the exposure settings to be the current setting in response to the captured scene being underexposed or overexposed, and, (d) repeating (b) and (c) until the captured scene is neither underexposed or overexposed.
    Type: Grant
    Filed: June 25, 2008
    Date of Patent: October 19, 2010
    Assignee: Intel Corporation
    Inventors: Cynthia S. Bell, Edward P. Tomaszewski, Amy E. Hansen, Kannan Raj
  • Patent number: 7476037
    Abstract: A device for forming an optical connection between an optoelectronic device and an optical fiber and for forming an electrical connection between the optoelectronic device and a substrate, a system including the device and materials, and methods of forming the device and system are disclosed. The device for forming an optical connection includes a—light transmission medium and electrical connectors, which are at least partially encapsulated. In addition, the device includes guide grooves configured to receive guide pins from a fiber ribbon connector, such that when the fiber ribbon connector is attached to the device, fibers of the ribbon align with the optoelectronic device via the light transmission medium.
    Type: Grant
    Filed: August 1, 2006
    Date of Patent: January 13, 2009
    Assignee: Zarlink Semiconductor, Inc.
    Inventors: Suresh Golwalkar, Noah Davis, John Burns, Kannan Raj, Phil McClay, Wuchun Chou, Jonathan McFarland
  • Publication number: 20080260373
    Abstract: An embodiment of the invention is a method of generating a final exposure setting, including, (a) selecting one of a number of predetermined exposure settings as a current exposure setting for a solid state camera having a camera imager, (b) generating a captured scene by the camera imager using the current exposure setting, (c) selecting according to an automated search methodology another one of the exposure settings to be the current setting in response to the captured scene being underexposed or overexposed, and, (d) repeating (b) and (c) until the captured scene is neither underexposed or overexposed.
    Type: Application
    Filed: June 25, 2008
    Publication date: October 23, 2008
    Inventors: Cynthia S. Bell, Edward P. Tomaszewski, Amy E. Hansen, Kannan Raj
  • Patent number: 7403222
    Abstract: An embodiment of the invention is a method of generating a final exposure setting, including, (a) selecting one of a number of predetermined exposure settings as a current exposure setting for a solid state camera having a camera imager, (b) generating a captured scene by the camera imager using the current exposure setting, (c) selecting according to an automated search methodology another one of the exposure settings to be the current setting in response to the captured scene being underexposed or overexposed, and, (d) repeating (b) and (c) until the captured scene is neither underexposed or overexposed.
    Type: Grant
    Filed: November 25, 2002
    Date of Patent: July 22, 2008
    Assignee: Intel Corporation
    Inventors: Cynthia S. Bell, Edward P. Tomaszewski, Amy E. Hansen, Kannan Raj
  • Patent number: 7397506
    Abstract: A method to reduce the effect of noise on a pixel sensor element includes accumulating charge during an image capture operation (the accumulated charge representing a combination of noise and image), and discharging the accumulated charge for a predetermined time to generate a pixel sensor signal. The act of discharging may be passive or active.
    Type: Grant
    Filed: May 27, 2004
    Date of Patent: July 8, 2008
    Assignee: Intel Corporation
    Inventors: Cynthia Bell, Kannan Raj
  • Patent number: 7340120
    Abstract: A method of fabricating an interconnect includes forming one or more holes in an anisotropic conductive film on a carrier substrate, filling at least one of the one or more holes with a material capable of transmitting an optical signal, and laminating the anisotropic conductive film on a packaging substrate. An electronic package includes a first substrate, a second substrate, and an interconnect located between the first substrate and the second substrate. The interconnect includes a conductive film for electrically coupling a first terminal formed on the first substrate to a second terminal formed on the second substrate, and one or more optically transmissive units embedded in the conductive film, wherein at least one of the one or more optically transmissive units provides an optical signal path between an optical element on the first substrate and an optical element on the second substrate.
    Type: Grant
    Filed: December 22, 2004
    Date of Patent: March 4, 2008
    Assignee: Intel Corporation
    Inventors: Jonathan McFarland, Kannan Raj
  • Publication number: 20070053637
    Abstract: A device for forming an optical connection between an optoelectronic device and an optical fiber and for forming an electrical connection between the optoelectronic device and a substrate, a system including the device and materials, and methods of forming the device and system are disclosed. The device for forming an optical connection includes a—light transmission medium and electrical connectors, which are at least partially encapsulated. In addition, the device includes guide grooves configured to receive guide pins from a fiber ribbon connector, such that when the fiber ribbon connector is attached to the device, fibers of the ribbon align with the optoclectronic device via the light transmission medium.
    Type: Application
    Filed: August 1, 2006
    Publication date: March 8, 2007
    Inventors: Suresh Golwalkar, Noah Davis, John Burns, Kannan Raj, Phil McClay, Wuchun Chou, Jonathan McFarland
  • Patent number: 7101091
    Abstract: A device for forming an optical connection between an optoelectronic device and an optical fiber and for forming an electrical connection between the optoelectronic device and a substrate, a system including the device and materials, and methods of forming the device and system are disclosed. The device for forming an optical connection includes a—light transmission medium and electrical connectors, which are at least partially encapsulated. In addition, the device includes guide grooves configured to receive guide pins from a fiber ribbon connector, such that when the fiber ribbon connector is attached to the device, fibers of the ribbon align with the optoelectronic device via the light transmission medium.
    Type: Grant
    Filed: July 24, 2001
    Date of Patent: September 5, 2006
    Assignee: Zarlink Semiconductor, Inc.
    Inventors: Suresh Golwalkar, Noah Davis, John Burns, Kannan Raj, Phil McClay, Wuchun Chou, Jonathan McFarland
  • Patent number: 7095164
    Abstract: Several embodiments in accordance with the invention are disclosed. In one particular embodiment, a display screen for a display is discussed.
    Type: Grant
    Filed: September 15, 2000
    Date of Patent: August 22, 2006
    Assignee: Intel Corporation
    Inventors: Lawrence A. Booth, Jr., Kannan Raj