Abstract: A method of fabricating an interconnect includes forming one or more holes in an anisotropic conductive film on a carrier substrate, filling at least one of the one or more holes with a material capable of transmitting an optical signal, and laminating the anisotropic conductive film on a packaging substrate. An electronic package includes a first substrate, a second substrate, and an interconnect located between the first substrate and the second substrate. The interconnect includes a conductive film for electrically coupling a first terminal formed on the first substrate to a second terminal formed on the second substrate, and one or more optically transmissive units embedded in the conductive film, wherein at least one of the one or more optically transmissive units provides an optical signal path between an optical element on the first substrate and an optical element on the second substrate.

Abstract: A device for forming an optical connection between an optoelectronic device and an optical fiber and for forming an electrical connection between the optoelectronic device and a substrate, a system including the device and materials, and methods of forming the device and system are disclosed. The device for forming an optical connection includes a—light transmission medium and electrical connectors, which are at least partially encapsulated. In addition, the device includes guide grooves configured to receive guide pins from a fiber ribbon connector, such that when the fiber ribbon connector is attached to the device, fibers of the ribbon align with the optoclectronic device via the light transmission medium.

Abstract: A device for forming an optical connection between an optoelectronic device and an optical fiber and for forming an electrical connection between the optoelectronic device and a substrate, a system including the device and materials, and methods of forming the device and system are disclosed. The device for forming an optical connection includes a—light transmission medium and electrical connectors, which are at least partially encapsulated. In addition, the device includes guide grooves configured to receive guide pins from a fiber ribbon connector, such that when the fiber ribbon connector is attached to the device, fibers of the ribbon align with the optoelectronic device via the light transmission medium.

Abstract: Several embodiments in accordance with the invention are disclosed. In one particular embodiment, a display screen for a display is discussed.

Abstract: An apparatus for determining a type of an illuminant including a spectrum diffraction unit and a sensor coupled to the spectrum diffraction unit. An illuminant discrimination unit is coupled to the sensor and configured to receive a set of signals representative of a set of spectral components in the illuminant and to determine the type.

Abstract: A method of fabricating an interconnect includes forming one or more holes in an anisotropic conductive film on a carrier substrate, filling at least one of the one or more holes with a material capable of transmitting an optical signal, and laminating the anisotropic conductive film on a packaging substrate. An electronic package includes a first substrate, a second substrate, and an interconnect located between the first substrate and the second substrate. The interconnect includes a conductive film for electrically coupling a first terminal formed on the first substrate to a second terminal formed on the second substrate, and one or more optically transmissive units embedded in the conductive film, wherein at least one of the one or more optically transmissive units provides an optical signal path between an optical element on the first substrate and an optical element on the second substrate.

Abstract: An interconnect comprising an anisotropic conductive film and an optically transmissive unit embedded in the anisotropic conductive film. The optically transmissive unit provides an optically transmissive path through the anisotropic conductive film. In an alternative embodiment, an electronic package comprises a first substrate, a second substrate, and an interconnect located between the first substrate and the second substrate. The interconnect comprises an anisotropic conductive film for electrically coupling a first conductive element formed on the first substrate to a second conductive element formed on the second substrate and one or more optically transmissive units embedded in the anisotropic conductive film. At least one of the one or more optically transmissive units couples an optical signal path on the first substrate to an optical receiver on the second substrate.

Abstract: A method to reduce the effect of noise on a pixel sensor element includes accumulating charge during an image capture operation (the accumulated charge representing a combination of noise and image), and discharging the accumulated charge for a predetermined time to generate a pixel sensor signal. The act of discharging may be passive or active.

Abstract: In accordance with one embodiment of the invention, a method is provided for integrating at least a portion of a watermark into at least a portion of a compressed image. The method of this embodiment includes encoding at least a portion of the watermark and compressing at least a portion of the image. The encoded watermark, or portion thereof, and the compressed image, or portion thereof, are combined. Of course, many other embodiments in accordance with the invention are included within the scope of the present invention.

Abstract: A system for coupling optoelectronic devices, associated electrical components, and optical fibers is described. The system includes a substrate to which optoelectronic devices and at least some of the associated electronic components are formed on or formed using the substrate material. The substrate is further configured to receive and attach to one or more optical fibers. The system can be used to form transceivers for multiplexing and/or demultiplexing electronic information.

Abstract: A method includes storing an analog indication of a terminal voltage of a pixel cell. A second indication of an incremental update to the terminal voltage is received, and the analog indication is used to modify the terminal voltage to reflect the incremental update. The pixel cell may form part of a display panel.

Abstract: An improved optical interconnect structure, system including the structure, and method of forming the structure and system are disclosed. The optical interconnect structure includes a waveguide and a reflective structure. Either the waveguide, the reflective structure, or both include a curved surface to facilitate focusing of light transmitted between the waveguide and an optoelectronic device.

Abstract: An array of photosensitive devices may be formed with improved fill factors by including a diffractive microlens which may have a stepped configuration. The microlens may be formed of a sol-gel material having a photoinitiator, or other materials that may be defined with low temperature techniques commonly used in connection with photoresist. In particular, a gray scale mask may be used to define a plurality of steps in the resulting microlens which have different diffractive characteristics.

Abstract: In accordance with one embodiment of the invention, a method of integrating a watermark, or portion thereof, into an image, or portion thereof, includes the following. The watermark, or portion thereof, is blended into the image, or portion thereof, so as to appear as noise.

Abstract: A method includes storing an analog indication of a terminal voltage of a pixel cell. A second indication of an incremental update to the terminal voltage is received, and the analog indication is used to modify the terminal voltage to reflect the incremental update. The pixel cell may form part of a display panel.

Abstract: An integrated circuit may have a spatial light modulator formed on one side of a semiconductor support and a microprocessor formed on the opposite side. The microprocessor and the spatial light modulator may communicate with one another through electrical connections which extend completely through the semiconductor support. The microprocessor may be contacted using bump packaging techniques.

Abstract: In accordance with one embodiment of the invention, a method of integrating at least a portion of a watermark into at least a portion of a compressed image includes the following. The at least a portion of the watermark is encoded. THe at least a portion the image is compressed. The at least a portion of the-encoded watermark and the at least a portion of the compressed image are combined. Of course, many other embodiments in accordance with the invention are included within the scope of the present invention.

Abstract: In accordance with one embodiment of the invention, a method is provided for integrating at least a portion of a watermark into at least a portion of a compressed image. The method of this embodiment includes encoding at least a portion of the watermark and compressing at least a portion of the image. The encoded watermark, or portion thereof, and the compressed image, or portion thereof, are combined. Of course, many other embodiments in accordance with the invention are included within the scope of the present invention.

Abstract: A fiber optic connector system may include a elliptical reflector arranged to couple light from one optical fiber to another. The elliptical reflector has two foci, one of which may correspond to an end of a first optical fiber and the other of which may correspond to an end of another optical fiber. Thus, light emitted from one fiber may be coupled to another fiber.

Abstract: An embodiment of the invention is a method of generating a final exposure setting, including, (a) selecting one of a number of predetermined exposure settings as a current exposure setting for a solid state camera having a camera imager, (b) generating a captured scene by the camera imager using the current exposure setting, (c) selecting according to an automated search methodology another one of the exposure settings to be the current setting in response to the captured scene being underexposed or overexposed, and, (d) repeating (b) and (c) until the captured scene is neither underexposed or overexposed.