Patents by Inventor Kaori Watanabe
Kaori Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12037180Abstract: A packaging container includes a body part, a lid part integrally engaged with the body part, an inner lid positioned between the body part and the lid part, a stored item containing part opening from an engaged portion of the lid part that is engaged with the body part, and configured to contain a stored item, a chemical agent containing part opening from the engaged portion of the lid part that is engaged with the body part, the chemical agent containing part being formed separately from the stored item containing part, and a ventilation path in which the stored item containing part and the chemical agent containing part are in communication, the ventilation path being formed in an inner space defined by the first member and the second member.Type: GrantFiled: June 5, 2020Date of Patent: July 16, 2024Assignee: GC CorporationInventor: Kaori Watanabe
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Patent number: 11583376Abstract: A dental gypsum slurry includes water and a dental gypsum powder containing hemihydrate gypsum and a polycarboxylic acid salt-based water-reducing agent, wherein a powder-water ratio of the water to the dental gypsum powder is 0.24 to 0.50, and when the water and the dental gypsum powder being mixed are poured up to a height of 50 mm in a cylindrical mold having an inner diameter of 35 mm, which is vertically placed on a flat surface, and then, the cylindrical mold is pulled upward at 10 mm/s at 30 seconds after start of mixing so that a mixture spreads planarly, the diameter of the mixture is 141.4 mm or more.Type: GrantFiled: January 30, 2018Date of Patent: February 21, 2023Assignee: GC CORPORATIONInventors: Daizaburo Mori, Masatoshi Yoshinaga, Kenji Kojima, Kaori Watanabe, Tsukasa Kaneko
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Publication number: 20220227563Abstract: A packaging container includes a body part, a lid part integrally engaged with the body part, an inner lid positioned between the body part and the lid part, a stored item containing part opening from an engaged portion of the lid part that is engaged with the body part, and configured to contain a stored item, a chemical agent containing part opening from the engaged portion of the lid part that is engaged with the body part, the chemical agent containing part being formed separately from the stored item containing part, and a ventilation path in which the stored item containing part and the chemical agent containing part are in communication, the ventilation path being formed in an inner space defined by the first member and the second member.Type: ApplicationFiled: June 5, 2020Publication date: July 21, 2022Inventor: Kaori WATANABE
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Publication number: 20210085433Abstract: A dental gypsum slurry includes water and a dental gypsum powder containing hemihydrate gypsum and a polycarboxylic acid salt-based water-reducing agent, wherein a powder-water ratio of the water to the dental gypsum powder is 0.24 to 0.50, and when the water and the dental gypsum powder being mixed are poured up to a height of 50 mm in a cylindrical mold having an inner diameter of 35 mm, which is vertically placed on a flat surface, and then, the cylindrical mold is pulled upward at 10 mm/s at 30 seconds after start of mixing so that a mixture spreads planarly, the diameter of the mixture is 141.4 mm or more.Type: ApplicationFiled: January 30, 2018Publication date: March 25, 2021Applicant: GC CorporationInventors: Daizaburo Mori, Masatoshi Yoshinaga, Kenji Kojima, Kaori Watanabe, Tsukasa Kaneko
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Patent number: 10821221Abstract: An embodiment of the present invention is an encased syringe in which a prefilled syringe is accommodated in a case. The prefilled syringe includes a cylindrical syringe body filled with a foamable material and a plunger pressed into the syringe body on one end side. The case includes a body accommodating part faulted to be depressed along the shape of the syringe body to accommodate the syringe body and a plunger accommodating part formed to be depressed along the shape of the plunger to accommodate the plunger. The length of the plunger accommodating part is smaller than the length of the plunger in an axial direction of the prefilled syringe.Type: GrantFiled: January 25, 2017Date of Patent: November 3, 2020Assignee: GC CorporationInventors: Makoto Takahashi, Manami Kurakazu, Yuji Fujimaki, Kaori Watanabe
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Publication number: 20200016322Abstract: An embodiment of the present invention is an encased syringe in which a prefilled syringe is accommodated in a case. The prefilled syringe includes a cylindrical syringe body filled with a foamable material and a plunger pressed into the syringe body on one end side. The case includes a body accommodating part faulted to be depressed along the shape of the syringe body to accommodate the syringe body and a plunger accommodating part formed to be depressed along the shape of the plunger to accommodate the plunger. The length of the plunger accommodating part is smaller than the length of the plunger in an axial direction of the prefilled syringe.Type: ApplicationFiled: January 25, 2017Publication date: January 16, 2020Inventors: Makoto TAKAHASHI, Manami KURAKAZU, Yuji FUJIMAKI, Kaori WATANABE
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Publication number: 20190142705Abstract: A method for kneading a dental gypsum powder is provided that includes putting the dental gypsum powder and water in a bottle, the dental gypsum powder containing gypsum hemihydrate and a polycarboxylate-based water reducing agent, contained at 0.05 parts by mass to 0.8 parts by mass with respect to 100 parts by mass of the gypsum hemihydrate, sealing the bottle, and shaking the bottle.Type: ApplicationFiled: April 20, 2017Publication date: May 16, 2019Applicant: GC CorporationInventors: Daizaburo MORI, Masatoshi YOSHINAGA, Kaori WATANABE
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Patent number: 9138933Abstract: A process and apparatus for manufacturing a crystalline resin film or sheet. This manufacturing apparatus includes: an extruder that melts crystalline resin while supplying it; a gear pump that is provided on the downstream side of the extruder; a die which is provided on the downstream side of the gear pump, and which has a slit-shaped aperture; a cooling apparatus which cools film-shaped or sheet-shaped crystalline resin (A) discharged in a melted state from the die to a temperature which is not less than the crystallization temperature but not more than the melting point; and a pair of pinch rolls that press-roll between them the film-shaped or sheet-shaped crystalline resin (B) which has passed through the cooling apparatus (40), wherein the pair of guide rolls are positioned such that the thickness of the film-shaped or sheet-shaped crystalline resin (B) which has passed through the cooling apparatus is between 1.3 and 8.0 times the thickness of the film or sheet (C, D) after it has been press-rolled.Type: GrantFiled: January 22, 2010Date of Patent: September 22, 2015Assignee: SunAllomer Ltd.Inventors: Junichiro Washiyama, Hideharu Kimura, Koji Yamada, Takeshi Nakajima, Akihiro Otsubo, Masamichi Hikosaka, Kiyoka Okada, Kaori Watanabe
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Patent number: 8735523Abstract: One embodiment of the present invention provides polymer crystalline materials containing crystals of the polymer and satisfying the following requirements (I) and (II) or the following requirements (I) and (III): (I) the polymer crystalline materials a crystallinity of 70% or greater; (II) the crystals are 300 nm or less in size; and (III) the crystals have a number density of 40 ?m?3 or greater. This allows an embodiment of the present invention to provide polymer crystalline materials which are excellent in properties such as mechanical strength, heat tolerance, and transparency or, in particular, polymer crystalline materials, based on a general-purpose plastic such as PP, which is excellent in properties such as mechanical strength, heat tolerance, and transparency.Type: GrantFiled: February 27, 2008Date of Patent: May 27, 2014Assignee: Hiroshima UniversityInventors: Masamichi Hikosaka, Kaori Watanabe, Kiyoka Okada
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Patent number: 8728616Abstract: A polymer sheet according to at least one embodiment of the present invention is a polymer sheet whose main component is oriented nanocrystals of a polymer, and which satisfies the following conditions (I), (II), and (III): (I) having a crystallinity of not less than 70%; (II) having a tensile strength at break of not less than 100 MPa and a tensile modulus of not less than 3 GPa; and (III) having an average thickness of not less than 0.15 mm. According to at least one embodiment of the present invention, it is possible to provide a polymer sheet excelling in properties such as mechanical strength, heat tolerance, and transparency, particularly a polymer sheet having excellent properties such as mechanical strength, heat tolerance, and transparency in general-purpose plastics such as polypropylene.Type: GrantFiled: January 21, 2010Date of Patent: May 20, 2014Assignees: Hiroshima University, Sunallomer Ltd.Inventors: Masamichi Hikosaka, Kiyoka Okada, Kaori Watanabe, Junichiro Washiyama, Hideharu Kimura, Koji Yamada, Takeshi Nakajima, Akihiro Otsubo
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Publication number: 20120018917Abstract: A process and apparatus for manufacturing a crystalline resin film or sheet. This manufacturing apparatus includes: an extruder that melts crystalline resin while supplying it; a gear pump that is provided on the downstream side of the extruder; a die which is provided on the downstream side of the gear pump, and which has a slit-shaped aperture; a cooling apparatus which cools film-shaped or sheet-shaped crystalline resin (A) discharged in a melted state from the die to a temperature which is not less than the crystallization temperature but not more than the melting point; and a pair of pinch rolls that press-roll between them the film-shaped or sheet-shaped crystalline resin (B) which has passed through the cooling apparatus (40), wherein the pair of guide rolls are positioned such that the thickness of the film-shaped or sheet-shaped crystalline resin (B) which has passed through the cooling apparatus is between 1.3 and 8.0 times the thickness of the film or sheet (C, D) after it has been press-rolled.Type: ApplicationFiled: January 22, 2010Publication date: January 26, 2012Applicant: SunAllomer Ltd.Inventors: Junichiro Washiyama, Hideharu Kimura, Koji Yamada, Takeshi Nakajima, Akihiro Otsubo, Masamichi Hikosaka, Kiyoka Okada, Kaori Watanabe
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Publication number: 20110300364Abstract: A polymer sheet according to at least one embodiment of the present invention is a polymer sheet whose main component is oriented nanocrystals of a polymer, and which satisfies the following conditions (I), (II), and (III): (I) having a crystallinity of not less than 70%; (II) having a tensile strength at break of not less than 100 MPa and a tensile modulus of not less than 3 GPa; and (III) having an average thickness of not less than 0.15 mm. According to at least one embodiment of the present invention, it is possible to provide a polymer sheet excelling in properties such as mechanical strength, heat tolerance, and transparency, particularly a polymer sheet having excellent properties such as mechanical strength, heat tolerance, and transparency in general-purpose plastics such as polypropylene.Type: ApplicationFiled: January 21, 2010Publication date: December 8, 2011Applicants: SUNALLOMER LTD., HIROSHIMA UNIVERSITYInventors: Masamichi Hikosaka, Kiyoka Okada, Kaori Watanabe, Junichiro Washiyama, Hideharu Kimura, Koji Yamada, Takeshi Nakajima, Akihiro Otsubo
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Patent number: 7871548Abstract: A method and means for determining a critical elongation strain rate of a polymer melt, which make it possible to subject a polymer melt to elongation to prepare a bulk oriented melt, are established, and a process for producing bulk polymer oriented crystals and polymer oriented crystals are provided. In the critical elongation strain rate determination process or critical elongation strain rate determining method, a polymer melt (3) in a disc shape having a radius x0 and a thickness of ?z0 is held between transparent plates (an upper transparent plate (1) and a lower transparent plate (2)). The polymer melt (3) is cooled to a supercooled state and is press in a thickness direction at a constant rate v by using the transparent plates. The critical point radius x*, at which the polymer melt (3) is turned to an oriented crystal, is measured, and the critical elongation strain rate ? is calculated by equation ?*=ax*3 wherein ?=v/(2?z0x03).Type: GrantFiled: August 31, 2006Date of Patent: January 18, 2011Assignee: National University of Corporation Hiroshima UniversityInventors: Masamichi Hikosaka, Kaori Watanabe
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Publication number: 20100063235Abstract: One embodiment of the present invention provides polymer crystalline materials containing crystals of the polymer and satisfying the following requirements (I) and (II) or the following requirements (I) and (III): (I) the polymer crystalline materials a crystallinity of 70% or greater; (II) the crystals are 300 nm or less in size; and (III) the crystals have a number density of 40 ?m?3 or greater. This allows an embodiment of the present invention to provide polymer crystalline materials which are excellent in properties such as mechanical strength, heat tolerance, and transparency or, in particular, polymer crystalline materials, based on a general-purpose plastic such as PP, which is excellent in properties such as mechanical strength, heat tolerance, and transparency.Type: ApplicationFiled: February 27, 2008Publication date: March 11, 2010Inventors: Masamichi Hikosaka, Kaori Watanabe, Kiyoka Okada
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Publication number: 20090249883Abstract: A method and means for determining a critical elongation strain rate of a polymer melt, which make it possible to subject a polymer melt to elongation to prepare a bulk oriented melt, are established, and a process for producing bulk polymer oriented crystals and polymer oriented crystals are provided. In the critical elongation strain rate determination process or critical elongation strain rate determining method, a polymer melt (3) in a disc shape having a radius x0 and a thickness of ?z0 is held between transparent plates (an upper transparent plate (1) and a lower transparent plate (2)). The polymer melt (3) is cooled to a supercooled state and is press in a thickness direction at a constant rate v by using the transparent plates.Type: ApplicationFiled: August 31, 2006Publication date: October 8, 2009Applicant: NATIONAL UNIVERSITY OF CORP. HIROSHIMA UNIVERSITYInventors: Masamichi Hikosaka, Kaori Watanabe
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Patent number: 7566663Abstract: A method for manufacturing a semiconductor device or a semiconductor wafer using a chucking unit is provided to remove a slurry that adheres to the back surface of the semiconductor wafer. An edge portion of a semiconductor wafer is polished while a back surface of the semiconductor wafer is chucked to a chucking unit of a first polishing unit. The polished semiconductor wafer is then dechucked from the chucking unit of the first polishing unit. Next, a gap is formed above the chucking unit of the second polishing unit, and the semiconductor wafer is disposed therein. Water is discharged from the chucking unit of the second polishing unit to clean the back surface of the semiconductor wafer W. Thereafter, the back surface of the semiconductor wafer is chucked to the chucking unit of the second polishing unit, and the semiconductor wafer is polished.Type: GrantFiled: December 20, 2006Date of Patent: July 28, 2009Assignee: NEC Electronics CorporationInventors: Kaori Watanabe, Hiroyuki Itoh, Takatoshi Hattori
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Patent number: 7442652Abstract: A method for removing contamination on a semiconductor substrate is disclosed. The contamination contains at least one element belonging to one of 3A group, 3B group and 4A group of long-period form of periodic system of elements. The method comprises first and second process steps. The first process is wet processing the semiconductor substrate by first remover liquid that contains one of acid and alkali. The second process is wet processing the semiconductor substrate by second remover liquid that contains oxidizing reagent and one of hydrofluoric acid and salt of hydrofluoric acid.Type: GrantFiled: February 3, 2003Date of Patent: October 28, 2008Assignee: NEC Electronics CorporationInventors: Hidemitsu Aoki, Kaori Watanabe
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Patent number: 7351354Abstract: A removing solution for removing tungsten metal which causes a film formation on a semiconductor substrate or adheres to it, wherein orthoperiodic acid and water are contained.Type: GrantFiled: December 1, 2004Date of Patent: April 1, 2008Assignee: Kanto Kagaku Kabushiki KaishaInventors: Toshikazu Shimizu, Kaori Watanabe, Hidemitsu Aoki
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Patent number: D873131Type: GrantFiled: August 7, 2018Date of Patent: January 21, 2020Assignee: GC CorporationInventor: Kaori Watanabe
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Patent number: D967713Type: GrantFiled: November 14, 2019Date of Patent: October 25, 2022Assignee: GC CorporationInventor: Kaori Watanabe