Patents by Inventor Kaori Watanabe

Kaori Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11583376
    Abstract: A dental gypsum slurry includes water and a dental gypsum powder containing hemihydrate gypsum and a polycarboxylic acid salt-based water-reducing agent, wherein a powder-water ratio of the water to the dental gypsum powder is 0.24 to 0.50, and when the water and the dental gypsum powder being mixed are poured up to a height of 50 mm in a cylindrical mold having an inner diameter of 35 mm, which is vertically placed on a flat surface, and then, the cylindrical mold is pulled upward at 10 mm/s at 30 seconds after start of mixing so that a mixture spreads planarly, the diameter of the mixture is 141.4 mm or more.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: February 21, 2023
    Assignee: GC CORPORATION
    Inventors: Daizaburo Mori, Masatoshi Yoshinaga, Kenji Kojima, Kaori Watanabe, Tsukasa Kaneko
  • Publication number: 20220227563
    Abstract: A packaging container includes a body part, a lid part integrally engaged with the body part, an inner lid positioned between the body part and the lid part, a stored item containing part opening from an engaged portion of the lid part that is engaged with the body part, and configured to contain a stored item, a chemical agent containing part opening from the engaged portion of the lid part that is engaged with the body part, the chemical agent containing part being formed separately from the stored item containing part, and a ventilation path in which the stored item containing part and the chemical agent containing part are in communication, the ventilation path being formed in an inner space defined by the first member and the second member.
    Type: Application
    Filed: June 5, 2020
    Publication date: July 21, 2022
    Inventor: Kaori WATANABE
  • Publication number: 20210085433
    Abstract: A dental gypsum slurry includes water and a dental gypsum powder containing hemihydrate gypsum and a polycarboxylic acid salt-based water-reducing agent, wherein a powder-water ratio of the water to the dental gypsum powder is 0.24 to 0.50, and when the water and the dental gypsum powder being mixed are poured up to a height of 50 mm in a cylindrical mold having an inner diameter of 35 mm, which is vertically placed on a flat surface, and then, the cylindrical mold is pulled upward at 10 mm/s at 30 seconds after start of mixing so that a mixture spreads planarly, the diameter of the mixture is 141.4 mm or more.
    Type: Application
    Filed: January 30, 2018
    Publication date: March 25, 2021
    Applicant: GC Corporation
    Inventors: Daizaburo Mori, Masatoshi Yoshinaga, Kenji Kojima, Kaori Watanabe, Tsukasa Kaneko
  • Patent number: 10821221
    Abstract: An embodiment of the present invention is an encased syringe in which a prefilled syringe is accommodated in a case. The prefilled syringe includes a cylindrical syringe body filled with a foamable material and a plunger pressed into the syringe body on one end side. The case includes a body accommodating part faulted to be depressed along the shape of the syringe body to accommodate the syringe body and a plunger accommodating part formed to be depressed along the shape of the plunger to accommodate the plunger. The length of the plunger accommodating part is smaller than the length of the plunger in an axial direction of the prefilled syringe.
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: November 3, 2020
    Assignee: GC Corporation
    Inventors: Makoto Takahashi, Manami Kurakazu, Yuji Fujimaki, Kaori Watanabe
  • Publication number: 20200016322
    Abstract: An embodiment of the present invention is an encased syringe in which a prefilled syringe is accommodated in a case. The prefilled syringe includes a cylindrical syringe body filled with a foamable material and a plunger pressed into the syringe body on one end side. The case includes a body accommodating part faulted to be depressed along the shape of the syringe body to accommodate the syringe body and a plunger accommodating part formed to be depressed along the shape of the plunger to accommodate the plunger. The length of the plunger accommodating part is smaller than the length of the plunger in an axial direction of the prefilled syringe.
    Type: Application
    Filed: January 25, 2017
    Publication date: January 16, 2020
    Inventors: Makoto TAKAHASHI, Manami KURAKAZU, Yuji FUJIMAKI, Kaori WATANABE
  • Publication number: 20190142705
    Abstract: A method for kneading a dental gypsum powder is provided that includes putting the dental gypsum powder and water in a bottle, the dental gypsum powder containing gypsum hemihydrate and a polycarboxylate-based water reducing agent, contained at 0.05 parts by mass to 0.8 parts by mass with respect to 100 parts by mass of the gypsum hemihydrate, sealing the bottle, and shaking the bottle.
    Type: Application
    Filed: April 20, 2017
    Publication date: May 16, 2019
    Applicant: GC Corporation
    Inventors: Daizaburo MORI, Masatoshi YOSHINAGA, Kaori WATANABE
  • Patent number: 9138933
    Abstract: A process and apparatus for manufacturing a crystalline resin film or sheet. This manufacturing apparatus includes: an extruder that melts crystalline resin while supplying it; a gear pump that is provided on the downstream side of the extruder; a die which is provided on the downstream side of the gear pump, and which has a slit-shaped aperture; a cooling apparatus which cools film-shaped or sheet-shaped crystalline resin (A) discharged in a melted state from the die to a temperature which is not less than the crystallization temperature but not more than the melting point; and a pair of pinch rolls that press-roll between them the film-shaped or sheet-shaped crystalline resin (B) which has passed through the cooling apparatus (40), wherein the pair of guide rolls are positioned such that the thickness of the film-shaped or sheet-shaped crystalline resin (B) which has passed through the cooling apparatus is between 1.3 and 8.0 times the thickness of the film or sheet (C, D) after it has been press-rolled.
    Type: Grant
    Filed: January 22, 2010
    Date of Patent: September 22, 2015
    Assignee: SunAllomer Ltd.
    Inventors: Junichiro Washiyama, Hideharu Kimura, Koji Yamada, Takeshi Nakajima, Akihiro Otsubo, Masamichi Hikosaka, Kiyoka Okada, Kaori Watanabe
  • Patent number: 8735523
    Abstract: One embodiment of the present invention provides polymer crystalline materials containing crystals of the polymer and satisfying the following requirements (I) and (II) or the following requirements (I) and (III): (I) the polymer crystalline materials a crystallinity of 70% or greater; (II) the crystals are 300 nm or less in size; and (III) the crystals have a number density of 40 ?m?3 or greater. This allows an embodiment of the present invention to provide polymer crystalline materials which are excellent in properties such as mechanical strength, heat tolerance, and transparency or, in particular, polymer crystalline materials, based on a general-purpose plastic such as PP, which is excellent in properties such as mechanical strength, heat tolerance, and transparency.
    Type: Grant
    Filed: February 27, 2008
    Date of Patent: May 27, 2014
    Assignee: Hiroshima University
    Inventors: Masamichi Hikosaka, Kaori Watanabe, Kiyoka Okada
  • Patent number: 8728616
    Abstract: A polymer sheet according to at least one embodiment of the present invention is a polymer sheet whose main component is oriented nanocrystals of a polymer, and which satisfies the following conditions (I), (II), and (III): (I) having a crystallinity of not less than 70%; (II) having a tensile strength at break of not less than 100 MPa and a tensile modulus of not less than 3 GPa; and (III) having an average thickness of not less than 0.15 mm. According to at least one embodiment of the present invention, it is possible to provide a polymer sheet excelling in properties such as mechanical strength, heat tolerance, and transparency, particularly a polymer sheet having excellent properties such as mechanical strength, heat tolerance, and transparency in general-purpose plastics such as polypropylene.
    Type: Grant
    Filed: January 21, 2010
    Date of Patent: May 20, 2014
    Assignees: Hiroshima University, Sunallomer Ltd.
    Inventors: Masamichi Hikosaka, Kiyoka Okada, Kaori Watanabe, Junichiro Washiyama, Hideharu Kimura, Koji Yamada, Takeshi Nakajima, Akihiro Otsubo
  • Publication number: 20120018917
    Abstract: A process and apparatus for manufacturing a crystalline resin film or sheet. This manufacturing apparatus includes: an extruder that melts crystalline resin while supplying it; a gear pump that is provided on the downstream side of the extruder; a die which is provided on the downstream side of the gear pump, and which has a slit-shaped aperture; a cooling apparatus which cools film-shaped or sheet-shaped crystalline resin (A) discharged in a melted state from the die to a temperature which is not less than the crystallization temperature but not more than the melting point; and a pair of pinch rolls that press-roll between them the film-shaped or sheet-shaped crystalline resin (B) which has passed through the cooling apparatus (40), wherein the pair of guide rolls are positioned such that the thickness of the film-shaped or sheet-shaped crystalline resin (B) which has passed through the cooling apparatus is between 1.3 and 8.0 times the thickness of the film or sheet (C, D) after it has been press-rolled.
    Type: Application
    Filed: January 22, 2010
    Publication date: January 26, 2012
    Applicant: SunAllomer Ltd.
    Inventors: Junichiro Washiyama, Hideharu Kimura, Koji Yamada, Takeshi Nakajima, Akihiro Otsubo, Masamichi Hikosaka, Kiyoka Okada, Kaori Watanabe
  • Publication number: 20110300364
    Abstract: A polymer sheet according to at least one embodiment of the present invention is a polymer sheet whose main component is oriented nanocrystals of a polymer, and which satisfies the following conditions (I), (II), and (III): (I) having a crystallinity of not less than 70%; (II) having a tensile strength at break of not less than 100 MPa and a tensile modulus of not less than 3 GPa; and (III) having an average thickness of not less than 0.15 mm. According to at least one embodiment of the present invention, it is possible to provide a polymer sheet excelling in properties such as mechanical strength, heat tolerance, and transparency, particularly a polymer sheet having excellent properties such as mechanical strength, heat tolerance, and transparency in general-purpose plastics such as polypropylene.
    Type: Application
    Filed: January 21, 2010
    Publication date: December 8, 2011
    Applicants: SUNALLOMER LTD., HIROSHIMA UNIVERSITY
    Inventors: Masamichi Hikosaka, Kiyoka Okada, Kaori Watanabe, Junichiro Washiyama, Hideharu Kimura, Koji Yamada, Takeshi Nakajima, Akihiro Otsubo
  • Patent number: 7871548
    Abstract: A method and means for determining a critical elongation strain rate of a polymer melt, which make it possible to subject a polymer melt to elongation to prepare a bulk oriented melt, are established, and a process for producing bulk polymer oriented crystals and polymer oriented crystals are provided. In the critical elongation strain rate determination process or critical elongation strain rate determining method, a polymer melt (3) in a disc shape having a radius x0 and a thickness of ?z0 is held between transparent plates (an upper transparent plate (1) and a lower transparent plate (2)). The polymer melt (3) is cooled to a supercooled state and is press in a thickness direction at a constant rate v by using the transparent plates. The critical point radius x*, at which the polymer melt (3) is turned to an oriented crystal, is measured, and the critical elongation strain rate ? is calculated by equation ?*=ax*3 wherein ?=v/(2?z0x03).
    Type: Grant
    Filed: August 31, 2006
    Date of Patent: January 18, 2011
    Assignee: National University of Corporation Hiroshima University
    Inventors: Masamichi Hikosaka, Kaori Watanabe
  • Publication number: 20100063235
    Abstract: One embodiment of the present invention provides polymer crystalline materials containing crystals of the polymer and satisfying the following requirements (I) and (II) or the following requirements (I) and (III): (I) the polymer crystalline materials a crystallinity of 70% or greater; (II) the crystals are 300 nm or less in size; and (III) the crystals have a number density of 40 ?m?3 or greater. This allows an embodiment of the present invention to provide polymer crystalline materials which are excellent in properties such as mechanical strength, heat tolerance, and transparency or, in particular, polymer crystalline materials, based on a general-purpose plastic such as PP, which is excellent in properties such as mechanical strength, heat tolerance, and transparency.
    Type: Application
    Filed: February 27, 2008
    Publication date: March 11, 2010
    Inventors: Masamichi Hikosaka, Kaori Watanabe, Kiyoka Okada
  • Publication number: 20090249883
    Abstract: A method and means for determining a critical elongation strain rate of a polymer melt, which make it possible to subject a polymer melt to elongation to prepare a bulk oriented melt, are established, and a process for producing bulk polymer oriented crystals and polymer oriented crystals are provided. In the critical elongation strain rate determination process or critical elongation strain rate determining method, a polymer melt (3) in a disc shape having a radius x0 and a thickness of ?z0 is held between transparent plates (an upper transparent plate (1) and a lower transparent plate (2)). The polymer melt (3) is cooled to a supercooled state and is press in a thickness direction at a constant rate v by using the transparent plates.
    Type: Application
    Filed: August 31, 2006
    Publication date: October 8, 2009
    Applicant: NATIONAL UNIVERSITY OF CORP. HIROSHIMA UNIVERSITY
    Inventors: Masamichi Hikosaka, Kaori Watanabe
  • Patent number: 7566663
    Abstract: A method for manufacturing a semiconductor device or a semiconductor wafer using a chucking unit is provided to remove a slurry that adheres to the back surface of the semiconductor wafer. An edge portion of a semiconductor wafer is polished while a back surface of the semiconductor wafer is chucked to a chucking unit of a first polishing unit. The polished semiconductor wafer is then dechucked from the chucking unit of the first polishing unit. Next, a gap is formed above the chucking unit of the second polishing unit, and the semiconductor wafer is disposed therein. Water is discharged from the chucking unit of the second polishing unit to clean the back surface of the semiconductor wafer W. Thereafter, the back surface of the semiconductor wafer is chucked to the chucking unit of the second polishing unit, and the semiconductor wafer is polished.
    Type: Grant
    Filed: December 20, 2006
    Date of Patent: July 28, 2009
    Assignee: NEC Electronics Corporation
    Inventors: Kaori Watanabe, Hiroyuki Itoh, Takatoshi Hattori
  • Patent number: 7442652
    Abstract: A method for removing contamination on a semiconductor substrate is disclosed. The contamination contains at least one element belonging to one of 3A group, 3B group and 4A group of long-period form of periodic system of elements. The method comprises first and second process steps. The first process is wet processing the semiconductor substrate by first remover liquid that contains one of acid and alkali. The second process is wet processing the semiconductor substrate by second remover liquid that contains oxidizing reagent and one of hydrofluoric acid and salt of hydrofluoric acid.
    Type: Grant
    Filed: February 3, 2003
    Date of Patent: October 28, 2008
    Assignee: NEC Electronics Corporation
    Inventors: Hidemitsu Aoki, Kaori Watanabe
  • Patent number: 7351354
    Abstract: A removing solution for removing tungsten metal which causes a film formation on a semiconductor substrate or adheres to it, wherein orthoperiodic acid and water are contained.
    Type: Grant
    Filed: December 1, 2004
    Date of Patent: April 1, 2008
    Assignee: Kanto Kagaku Kabushiki Kaisha
    Inventors: Toshikazu Shimizu, Kaori Watanabe, Hidemitsu Aoki
  • Publication number: 20070139857
    Abstract: A method for manufacturing a semiconductor device or a semiconductor wafer is provided, in which a removal of slurry that is adherently remained on the back surface of the semiconductor wafer can be ensured without a need for employing an increased dimension of apparatus. An edge portion of a semiconductor wafer is polished while a back surface of the semiconductor wafer is chucked to a chucking unit of a first polishing unit, and then, the polished semiconductor wafer is dechucked from the chucking unit of the first polishing unit. Next, a predetermined gap is formed in a location above the chucking unit of the second polishing unit, and the semiconductor wafer is disposed therein. Water is discharged form the chucking unit of the second polishing unit to clean the back surface of the semiconductor wafer W. Thereafter, the back surface of the semiconductor wafer is chucked to the chucking unit of the second polishing unit, and then the semiconductor wafer is polished.
    Type: Application
    Filed: December 20, 2006
    Publication date: June 21, 2007
    Applicant: NEC ELECTRONICS CORPORATION
    Inventors: Kaori Watanabe, Hiroyuki Itoh, Takatoshi Hattori
  • Patent number: D873131
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: January 21, 2020
    Assignee: GC Corporation
    Inventor: Kaori Watanabe
  • Patent number: D967713
    Type: Grant
    Filed: November 14, 2019
    Date of Patent: October 25, 2022
    Assignee: GC Corporation
    Inventor: Kaori Watanabe