Abstract: A lighting system has light-emitting diodes as light sources mounted on a circuit board, in which the light-emitting diodes include a red light-emitting diode, blue light-emitting diode and a green light-emitting diode, the light-emitting diodes are constituted of one single unit including one for each of the red, blue and green light-emitting diodes, and the one single unit is repeatedly arranged as plural pieces on the same circuit board, and each of the red, blue and green light-emitting diodes is individually connected electrically to emit a light.

Abstract: A method and system for enhancing the sales potential of transactions conducted over the Internet or other networks though selectively offered promotions functionally related to an initial order.

Abstract: To provide a liquid crystal display device having excellent uniformity in the brightness so that the performance of displays of liquid crystal can be increased. A liquid crystal display device is provided with: a support member: a heat releasing member provided on this support member; a light guiding plate 121 provided on a rear surface of a liquid crystal panel; and a light source module 124 which is thermally secured to the heat releasing member so as to face an entrance surface 121a formed on one or two sides in the direction of the length of the light guiding plate 121 and has a light source for emitting a light beam toward the entrance surface 121a, wherein the light source is covered with a lens 124c in the light source module 124, and the distance D between the lens 124c and the entrance surface 121a when the light source module 124 is not driven is set within a certain range.

Abstract: When different paste solder materials are printed to circuit patterns on a substrate, a plurality of metal masks corresponding to kinds of solder materials are used so as to perform printing in a manner corresponding to each of the solder materials, so that the particular solder materials are supplied to particular components in the same flat surface. One of the metal mask is provided with a depression so that the mask does not contact the solder material which has already been printed, and the metal mask is further provided with another depression to reduce an amount of the solder material supplied.

Abstract: A lighting system has light-emitting diodes as light sources mounted on a circuit board, in which the light-emitting diodes include a red light-emitting diode, blue light-emitting diode and a green light-emitting diode, the light-emitting diodes are constituted of one single unit including one for each of the red, blue and green light-emitting diodes, and the one single unit is repeatedly arranged as plural pieces on the same circuit board, and each of the red, blue and green light-emitting diodes is individually connected electrically to emit a light.

Abstract: The present invention provides a method for removing solder adhering to an LSI. In this method, a plate-shaped first member for causing molten solder to adhere thereto is mounted on top of a heater. An LSI is placed on top of the first member with the surface on which solder is attached facing downward. A second member for adding a load to the LSI is placed on top of the LSI. The heater is heated up to heat the first member and the LSI, and to melt the solder. The molten solder is transferred to the first member. A suction mechanism is positioned at a location a predetermined distance away from the top surface of the second member. The second member and the LSI are attracted by the suction mechanism, and the LSI is pulled away from the first member. The solder is thereby removed from the LSI.

Abstract: A glass bottle inspecting apparatus is presented which can detect a defect at a specific location of a bottle-mouth portion of a glass bottle. An inspecting apparatus detects a defect of a glass bottle by imaging light from the glass bottle while the glass bottle (2) is illuminated and rotated, and processes the obtained image. A glass bottle inspecting apparatus includes a lighting device (7) disposed at a predetermined position with respect to the glass bottle, a plurality of CCD cameras (11-20) disposed around the glass bottle for imaging a specific part of the glass bottle, an angle detection device (10) for detecting a rotation angle of the glass bottle with respect to a reference position, and an image processor (8) for processing the images obtained by the CCD cameras. The image processor stores rotation angle information detected by the angle detection device in such a manner that the rotation angle information corresponds to the image imaged by each of the CCD cameras.

Abstract: The present invention relates to a method and apparatus for producing a reference image (template) used in a glass bottle inspecting apparatus for detecting a defect at a specific location of a bottle-mouth portion and the like of a glass bottle, and used for being compared with the image obtained from the glass bottle to be inspected in the inspecting apparatus. According to a method of producing a reference image of the present invention, plural images are formed by using a CCD camera to image a plurality of glass bottles as samples which may contain defective glass bottles, and a reference image is provided from the obtained plural images, a range of brightness when light is applied to a non-defective glass bottle being specified in said reference image.

Abstract: The present invention relates to a method and apparatus for producing a reference image (template) used in a glass bottle inspecting apparatus for detecting a defect at a specific location of a bottle-mouth portion and the like of a glass bottle, and used for being compared with the image obtained from the glass bottle to be inspected in the inspecting apparatus. According to a method of producing a reference image of the present invention, plural images are formed by using a CCD camera to image a plurality of glass bottles (2) as samples which may contain defective glass bottles, and a reference image is provided from the obtained plural images, a range of brightness when light is applied to a non-defective glass bottle being specified in said reference image.

Abstract: When different paste solder materials are printed to circuit patterns on a substrate, a plurality of metal masks corresponding to kinds of solder materials are used so as to perform printing in a manner corresponding to each of the solder materials, so that the particular solder materials are supplied to particular components in the same flat surface. One of the metal mask is provided with a depression so that the mask does not contact the solder material which has already been printed, and the metal mask is further provided with another depression to reduce an amount of the solder material supplied.

Abstract: A glass bottle inspecting apparatus is presented which can detect a defect at a specific location of a bottle-mouth portion of a glass bottle. An inspecting apparatus detects a defect of a glass bottle by imaging light from the glass bottle while the glass bottle (2) is illuminated and rotated, and processes the obtained image. A glass bottle inspecting apparatus includes a lighting device (7) disposed at a predetermined position with respect to the glass bottle, a plurality of CCD cameras (11-20) disposed around the glass bottle for imaging a specific part of the glass bottle, an angle detection device (10) for detecting a rotation angle of the glass bottle with respect to a reference position, and an image processor (8) for processing the images obtained by the CCD cameras. The image processor stores rotation angle information detected by the angle detection device in such a manner that the rotation angle information corresponds to the image imaged by each of the CCD cameras.

Abstract: The present invention provides a method for removing solder adhering to an LSI. In this method, a plate-shaped first member for causing molten solder to adhere thereto is mounted on top of a heater. An LSI is placed on top of the first member with the surface on which solder is attached facing downward. A second member for adding a load to the LSI is placed on top of the LSI. The heater is heated up to heat the first member and the LSI, and to melt the solder. The molten solder is transferred to the first member. A suction mechanism is positioned at a location a predetermined distance away from the top surface of the second member. The second member and the LSI are attracted by the suction mechanism, and the LSI is pulled away from the first member. The solder is thereby removed from the LSI.

Abstract: A laser printing apparatus is formed by a laser oscillator 10, galvano mirrors 42, 44 for scanning the laser light emitted from the laser oscillator 10, and an f&thgr; lens 40 for focusing the laser light emitted from the laser oscillator 10 on MCCs 32, 34 serving as the member to be printed. The laser oscillator 10 is an YLF laser oscillator which emits the laser light of the third harmonics in the ultraviolet range. The laser printing is performed on the MCCs 32, 34 serving as the member to be printed by using the laser light emitted from the laser oscillator 10.

Abstract: The present invention provides a method for removing solder adhering to an LSI. In this method, a plate-shaped first member for causing molten solder to adhere thereto is mounted on top of a heater. An LSI is placed on top of the first member with the surface on which solder is attached facing downward. A second member for adding a load to the LSI is placed on top of the LSI. The heater is heated up to heat the first member and the LSI, and to melt the solder. The molten solder is transferred to the first member. A suction mechanism is positioned at a location a predetermined distance away from the top surface of the second member. The second member and the LSI are attracted by the suction mechanism, and the LSI is pulled away from the first member. The solder is thereby removed from the LSI.

Abstract: A sulfated saccharide represented by the following formula [I] or a sulfated polysaccharide where the said sulfated saccharide is an essential component of the constituting sugar as well as a salt thereof.

Abstract: Apoptosis inducers, anticancer drugs and carcinostatic drugs containing sulfated-fucose-containing polysaccharide(s) and/or degradation product(s) thereof, and a method for inducing apoptosis by using sulfated-fucose-containing polysaccharide(s) and/or degradation product(s) thereof as the active ingredient. A degrading enzyme which is useful in the production of the degradation products of sulfated-fucose-containing polysaccharides.

Abstract: Sulfated fucogalactan or its salt useful as a reagent for sugar chain engineering or an HGF-production inducer; a degraded product or its salt obtained by treating the sulfated fucogalactan with a sulfated fucogalactan digesting enzyme; the sulfated fucogalactan digesting enzyme useful in sugar chain engineering; a process for producing the degraded product by treating sulfated fucogalactan or its salt with the above enzyme; and a process for producing the sulfated fucogalactan digesting enzyme.

Abstract: The present invention provides a method for removing solder adhering to an LSI. In this method, a plate-shaped first member for causing molten solder to adhere thereto is mounted on top of a heater. An LSI is placed on top of the first member with the surface on which solder is attached facing downward. A second member for adding a load to the LSI is placed on top of the LSI. The heater is heated up to heat the first member and the LSI, and to melt the solder. The molten solder is transferred to the first member. A suction mechanism is positioned at a location a predetermined distance away from the top surface of the second member. The second member and the LSI are attracted by the suction mechanism, and the LSI is pulled away from the first member. The solder is thereby removed from the LSI.

Abstract: A module is placed inside a chamber that can be sealed hermetically. The module includes a substrate incorporating a plurality of electronic circuit parts, a frame connected to the substrate so as to enclose the plurality of electronic circuit parts, and a cover placed facing the substrate and connected to the frame so as to cover an opening portion of the frame. The pressure in the chamber is reduced to a first pressure P1, and then the pressure is increased from the first pressure P1 to a second pressure P2. A liquid is filled into the module through a hole formed in the cover within the chamber, and the pressure inside the chamber is increased from the second pressure P2 to a third pressure P3. Then, the hole of the cover in the chamber is closed to seal the module hermetically, thereby sealing the liquid in the module. Thereafter, the pressure in the chamber is increased from the third pressure P3 to an atmospheric pressure P0, and the module is taken out of the chamber.

Abstract: A solder-removing apparatus includes a heating portion for heating the object having the solder adhered thereto, a measuring portion for measuring the distance from the measuring portion to the object, a solder-drawing portion for drawing the molten solder on the object by suction, an X-Y moving portion for moving the object in an X-direction or a Y-direction, a Z moving portion for moving the object relative to the solder-drawing portion in a Z-direction, and a control portion for controlling the X-Y moving portion and the Z moving portion. During the time when the molten solder on the object is drawn by the solder-drawing portion, the control portion causes the X-Y moving portion to move the object, and also causes the Z moving portion to move the object relative to the solder-drawing portion in accordance with the distance, measured by the measuring portion, so that the distance between the solder-drawing portion and the object can be kept constant.