Patents by Inventor Kaoru Katayama
Kaoru Katayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6435401Abstract: A solder-removing apparatus includes a heating portion for heating the object having the solder adhered thereto, a measuring portion for measuring the distance from the measuring portion to the object, a solder-drawing portion for drawing the molten solder on the object by suction, an X-Y moving portion for moving the object in an X-direction or a Y-direction, a Z moving portion for moving the object relative to the solder-drawing portion in a Z-direction, and a control portion for controlling the X-Y moving portion and the Z moving portion. During the time when the molten solder on the object is drawn by the solder-drawing portion, the control portion causes the X-Y moving portion to move the object, and also causes the Z moving portion to move the object relative to the solder-drawing portion in accordance with the distance, measured by the measuring portion, so that the distance between the solder-drawing portion and the object can be kept constant.Type: GrantFiled: July 18, 2000Date of Patent: August 20, 2002Assignee: Hitachi, Ltd.Inventors: Takeshi Miitsu, Kaoru Katayama, Yasuhiro Yamamoto
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Patent number: 6433810Abstract: A laser printing apparatus is formed by a laser oscillator 10, galvano mirrors 42, 44 for scanning the laser light emitted from the laser oscillator 10, and an f&thgr; lens 40 for focusing the laser light emitted from the laser oscillator 10 on MCCs 32, 34 serving as the member to be printed. The laser oscillator 10 is an YLF laser oscillator which emits the laser light of the third harmonics in the ultraviolet range. The laser printing is performed on the MCCs 32, 34 serving as the member to be printed by using the laser light emitted from the laser oscillator 10.Type: GrantFiled: March 9, 2000Date of Patent: August 13, 2002Assignee: Hitachi, Ltd.Inventors: Kaoru Katayama, Kenichi Inoue, Mitsugu Shirai, Tsutomu Sakamoto
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Patent number: 6423405Abstract: There is disclosed a surface reformation method of a high polymer material such that by irradiating and excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface, wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be soldered with preferable durability by a fluxess reflow soldering.Type: GrantFiled: August 27, 1999Date of Patent: July 23, 2002Assignee: Hitachi, Ltd.Inventors: Tsutomu Shibuya, Kaoru Katayama, Mitugu Shirai, Shinichi Kazui, Hideaki Sasaki, Yasuhiro Iwata
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Publication number: 20020093562Abstract: A laser printing apparatus is formed by a laser oscillator 10, galvano mirrors 42, 44 for scanning the laser light emitted from the laser oscillator 10, and an f&thgr; lens 40 for focusing the laser light emitted from the laser oscillator 10 on MCCs 32, 34 serving as the member to be printed. The laser oscillator 10 is an YLF laser oscillator which emits the laser light of the third harmonics in the ultraviolet range. The laser printing is performed on the MCCs 32, 34 serving as the member to be printed by using the laser light emitted from the laser oscillator 10.Type: ApplicationFiled: March 13, 2002Publication date: July 18, 2002Applicant: Hitachi, Ltd.Inventors: Kaoru Katayama, Kenichi Inoue, Mitsugu Shirai, Tsutomu Sakamoto
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Patent number: 6410881Abstract: The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.Type: GrantFiled: June 18, 2001Date of Patent: June 25, 2002Assignee: Hitachi, Ltd.Inventors: Kaoru Katayama, Hiroshi Fukuda, Shinichi Kazui, Toshihiko Ohta, Yasuhiro Iwata, Mitsugu Shirai, Mitsunori Tamura
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Publication number: 20020048664Abstract: There is disclosed a surface reformation method of a high polymer material such that by irradiating and excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface, wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be soldered with preferable durability by a fluxess reflow soldering.Type: ApplicationFiled: August 27, 1999Publication date: April 25, 2002Inventors: TSUTOMU SHIBUYA, KAORU KATAYAMA, MITUGU SHIRAI, SHINICHI KAZUI, HIDEAKI SASAKI, YASUHIRO IWATA
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Patent number: 6325270Abstract: A solder removing apparatus comprises a stage and a head portion. A top face of the stage is a flat surface, and the stage can arbitrarily move in a direction parallel to the top face. On the stage are arranged a first member supplying portion on which one or more first members are located, a second member supplying portion on which one or more second members are located, and a heating portion for heating a member located thereon at an arbitrary temperature. The head comprises a first head and a second head. The first head and the second head can move along the same moving axis in a direction vertical to the top face of the stage independently from each other. The first head adsorbs the first member located on the first member supplying portion and locates the first member on the heating portion. The second head adsorbs the second member located on the second member supplying portion and locates the second member on the first member located on the heating portion.Type: GrantFiled: June 22, 2000Date of Patent: December 4, 2001Assignee: Hitachi, Ltd.Inventors: Takeshi Kuroda, Kaoru Katayama, Takeshi Takahashi, Naoki Watanabe
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Publication number: 20010039725Abstract: This invention provides a process for manufacturing electronic circuits, according to which soldering can be carried out without using flux by applying a metal surface treatment procedure which allows oxide film, organic matters, carbon or the like on the surface of metal to be easily removed without using complex process nor unfavorably affecting electronic devices or circuit substrates.Type: ApplicationFiled: June 18, 2001Publication date: November 15, 2001Applicant: Hitachi, Ltd.Inventors: Kaoru Katayama, Hiroshi Fukuda, Shinichi Kazui, Toshihiko Ohta, Yasuhiro Iwata, Mitsugu Shirai, Mitsunori Tamura
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Publication number: 20010034335Abstract: Apoptosis inducers, anticancer drugs and carcinostatic drugs containing sulfated-fucose-containing polysaccharide(s) and/or degradation product(s) thereof, and a method for inducing apoptosis by using sulfated-fucose-containing polysaccharide(s) and/or degradation product(s) thereof as the active ingredient. A degrading enzyme which is useful in the production of the degradation products of sulfated-fucose-containing polysaccharides.Type: ApplicationFiled: January 29, 2001Publication date: October 25, 2001Inventors: Takeshi Sakai, Hideo Kitano, Fu-Gong Yu, Shinji Nakayama, Kaoru Kojima, Hitomi Kimura, Yoshikuni Nakanishi, Kaoru Katayama, Takanari Tominaga, Kazuo Shimanaka, Katsushige Ikai, Ikunoshin Kato
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Patent number: 6281575Abstract: A multi-chip module is provided with a structure for disposing of a large amount of surplus solder at soldered portions. In this multi-chip module, a cooling member (structure) is soldered directly at the back side of heat generating member such as a semiconductor integrated circuit element. In order to dispose of the surplus solder, the present invention has a first metallized part formed at a cooling member which is larger than a second metallized part formed at the back side of semiconductor integrated circuit element which is solder with the first metallized part.Type: GrantFiled: July 7, 1999Date of Patent: August 28, 2001Assignee: Hitachi, LTDInventors: Toru Nishikawa, Masahide Harada, Kaoru Katayama, Takeshi Miitsu, Takayuki Uda, Takahiro Daikoku
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Patent number: 6269998Abstract: The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.Type: GrantFiled: November 3, 2000Date of Patent: August 7, 2001Assignee: Hitachi, Ltd.Inventors: Kaoru Katayama, Hiroshi Fukuda, Shinichi Kazui, Toshihiko Ohta, Yasuhiro Iwata, Mitsugu Shirai, Mitsunori Tamura
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Patent number: 6207652Abstract: Apoptosis inducers, anticancer drugs and carcinostatic drugs containing sulfated-fucose-containing polysaccharide(s) and/or degradation product(s) thereof, and a method for inducing apoptosis by using sulfated-fucose-containing polysaccharide(s) and/or degradation product(s) thereof as the active ingredient. A degrading enzyme which is useful in the production of the degradation products of sulfated-fucose-containing polysaccharides.Type: GrantFiled: April 9, 1998Date of Patent: March 27, 2001Assignees: Takara Shuzo Co., Ltd., Research Institute for GlycotechnologyInventors: Takeshi Sakai, Hideo Kitano, Fu-Gong Yu, Shinji Nakayama, Kaoru Kojima, Hitomi Kimura, Yoshikuni Nakanishi, Kaoru Katayama, Takanari Tominaga, Kazuo Shimanaka, Katsushige Ikai, Ikunoshin Kato
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Patent number: 6161748Abstract: The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.Type: GrantFiled: March 30, 2000Date of Patent: December 19, 2000Assignee: Hitachi, Ltd.Inventors: Kaoru Katayama, Hiroshi Fukuda, Shinichi Kazui, Toshihiko Ohta, Yasuhiro Iwata, Mitsugu Shirai, Mitsunori Tamura
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Patent number: 6133135Abstract: The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.Type: GrantFiled: June 1, 1999Date of Patent: October 17, 2000Assignee: Hitachi, Ltd.Inventors: Kaoru Katayama, Hiroshi Fukuda, Shinichi Kazui, Toshihiko Ohta, Yasuhiro Iwata, Mitsugu Shirai, Mitsunori Tamura
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Patent number: 6017424Abstract: A surface reformation method of a high polymer material irradiates an excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface. The wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be durably soldered by fluxless reflow soldering.Type: GrantFiled: February 23, 1998Date of Patent: January 25, 2000Assignee: Hitachi, Ltd.Inventors: Tsutomu Shibuya, Kaoru Katayama, Mitugu Shirai, Shinichi Kazui, Hideaki Sasaki, Yasuhiro Iwata
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Patent number: 5940728Abstract: A process for manufacturing electronic circuits, according to which soldering can be carried out without using flux by applying a metal surface treatment procedure which allows oxide film, organic matters, carbon or the like on the surface of metal to be easily removed without using a complex process nor unfavorably affecting electronic devices or circuit substrates. A process of connecting an electronic device and a circuit substrate by means of solder comprises the steps of irradiating the solder with a laser beam to clean the solder, aligning and mounting the electronic device on the circuit substrate, and hot-melting said solder in a low-oxygen content atmosphere to bond the electronic device and the circuit substrate.Type: GrantFiled: May 15, 1996Date of Patent: August 17, 1999Assignee: Hitachi, Ltd.Inventors: Kaoru Katayama, Hiroshi Fukuda, Shinichi Kazui, Toshihiko Ohta, Yasuhiro Iwata, Mitsugu Shirai, Mitsunori Tamura
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Patent number: 5832595Abstract: A method of modifying an electronic circuit board by performing disconnection or connection of conductive lines at a specified or an arbitrary position of the conductive lines of the electronic circuit board thereby changing an electric circuit and of completely modifying an open pattern defect of the conductive lines or an insulator layer, and its device, wherein a first energy beam is irradiated to portions of repair terminals 9 and 9' which are intended to connect or disconnect, of conductive lines 5 and 5' in the electronic circuit board thereby removing a protection layer, making windows and exposing the terminals 9 and 9' for connection; a second energy beam is irradiated thereby disconnecting the repair terminals 9 and 9', or a metal piece for connecting is supplied to between the repair terminals 9 and 9' and applying an energy thereto thereby electrically connecting them; and the disconnected or connected windowed portion is locally coated with the insulator layer thereby modifying the conductive linType: GrantFiled: June 14, 1994Date of Patent: November 10, 1998Assignee: Hitachi, Ltd.Inventors: Shigenobu Maruyama, Mikio Hongo, Haruhisa Sakamoto, Tateoki Miyauchi, Ryohei Satoh, Kiyoshi Matsui, Shinichi Kazui, Kaoru Katayama, Hiroshi Fukuda
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Patent number: 5801350Abstract: A surface reformation method of a high polymer material irradiates an excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface. The wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be durably soldered by fluxless reflow soldering.Type: GrantFiled: March 21, 1996Date of Patent: September 1, 1998Assignee: Hitachi, Ltd.Inventors: Tsutomu Shibuya, Kaoru Katayama, Mitugu Shirai, Shinichi Kazui, Hideaki Sasaki, Yasuhiro Iwata
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Patent number: 5499668Abstract: Oxide films, and residues of organic matters, carbons, if any, are removed from a metal surface simply without using complicated steps and without giving adverse effects on electronic parts or electronic devices by irradiating the metal surface with a laser beam of lower energy level than energy capable of changing the metal surface structure, thereby cleaning the metal surface.Type: GrantFiled: October 27, 1994Date of Patent: March 19, 1996Assignee: Hitachi, Ltd.Inventors: Kaoru Katayama, Shinichi Kazui, Yasuhiro Iwata, Hiroshi Fukuda, Toshihiko Ohta
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Patent number: 5262614Abstract: A circuit board is manufactured by a method having the steps of depositing a metal pattern on a ceramic board, depositing a thin layer of a high polymer material on the ceramic board formed with the metal pattern, depositing a protective layer of a high polymer material on the thin layer of the high polymer material, and directing a laser beam toward and onto the protective layer and the thin layer deposited on a plating region of the metal pattern and a cutting region of the ceramic board thereby selectively removing part of those layers. The laser beam has a wavelength range of from 150 nm to 400 nm, an energy density range of from 0.5 J/cm.sup.2 to 5.0 J/cm.sup.2, and a pulse width range of from 100 ps to 1 .mu.s.Type: GrantFiled: May 31, 1991Date of Patent: November 16, 1993Assignee: Hitachi, Ltd.Inventors: Kaoru Katayama, Hidetaka Shigi