Abstract: A method of manufacturing a semiconductor device includes forming a wiring layer in a first insulating layer, forming a second insulating layer over the first insulating layer, forming a first conductive layer over the second insulating layer, forming a dielectric layer on the first conductive layer, forming a second conductive layer on the dielectric layer, selectively removing the second conductive layer to form an upper electrode on the dielectric layer, forming a first layer over the upper electrode and the dielectric layer, selectively removing the first layer, the dielectric layer, and the first conductive layer to form a lower electrode over which the dielectric layer and the first layer is entirely left, the upper electrode remaining partially over the lower electrode.

Abstract: A method of manufacturing a semiconductor device has forming a capacitor having electrodes and a ferroelectric film provided therebetween above a substrate, forming a pad electrode electrically connected to one of the electrodes of the capacitor above the substrate, forming a protective film covering the pad electrode over the substrate, forming an opening in the protective film exposing at least a part of the pad electrode, bringing a measurement terminal into contact with the exposed surface of the pad electrode, etching the surface of the pad electrode after the measurement terminal is brought into contact therewith, and forming a hydrogen absorbing film on the protective film and the pad electrode exposed through the opening.

Abstract: An insulation film (24) having a gradual inclination of a surface is formed by a high density plasma CVD method, an atmospheric pressure CVD method or the like, after a ferroelectric capacitor (23) is formed. Thereafter, an alumina film (25) is formed on the insulation film (24). According to the method, low coverage of the alumina film (25) does not become a problem, and the ferroelectric capacitor (23) is reliably protected.

Abstract: A semiconductor device is provided having a pad with an improved moisture blocking ability. The semiconductor device has: a circuit portion including a plurality of semiconductor elements formed on a semiconductor substrate; lamination of insulator covering the circuit portion, including a passivation film as an uppermost layer having openings; ferro-electric capacitors formed in the lamination of insulator; wiring structure formed in the lamination of insulator and connected to the semiconductor elements and the ferro-electric capacitors; pad electrodes connected to the wiring structure, formed in the lamination of insulator and exposed in the openings of the passivation film; a conductive pad protection film, including a Pd film, covering each pad electrode via the opening of the passivation film, and extending on the passivation film; and stud bump or bonding wire connected to the pad electrode via the conductive pad protection film.

Abstract: A semiconductor device including a capacitor formed over a semiconductor substrate and including a lower electrode, a dielectric film formed over the lower electrode and an upper electrode formed over the dielectric film, an insulation film formed over the semiconductor substrate and the capacitor, and an electrode pad formed over the insulation film and including an alloy film of aluminum and magnesium.

Abstract: A protective film (56) having a water/hydrogen blocking function is formed so as to cover the periphery of a pad electrode (54a) while being electrically isolated from the pad electrode. A material selected in the embodiment for composing the protective film is a highly moisture-proof material having a water/hydrogen blocking function considerably superior to that of the insulating material, such as palladium (Pd) or palladium-containing material, and iridium (Ir) or iridium oxide (IrOx: typically x=2) or an iridium- or iridium oxide-containing material. An FeRAM capable of reliably preventing water/hydrogen from entering inside, and of maintaining high performance of the ferroelectric capacitor structure (30) may be realized only by a simple configuration.

Abstract: A semiconductor device includes a semiconductor substrate, a circuit part formed on and above the semiconductor substrate, a passivation film covering the circuit part, an electrode pad provided outside the circuit part in such a manner that the electrode pad is exposed from the passivation film, and a guard ring pattern provided between the electrode pad and the circuit part such that the guard ring pattern surrounds the circuit part substantially. The guard ring pattern extends from a surface of the semiconductor substrate to the passivation film.

Abstract: The present invention relates to a semiconductor device having capacitors. The configuration of the device includes: capacitor upper electrodes 14a, 14b formed via a dielectric film 13 on plate lines 12a that become capacitor lower electrodes; a conductive connecting sections 12b that are connected to one ends of the plate lines 12a and have contact regions; upper conductive patterns 14c that are formed between the contact regions and the edge of plate lines 12a on the dielectric film 13 on the conductive connecting sections 12b and are in the same layer as the capacitor upper electrodes 14a, 14b.

Abstract: An ultra-thin semiconductor chip of an FeRAM, which is miniaturized and highly integrated with characteristic degradation of a ferroelectric capacitor suppressed though a thin package structure is applied to the FeRAM is realized. The semiconductor chip is molded up by using a sealing resin with a filler content set at a value in a range of 90 weight % to 93 weight % to produce a package structure.

Abstract: After a ferroelectric capacitor is formed, an Al wiring (conductive pad) connected to the ferroelectric capacitor is formed. Then, a silicon oxide film and a silicon nitride film are formed around the Al wiring. Thereafter, as a penetration inhibiting film which inhibits penetration of moisture into the silicon oxide film, an Al2O3 film is formed.

Abstract: An insulation film (24) having a gradual inclination of a surface is formed by a high density plasma CVD method, an atmospheric pressure CVD method or the like, after a ferroelectric capacitor (23) is formed. Thereafter, an alumina film (25) is formed on the insulation film (24). According to the method, low coverage of the alumina film (25) does not become a problem, and the ferroelectric capacitor (23) is reliably protected.

Abstract: A semiconductor device formed by forming contact holes in the insulating film, that covers the source/drain of the MOSFET and the capacitor in the memory cell region, on the lower electrode of the capacitor by the same steps, then filling the plugs into contact holes, and then forming the contact hole on the upper electrode of the capacitor. Accordingly, there can be provided the semiconductor device having the ferroelectric capacitor, capable of simplifying respective wiring connection structures to the upper electrode and the lower electrode of the capacitor by suppressing the damage to the capacitor formed over the transistor.

Abstract: A semiconductor device includes a semiconductor substrate, a circuit part formed on and above the semiconductor substrate, a passivation film covering the circuit part, an electrode pad provided outside the circuit part in such a manner that the electrode pad is exposed from the passivation film, and a guard ring pattern provided between the electrode pad and the circuit part such that the guard ring pattern surrounds the circuit part substantially. The guard ring pattern extends from a surface of the semiconductor substrate to the passivation film.

Abstract: The present invention relates to a semiconductor device having capacitors. The configuration of the device includes: capacitor upper electrodes 14a, 14b formed via a dielectric film 13 on plate lines 12a that become capacitor lower electrodes; a conductive connecting sections 12b that are connected to one ends of the plate lines 12a and have contact regions; upper conductive patterns 14c that are formed between the contact regions and the edge of plate lines 12a on the dielectric film 13 on the conductive connecting sections 12b and are in the same layer as the capacitor upper electrodes 14a, 14b.

Abstract: The semiconductor device having the capacitor comprises a plurality of switching elements formed on a semiconductor substrate 1 at a distance, a plurality of capacitors formed in areas between a plurality of switching elements formed in the first direction respectively and each having a lower electrode, a dielectric film and an upper electrode, first wirings for connecting the upper electrodes of the capacitors and the switching elements in the first direction on a one-by-one base, and second wirings formed over a part of the first wirings, the switching elements, and the capacitors to extend in the second direction that intersects with the first direction. Accordingly, the higher speed operation than the prior art can be achieved.

Abstract: There is provided such a structure that a first insulating layer, a conductive pattern, a second insulating layer, a capacitor Q, a third insulating layer, and a lower electrode leading wiring are formed sequentially on a semiconductor substrate, and a lower electrode of the capacitor is connected to an upper surface of the conductive pattern, and the lower electrode leading wiring is also connected electrically to the conductive pattern from its upper side.

Abstract: There is provided such a structure that a first insulating layer, a conductive pattern, a second insulating layer, a capacitor Q, a third insulating layer, and a lower electrode leading wiring are formed sequentially on a semiconductor substrate, and a lower electrode of the capacitor is connected to an upper surface of the conductive pattern, and the lower electrode leading wiring is also connected electrically to the conductive pattern from its upper side.

Abstract: There is provided a semiconductor device which comprises capacitors having lower electrodes, which are formed of platinum on a first insulating film over a semiconductor substrate to have a contact region, and upper electrodes formed on the lower electrodes via a dielectric film respectively, a second insulating film formed on the capacitors, a hole formed in the second insulating film on the contact region of the lower electrode, and a wiring constructed by forming an underlying conductive film, a minimum thickness of which is thicker than 30 nm at a bottom of the hole, and an aluminum film sequentially, and formed from an inside of the hole to an upper surface of the second insulating film.

Abstract: There are provided the steps of forming contact holes in the insulating film, that covers the source/drain of the MOSFET and the capacitor in the memory cell region, on the lower electrode of the capacitor by the same steps, then filling the plugs into the contact holes, and then forming the contact hole on the upper electrode of the capacitor. Accordingly, there can be provided the semiconductor device having the ferroelectric capacitor, capable of simplifying respective wiring connection structures to the upper electrode and the lower electrode of the capacitor by suppressing the damage to the capacitor formed over the transistor.

Abstract: A semiconductor device formed by forming contact holes in the insulating film, that covers the source/drain of the MOSFET and the capacitor in the memory cell region, on the lower electrode of the capacitor by the same steps, then filling the plugs into the contact holes, and then forming the contact hole on the upper electrode of the capacitor. Accordingly, there can be provided the semiconductor device having the ferroelectric capacitor, capable of simplifying respective wiring connection structures to the upper electrode and the lower electrode of the capacitor by suppressing the damage to the capacitor formed over the transistor.