Patents by Inventor Kaoru Sudo

Kaoru Sudo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145926
    Abstract: A dielectric block includes a bottom surface that includes a conductive ground member including an antenna ground surface inclined with respect to the bottom surface. A feed element is disposed at a distance from the antenna ground surface, and constitutes a patch antenna together with the antenna ground surface. A feed line is connected to a feed point of the feed element, and a dielectric member that supports the feed element with respect to the ground member. The ground member is exposed to the bottom surface, on both a lower side and a higher side of a contour line passing through an intersection point of a perpendicular line from the feed point to a virtual plane including the bottom surface and a plane including the antenna ground surface, using the bottom surface as a height reference.
    Type: Application
    Filed: January 11, 2024
    Publication date: May 2, 2024
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Hideki UEDA, Kaoru SUDO, Natsumi MINAMITANI, Jun ADACHI, Shu HAMADA
  • Patent number: 11955737
    Abstract: An antenna module includes: a radiating element and a filter device including a plurality of resonators. The plurality of resonators include a first resonator and a second resonator, the second resonator being disposed at a final stage. The first resonator and the second resonator are each electrically coupled to the radiating element. A degree of a coupling of the resonator and the radiating element is weaker than a degree of a coupling of the resonator and the radiating element.
    Type: Grant
    Filed: May 11, 2022
    Date of Patent: April 9, 2024
    Assignees: NATIONAL UNIVERSITY CORPORATION SAITAMA UNIVERSITY, MURATA MANUFACTURING CO., LTD.
    Inventors: Masataka Ohira, Kaoru Sudo, Yoshinori Taguchi
  • Patent number: 11936125
    Abstract: An antenna module includes a ground electrode, a fed element, unfed elements, and feed lines. The unfed element is formed in a planar shape and disposed facing the ground electrode. The fed element is formed in a planar shape and disposed between the unfed element and the ground electrode. The unfed element is formed in a planar shape and disposed between the fed element and the ground electrode. The feed lines extend through the unfed element and are used to transfer radio-frequency signals to the fed element.
    Type: Grant
    Filed: October 22, 2021
    Date of Patent: March 19, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Kaoru Sudo
  • Publication number: 20240055754
    Abstract: An antenna element includes an insulative substrate including first and second main surfaces arranged in an up-down direction. At least one antenna conductor layer is provided on the first main surface of the insulative substrate. At least one insulative substrate non-forming region is provided between the insulative substrate and the antenna conductor layer in the up-down direction. An insulator layer does not exist in the at least one insulative substrate non-forming region. When seen in the up-down direction, all of an outer boundary of at least one antenna conductor overlaps the at least one insulative substrate non-forming region and is not in contact with the insulative substrate. At least one of the at least one insulative substrate non-forming region includes a void.
    Type: Application
    Filed: October 23, 2023
    Publication date: February 15, 2024
    Inventors: Nobuo IKEMOTO, Kosuke NISHIO, Kaoru SUDO, Keiichi ICHIKAWA, Nobuyuki TENNO
  • Publication number: 20240047865
    Abstract: An antenna element includes a first opening including an annular outer boundary in an antenna conductor layer. A first insulative substrate non-forming region is provided between an insulative substrate and the antenna conductor layer in an up-down direction. The insulative substrate does not exist in the first insulative substrate non-forming region. The outer boundary of the first opening overlaps one or more first insulative substrate non-forming regions and is not in contact with the insulative substrate. The first insulative substrate non-forming region is a first void, and a low dielectric constant material having a lower dielectric constant than that of a material of the insulative substrate or a high dielectric constant material having a higher dielectric constant than that of the material of the insulative substrate is provided in the first insulative substrate non-forming region.
    Type: Application
    Filed: October 19, 2023
    Publication date: February 8, 2024
    Inventors: Nobuo IKEMOTO, Kosuke NISHIO, Kaoru SUDO, Keiichi ICHIKAWA, Nobuyuki TENNO
  • Publication number: 20240030614
    Abstract: In a first region of a ground electrode, a width of a protrusion of the ground electrode in a first direction, in which a notch portion is formed, from a slot is different from a width of the ground electrode in a second direction opposite to the first direction from the slot.
    Type: Application
    Filed: October 5, 2023
    Publication date: January 25, 2024
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Hayato NAKAMURA, Kaoru SUDO, Kengo ONAKA
  • Patent number: 11881640
    Abstract: An antenna element includes a dielectric substrate, a first ground electrode, a second ground electrode, a via conductor, and a radiation electrode. The dielectric substrate includes a first portion shaped like a flat plate and a second portion thinner than the first portion. The first ground electrode is arranged in the first portion. The second ground electrode is arranged in the second portion. The via conductor couples the first ground electrode and the second ground electrode. A distance between the radiation electrode and the first ground electrode in a first thickness direction is more than a distance between the radiation electrode and the second ground electrode in a second thickness direction. Part of the radiation electrode lies opposite to the first ground electrode without lying opposite to the second ground electrode.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: January 23, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kaoru Sudo, Hirotsugu Mori, Kengo Onaka
  • Publication number: 20240022005
    Abstract: An antenna module includes a mounting board with a flat plate shape, and a power supply circuit to supply a radio frequency signal. The power supply circuit is mounted on the mounting board, and a radiating electrode is arranged on the power supply circuit. A dielectric fills a region around the power supply circuit and the radiating electrode. A conductive layer covers at least part of the dielectric. In the dielectric, a lens part is formed at a position overlapping the radiating electrode in plan view of the mounting board. The dielectric includes a first region in which the lens part is formed and a second region other than the first region, and the conductive layer is formed in the second region.
    Type: Application
    Filed: August 22, 2023
    Publication date: January 18, 2024
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Kaoru SUDO
  • Patent number: 11870164
    Abstract: An antenna module includes a dielectric substrate having a multilayer structure, a ground electrode disposed in the dielectric substrate, a plate-like fed element facing the ground electrode and disposed at a layer different from a layer including the ground electrode, a feed line for transferring a radio-frequency signal to a feed point of the fed element, and a stub. The stub branches off from the feed line at a branch point of the feed line and has an open end. The stub is disposed between the fed element and the ground electrode. When the dielectric substrate is viewed in plan view, the open end coincides with the fed element.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: January 9, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Keisei Takayama, Kaoru Sudo
  • Publication number: 20230411862
    Abstract: An antenna module including a mount substrate that has a flat-plate shape having a surface and a surface, an RFIC that is disposed on the surface side and supplies a radio-frequency signal, and a radiating electrode, in which the mount substrate is provided with a cavity at a position overlapping with the radiating electrode assuming the mount substrate is viewed in plan view, and a periphery of the radiating electrode including an inside of the cavity is filled with a mold resin. The mold resin is provided with a lens at a position overlapping with the radiating electrode assuming the mount substrate is viewed in plan view and on the surface side.
    Type: Application
    Filed: September 5, 2023
    Publication date: December 21, 2023
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Hayato NAKAMURA, Kaoru SUDO
  • Publication number: 20230411870
    Abstract: An antenna module includes a dielectric substrate, radiating circuits disposed on the dielectric substrate, a ground electrode, and a dielectric layer. In a plan view in a direction of a normal line of the dielectric substrate, the radiating circuit is disposed adjacent to the radiating circuit. The ground electrode is disposed to face the radiating circuit and the radiating circuit. The dielectric layer is disposed to cover the radiating circuit. The radiating circuit is capable of emitting an electric wave in a frequency band higher than that for the radiating circuit. A dielectric constant of the dielectric layer is higher than a dielectric constant of the dielectric substrate. A distance between the radiating circuit and the ground electrode is shorter than a distance between the radiating circuit and the ground electrode.
    Type: Application
    Filed: September 5, 2023
    Publication date: December 21, 2023
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Kaoru SUDO, Kengo ONAKA, Natsumi MINAMITANI, Yoshiki YAMADA
  • Patent number: 11777221
    Abstract: A plurality of multi-band antenna elements operable at a plurality of frequencies constitutes an array antenna. An antenna drive unit selects at least some of the multi-band antenna elements from the plurality of multi-band antenna elements in accordance with one operation frequency selected from the plurality of operation frequencies, and causes the selected multi-band antenna elements to operate.
    Type: Grant
    Filed: October 21, 2020
    Date of Patent: October 3, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hideki Ueda, Kaoru Sudo, Kengo Onaka, Hirotsugu Mori, Takaki Murata
  • Publication number: 20230223691
    Abstract: An antenna device includes a ground electrode, a feed element, and a parasitic element. The ground electrode has a substantially non-square rectangular plane shape that includes a first side extending in a first direction and a second side extending in a second direction orthogonal to the first direction. The feed element has a substantially rectangular plane shape and is formed in such a way that each side of the feed element becomes parallel to the first direction or the second direction. The parasitic element is formed in such a manner as to face a side of the feed element parallel to the first side. The feed element is configured to radiate a first polarized wave that excites in the first direction and a second polarized wave that excites in the second direction. The length of the first side is longer than the length of the second side.
    Type: Application
    Filed: March 16, 2023
    Publication date: July 13, 2023
    Inventors: Kaoru SUDO, Kengo ONAKA
  • Publication number: 20230187837
    Abstract: An antenna module includes a dielectric layer in a form of a flat plate, a ground electrode, a radiating element, and a wiring cable. The ground electrode is arranged on a lower surface of the dielectric layer. The radiating element is arranged on an upper surface of the dielectric layer as being opposed to the ground electrode. The wiring cable faces a side surface of the dielectric layer, and includes a ground electrode and a power feeder line that conveys a radio frequency signal to the radiating element. The wiring cable is smaller in thickness than the dielectric layer. The power feeder line and the ground electrode are electrically connected to the radiating element and the ground electrode, respectively. The ground electrode is arranged at a position different from a position of the ground electrode in a direction of thickness of the dielectric layer.
    Type: Application
    Filed: February 9, 2023
    Publication date: June 15, 2023
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Shun SAKAIDA, Kaoru SUDO, Kengo ONAKA
  • Publication number: 20230188223
    Abstract: A communication apparatus includes: an antenna module provided with an antenna element having a flat plate shape; a housing that accommodates the antenna module; a heat dissipation plate; and an electrode. The heat dissipation plate is disposed between the housing and the antenna module, and provided with an opening that faces the antenna element. The electrode faces the antenna element in a direction normal to the antenna element and on a side of the first radiating element that radiates the radio wave.
    Type: Application
    Filed: February 14, 2023
    Publication date: June 15, 2023
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Kaoru SUDO, Kengo ONAKA
  • Publication number: 20230145095
    Abstract: The antenna module includes a first substrate and a second substrate on each of which a radiating element is arranged, a third substrate, and a switch circuit. An RFIC for supplying a radio frequency signal to the first substrate and the second substrate is arranged on the third substrate. The switch circuit is configured to change over a connection between the RFIC and the radiating element on the first substrate and a connection between the RFIC and the radiating element on the second substrate.
    Type: Application
    Filed: December 29, 2022
    Publication date: May 11, 2023
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Kengo ONAKA, Hirotsugu MORI, Yoshiki YAMADA, Kaoru SUDO, Hiroshi IZUMITANI, Hideki UEDA
  • Publication number: 20230139670
    Abstract: An antenna module includes feed elements each having a flat plate shape and a ground electrode arranged opposite the feed elements. The feed element radiates a radio wave of a first frequency band. The feed element radiates a radio wave of a second frequency band that is higher than the first frequency band. In a plan view of the feed element, the distance from the center of the feed element to an end portion of the ground electrode in a first direction is shorter than or equal to ½ of a free space wavelength of a radio wave radiated from the feed element. A feed point of the feed element is arranged at a location shifted in a second direction from the center of the feed element, and the second direction is different from the first direction.
    Type: Application
    Filed: December 29, 2022
    Publication date: May 4, 2023
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Kaoru SUDO, Kengo ONAKA, Yoshiki YAMADA
  • Publication number: 20230140655
    Abstract: An antenna module includes a first substrate, a second substrate, a connection member connected between the first substrate and the second substrate, and an FEM disposed on the connection member. A radiating element is disposed on the first substrate. An RFIC for supplying a radio frequency signal to the radiating element is disposed on the second substrate. The connection member transmits radio frequency signals between the RFIC and the radiating element. The FEM amplifies radio frequency signals transmitted between the RFIC and the radiating element. The FEM is disposed at a position between a connecting point with the first substrate and a connecting point with the second substrate on the connection member.
    Type: Application
    Filed: December 29, 2022
    Publication date: May 4, 2023
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Kengo ONAKA, Hirotsugu MORI, Yoshiki YAMADA, Kaoru SUDO, Hiroshi IZUMITANI
  • Patent number: 11631936
    Abstract: An antenna device includes a ground electrode, a feed element, and a parasitic element. The ground electrode has a substantially non-square rectangular plane shape that includes a first side extending in a first direction and a second side extending in a second direction orthogonal to the first direction. The feed element has a substantially rectangular plane shape and is formed in such a way that each side of the feed element becomes parallel to the first direction or the second direction. The parasitic element is formed in such a manner as to face a side of the feed element parallel to the first side. The feed element is configured to radiate a first polarized wave that excites in the first direction and a second polarized wave that excites in the second direction. The length of the first side is longer than the length of the second side.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: April 18, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kaoru Sudo, Kengo Onaka
  • Patent number: 11588243
    Abstract: An antenna module includes a dielectric substrate, a ground electrode, a power feeding element (121) and a power feeding element (122) each facing the ground electrode, and power feeding wirings (141) and (142). The power feeding wiring (141) transmits a radio frequency signal to a power feeding point (SP1) of the power feeding element (121). The power feeding wiring (142) transmits a radio frequency signal to a power feeding point (SP2) of the power feeding element (122). A frequency of a radio wave from the power feeding element (122) is higher than a frequency of a radio wave from the power feeding element (121). The power feeding wiring (142) includes a via rises from the ground electrode side to the power feeding element (122) at a position different from the power feeding point (SP2) and a wiring pattern that connects the via and the power feeding point (SP2).
    Type: Grant
    Filed: November 10, 2020
    Date of Patent: February 21, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kaoru Sudo, Hirotsugu Mori