Patents by Inventor Kaoru Sudo

Kaoru Sudo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190123441
    Abstract: A multi-antenna module includes, on or in the dielectric substrate, a first radiation element, a second radiation element that operates at a frequency band lower than that of the first radiation element, and a ground plane. A first feed line and a second feed line are provided on or in the dielectric substrate. A first switch element switches between a first state in which a signal is supplied to the second radiation element and a second state including at least one of a state in which the second radiation element is connected to the ground plane with terminal impedance interposed therebetween, a state in which the second radiation element is in a floating state with respect to the second feed line and the ground plane, and a state in which the second radiation element is short-circuited to the ground plane.
    Type: Application
    Filed: July 18, 2018
    Publication date: April 25, 2019
    Inventors: Kaoru SUDO, Yasuhisa YAMAMOTO, Satoshi TANAKA
  • Publication number: 20190123438
    Abstract: A ground layer is disposed within a dielectric substrate. An antenna pattern that operates as an antenna is disposed so as to be closer to a first surface of the dielectric substrate than the ground layer is. A high-frequency device that supplies a high-frequency signal to the antenna pattern is mounted in or on a second surface of the dielectric substrate, which is opposite to the first surface. A plurality of signal conductor columns and a plurality of ground conductor columns that are made of a conductive material project from the second surface. Each of the signal conductor columns is connected to the high-frequency device by a wiring pattern, which is provided in or on the dielectric substrate, and the ground conductor columns are connected to the ground layer.
    Type: Application
    Filed: December 21, 2018
    Publication date: April 25, 2019
    Inventors: Ryuken MIZUNUMA, Kaoru SUDO
  • Publication number: 20190089071
    Abstract: First and second end-fire antennas are arranged on a dielectric substrate. The first end-fire antenna has polarization characteristics being parallel with a first direction. The second end-fire antenna has polarization characteristics being parallel with a second direction orthogonal to the first direction. A patch antenna provided with a first feed point and a second feed point, which are different from each other, is arranged on the dielectric substrate. When the patch antenna is fed from the first feed point, a radio wave whose polarization direction is parallel with the first direction is excited. When the patch antenna is fed from the second feed point, a radio wave whose polarization direction is orthogonal to the first direction is excited. A wireless communication module capable of achieving directivity in a wide range from a direction parallel with the substrate to the direction of the normal to the substrate is provided.
    Type: Application
    Filed: October 16, 2018
    Publication date: March 21, 2019
    Inventors: Kaoru Sudo, Hideki Ueda
  • Patent number: 10193222
    Abstract: A ground layer is disposed within a dielectric substrate. An antenna pattern that operates as an antenna is disposed so as to be closer to a first surface of the dielectric substrate than the ground layer is. A high-frequency device that supplies a high-frequency signal to the antenna pattern is mounted in or on a second surface of the dielectric substrate, which is opposite to the first surface. A plurality of signal conductor columns and a plurality of ground conductor columns that are made of a conductive material project from the second surface. Each of the signal conductor columns is connected to the high-frequency device by a wiring pattern, which is provided in or on the dielectric substrate, and the ground conductor columns are connected to the ground layer.
    Type: Grant
    Filed: April 19, 2017
    Date of Patent: January 29, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Ryuken Mizunuma, Kaoru Sudo
  • Patent number: 10153557
    Abstract: A first dipole antenna is included in a first layer of a dielectric substrate, a second dipole antenna which excites polarized waves in a direction orthogonal to a direction of polarized waves excited by the first dipole antenna is included in a second layer. Power is supplied from a first power supply line to the first dipole antenna and from a second power supply line to the second dipole antenna. The operating frequencies of the first dipole antenna and the second dipole antenna are the same as each other. A distance from an intermediate point between two power supply points of the first dipole antenna to an intermediate point between two power supply points of the second dipole antenna is no greater than an effective wavelength of the operating frequency. At least one of the first power supply line and the second power supply line has a triplate structure.
    Type: Grant
    Filed: April 19, 2017
    Date of Patent: December 11, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Kaoru Sudo
  • Patent number: 10135155
    Abstract: First and second end-fire antennas are arranged on a dielectric substrate. The first end-fire antenna has polarization characteristics being parallel with a first direction. The second end-fire antenna has polarization characteristics being parallel with a second direction orthogonal to the first direction. A patch antenna provided with a first feed point and a second feed point, which are different from each other, is arranged on the dielectric substrate. When the patch antenna is fed from the first feed point, a radio wave whose polarization direction is parallel with the first direction is excited. When the patch antenna is fed from the second feed point, a radio wave whose polarization direction is orthogonal to the first direction is excited. A wireless communication module capable of achieving directivity in a wide range from a direction parallel with the substrate to the direction of the normal to the substrate is provided.
    Type: Grant
    Filed: April 19, 2017
    Date of Patent: November 20, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kaoru Sudo, Hideki Ueda
  • Publication number: 20180309210
    Abstract: Provided is an array antenna in which a plurality of sub-arrays, which each include a plurality of radiating elements, are two-dimensionally arranged in a first direction and a second direction, which are perpendicular to each other. A plurality of power feeding lines individually feed power from a high-frequency input/output device to each of the plurality of sub-arrays. The plurality of sub-arrays are arranged along straight lines in the first direction, and are arranged in the second direction such that among two sub-arrays that are adjacent to each other in the second direction, one sub-array is shifted in the first direction with respect to the other sub-array.
    Type: Application
    Filed: April 23, 2018
    Publication date: October 25, 2018
    Inventor: Kaoru SUDO
  • Publication number: 20180219281
    Abstract: An antenna module includes a dielectric substrate and a feed element provided on the dielectric substrate. A radome formed from a dielectric is disposed so as to oppose the antenna module in a radiation direction of the feed element. A parasitic element is provided at a position on the radome at which the electromagnetic coupling with the feed element is achieved. The antenna module is bonded to the radome by an adhesive layer disposed between the antenna module and the radome.
    Type: Application
    Filed: February 1, 2018
    Publication date: August 2, 2018
    Inventors: Kaoru SUDO, Ryuken MIZUNUMA
  • Patent number: 9865928
    Abstract: In a multilayer substrate (2), an internal ground layer (11) is provided at a position between insulating layers (4) and (5) and a radiating element (13) is provided at a position between insulating layers (3) and (4). A first coplanar line (7) is connected to an intermediate position of the radiating element (13) in an X-axis direction, and a second coplanar line (9) is connected to an intermediate position of the radiating element (13) in a Y-axis direction. A passive element (16) is laminated on the upper surface of the radiating element (13) through the insulating layer (3). The passive element (16) is formed in a cross shape in which a first patch (16A) extending in the X-axis direction and a second patch (16B) extending in the Y-axis direction are orthogonal to each other.
    Type: Grant
    Filed: March 19, 2015
    Date of Patent: January 9, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kaoru Sudo, Masayuki Nakajima
  • Publication number: 20170222333
    Abstract: First and second end-fire antennas are arranged on a dielectric substrate. The first end-fire antenna has polarization characteristics being parallel with a first direction. The second end-fire antenna has polarization characteristics being parallel with a second direction orthogonal to the first direction. A patch antenna provided with a first feed point and a second feed point, which are different from each other, is arranged on the dielectric substrate. When the patch antenna is fed from the first feed point, a radio wave whose polarization direction is parallel with the first direction is excited. When the patch antenna is fed from the second feed point, a radio wave whose polarization direction is orthogonal to the first direction is excited. A wireless communication module capable of achieving directivity in a wide range from a direction parallel with the substrate to the direction of the normal to the substrate is provided.
    Type: Application
    Filed: April 19, 2017
    Publication date: August 3, 2017
    Inventors: Kaoru Sudo, Hideki Ueda
  • Publication number: 20170222316
    Abstract: A ground layer is disposed within a dielectric substrate. An antenna pattern that operates as an antenna is disposed so as to be closer to a first surface of the dielectric substrate than the ground layer is. A high-frequency device that supplies a high-frequency signal to the antenna pattern is mounted in or on a second surface of the dielectric substrate, which is opposite to the first surface. A plurality of signal conductor columns and a plurality of ground conductor columns that are made of a conductive material project from the second surface. Each of the signal conductor columns is connected to the high-frequency device by a wiring pattern, which is provided in or on the dielectric substrate, and the ground conductor columns are connected to the ground layer.
    Type: Application
    Filed: April 19, 2017
    Publication date: August 3, 2017
    Inventors: Ryuken Mizunuma, Kaoru Sudo
  • Publication number: 20170222325
    Abstract: A first dipole antenna is included in a first layer of a dielectric substrate, a second dipole antenna which excites polarized waves in a direction orthogonal to a direction of polarized waves excited by the first dipole antenna is included in a second layer. Power is supplied from a first power supply line to the first dipole antenna and from a second power supply line to the second dipole antenna. The operating frequencies of the first dipole antenna and the second dipole antenna are the same as each other. A distance from an intermediate point between two power supply points of the first dipole antenna to an intermediate point between two power supply points of the second dipole antenna is no greater than an effective wavelength of the operating frequency. At least one of the first power supply line and the second power supply line has a triplate structure.
    Type: Application
    Filed: April 19, 2017
    Publication date: August 3, 2017
    Inventor: Kaoru SUDO
  • Publication number: 20170222312
    Abstract: As such, in the disclosure, a slit is formed in a side plate. The slit has an opening in the upper end surface of the side plate. The opening has a width which is smaller than a thickness of the side plate and enables to correspond to a thickness t of the substrate and a length which enables to correspond to a length a of one side of the substrate. An RF antenna module is housed in the slit formed in the side plate of the housing to be accommodated in the housing by inserting the one side of the substrate through the opening of the slit, which is formed in the upper end surface of the side plate, and inserting the substrate into the slit by an amount equal to or larger than a length of another side of the substrate.
    Type: Application
    Filed: April 11, 2017
    Publication date: August 3, 2017
    Inventors: Kaoru SUDO, Ryuken MIZUNUMA, Masayuki NAKAJIMA, Masanori TSUJI
  • Patent number: 9698487
    Abstract: In a multilayer substrate, eight front-side antenna portions and eight back-side antenna portions are disposed. Front-side radiation elements in the front-side antenna portions and back-side radiation elements in the back-side antenna portions are arranged in a staggered pattern when being vertically projected onto an back side of the multilayer substrate. The front-side radiation elements are disposed on a front side of the multilayer substrate, and a front-side ground layer is formed near the back side of the multilayer substrate. On the other hand, the back-side radiation elements are disposed on the back side of the multilayer substrate, and a back-side ground layer is formed near the front side of the multilayer substrate. The front-side radiation element and the back-side radiation element are disposed so as not to overlap each other when being vertically projected onto the back side of the multilayer substrate.
    Type: Grant
    Filed: April 30, 2015
    Date of Patent: July 4, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kaoru Sudo, Masayuki Nakajima
  • Patent number: 9660340
    Abstract: Two high frequency antennas are provided in a multilayer substrate. Each high frequency antenna is configured of a radiation element, a high frequency power supply line, and a high frequency power supply unit. A low frequency antenna is configured of a series radiation element, a low frequency power supply line, and a lower frequency power supply unit. The series radiation element is formed of two radiation elements connected by a radiation element connection line. One end side of the series radiation element is connected to the low frequency power supply unit via the low frequency power supply line. Open stubs to block transmission of a high frequency signal (SH) are connected to the radiation element connection line and the low frequency power supply line. Short stubs to block transmission of a low frequency signal (SL) are connected to the high frequency power supply lines.
    Type: Grant
    Filed: June 10, 2015
    Date of Patent: May 23, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Michiharu Yokoyama, Kaoru Sudo, Ryuken Mizunuma, Masayuki Nakajima
  • Patent number: 9190732
    Abstract: A chip antenna is mounted on a mother substrate including a feed line. In a representative embodiment, the chip antenna includes a laminated body including plural insulating layers, a radiating conductor element, a parasitic conductor element, a coupling adjusting conductor plate, and a LGA. The radiating conductor element is connected to the feed line via a first flat electrode pad of the LGA. On the other hand, the coupling adjusting conductor plate is provided between the radiating conductor element and the parasitic conductor element, and both end sides of the coupling adjusting conductor plate are connected to second and third flat electrode pads of the LGA. Another representative embodiment does not include a coupling adjusting conductor plate in the laminated body and includes an LGA that may or may not include second and third flat electrode pads.
    Type: Grant
    Filed: March 23, 2012
    Date of Patent: November 17, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hirotaka Fujii, Eiichi Kobayashi, Kaoru Sudo, Toshiro Hiratsuka
  • Publication number: 20150311589
    Abstract: Two high frequency antennas are provided in a multilayer substrate. Each high frequency antenna is configured of a radiation element, a high frequency power supply line, and a high frequency power supply unit. A low frequency antenna is configured of a series radiation element, a low frequency power supply line, and a lower frequency power supply unit. The series radiation element is formed of two radiation elements connected by a radiation element connection line. One end side of the series radiation element is connected to the low frequency power supply unit via the low frequency power supply line. Open stubs to block transmission of a high frequency signal (SH) are connected to the radiation element connection line and the low frequency power supply line. Short stubs to block transmission of a low frequency signal (SL) are connected to the high frequency power supply lines.
    Type: Application
    Filed: June 10, 2015
    Publication date: October 29, 2015
    Inventors: Michiharu Yokoyama, Kaoru Sudo, Ryuken Mizunuma, Masayuki Nakajima
  • Patent number: 9172142
    Abstract: This disclosure provides a horizontal radiation antenna. The antenna includes a back-surface-side grounded conductor plate on a back surface of a substrate, a radiation element to which a coplanar line is connected on the front surface of the substrate, and a passive element closer to an end portion side of the substrate than the radiation element. A front-surface-side grounded conductor plate is provided at a substantially same height as the radiation element with respect to a thickness direction of the substrate, and a conductive wall surface capable of reflecting a high-frequency signal radiated from the radiation element is provided between the front-surface-side grounded conductor plate and the back-surface-side grounded conductor plate.
    Type: Grant
    Filed: March 8, 2012
    Date of Patent: October 27, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kaoru Sudo, Hirotaka Fujii, Eiichi Kobayashi, Toshiro Hiratsuka
  • Patent number: D757693
    Type: Grant
    Filed: March 24, 2014
    Date of Patent: May 31, 2016
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kaoru Sudo, Michiharu Yokoyama, Hideki Ueda, Ryuken Mizunuma, Masayuki Nakajima
  • Patent number: D830348
    Type: Grant
    Filed: February 25, 2016
    Date of Patent: October 9, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kaoru Sudo, Michiharu Yokoyama, Hideki Ueda, Ryuken Mizunuma, Masayuki Nakajima